半绝缘碳化硅单晶衬底的研究进展

碳化硅(SiC)被认为是最重要的宽禁带半导体材料之一,具有禁带宽度大、击穿电场高、热导率高、电子饱和速率高、抗辐射能力强等优越性质.基于SiC材料制备的半导体器件不仅能在更高的温度下稳定运行,而且在高电压、高频率状态下也具有更高的可靠性.近20年来,随着材料生长技术、制造工艺与器件物理的迅速发展,SiC材料及器件在雷达...     

高可靠性无铝有源层808 nm半导体激光器泵浦源

针对高功率808 nm激光器泵浦源的应用需求,设计并制备了InGaAsP/GaInP材料体系的无铝有源区半导体激光器.使用双非对称的限制层及波导层结构,降低了P侧材料的热阻及光吸收.优化了金属有机化学气相沉积(MOCVD)中As和P混合材料的生长条件,制备出界面陡峭的四元InGaAsP单晶外延薄膜.制作的激光器室温测试...     

退火时间对6H-SiC(0001)表面外延石墨烯形貌和结构的影响

在分子束外延(MBE)设备中,采用高温退火的方法在6H-SiC(0001)表面外延石墨烯,并研究了退火时间对外延石墨烯形貌和结构的影响.利用反射式高能电子衍射(RHEED)、原子力显微镜(AFM)、激光拉曼光谱(Raman)和近边X射线吸收精细结构(NEXAFS)等实验技术对制备的样品进行了表征.RHEED结果发现,不同退火时间的样品在SiC衍射条纹的外侧都出现了石墨烯的衍射条纹.AFM测试表明,外延石墨烯的厚度随退火时间增加而增大,且样品孔洞减少、表面更加平整.Raman测试表明,外延石墨烯拉曼谱中2D峰和G峰的位置相对高定向热解石墨(HOPG)中2D峰和G峰的位置蓝移,且退火时间增加,峰的蓝移量减小.对样品中碳原子K边NEXAFS谱测量显示,样品中存在sp2杂化的碳原子,退火时间增加使碳原子的1s→π以及1s→σ吸收的强度增大,且1s电子到π态的吸收峰相对HOPG的向高能偏移.     

砷化镓光导开关的损伤形貌研究北大核心CSCD

制作了同面型砷化镓光导开关,并测试了其导通性能。在偏置电压8 kV、激光能量10 mJ、重复频率10 Hz的条件下,研究了光导开关触发104次后器件表面的损伤形貌。利用激光扫描共聚焦显微镜,对电极边缘及电极间的损伤形貌进行分析,研究发现阳极边缘由于热积累形成热损伤,而阴极边缘的热损伤来源于热应力,并对电极间损伤形貌进行细致表征及分类。     

荧光法测定半导体禁带宽度

光学带隙或禁带宽度是半导体材料的一个重要特征参数.本文以3个具有代表性的InGaN/GaN多量子阱结构作为研究对象,深入探讨了荧光法测定某个目标温度下InGaN阱层的光学带隙所需要满足的测试条件.由于InGaN阱层是一种多元合金且受到来自GaN垒层的应力作用,所以该阱层中不仅存在着杂质/缺陷相关的非辐射中心,也存在着组分起伏诱发的局域势起伏以及极化场诱发的量子限制斯塔克效应.因此,为了获得目标温度下InGaN阱层的较为精确的光学带隙,提出了荧光测量至少应满足的测试条件,即必须消除该目标温度下非辐射中心、局域中心以及量子限制斯塔克效应对辐射过程的影响.     

Epitaxial Growth of Graphene on 6H-SiC （0001） by Thermal Annealing

An epitaxial graphene （EG） layer is successfully grown on a Si-terminated 6H-SiC （（9001） substrate by the method of thermal annealing in an ultrahigh vacuum molecular beam epitaxy chamber. The structure and morphology of the EG sample are characterized by reflection high energy diffraction （RHEED）, Raman spectroscopy and atomic force microscopy （AFM）. Graphene diffraction streaks can are clearly observed in the Raman spectrum. The AFM about 4-10 layers. be seen in RHEED. The G and 2D peaks of graphene results show that the graphene nominal thickness is     

A novel route to synthesize diphenylene by the catalytic effect of GaP nanocrystals

Diphenylene was synthesized directly from benzene under the catalytic effect of GaP nanocrystals, and the effect of GaP nanocrystals content was studied. The experimental results showed that no reactions took place without GaP nanocrystals. The more the GaP nanocrystals added, the more the reaction complete. Furthermore, at high temperatures (450-480℃), when the content of GaP nanocrystals was high enough, almost all benzene polymerized and the yield of diphenylene was rather high. On the contrast, even if there are enough GaP nanocrystals in the reaction mixture, almost no polymerization reaction took place at low temperature (for example, 250-300℃), and the yield of diphenylene was very poor. The analytical results of XRD, IR, elemental analysis and NMR proved that the sample was truly diphenylene.     

InP-to-InGaAs interfacial strain grown by using tertiarybutylarsine and tertiarybutylphosphine

Lattice-matched InGaAs/lnP heterostructures have been grown by using metalorganic vapor phase epitaxy (MOVPE) with tertiarybutylarsine (TBAs), tertiarybutylphosphine (TBP) as the group V sources. The results of X-ray diffraction on InGaAs/lnP single herterostructure show that there is a compressive-strained interfacial layer at the InP-to-InGaAs interface. X-ray diffraction of InGaAs/ InP superlattices is successfully simulated by using the same interfacial layer. TBAs purging of InP surface has a significant influence on the interfacial strain. A novel gas switching sequence, which switches group III to the run line earlier than TBAs, is proposed to reduce this interfacial strain. As a result, the average compressive strain of superlattices decreases, and a blue shift of photoluminescence ( PL) peak energy and narrowing in PL width are obtained.     

多层介质中的离子射程分布

本文提出了一种计算多层介质中注入离子深度分布的新方法。该方法把Monte Carlo模拟与输运方程的数值解法相结合,取其各自的优点,考虑了离子在界面处的反射,给出多层介质中射程分布表达式。理论与实验比较表明,两者符合得很好。 关键词：     

6H-SiC的飞秒激光超衍射加工

利用飞秒激光直写微纳加工平台, 对6H-SiC材料进行了突破衍射极限的微纳结构加工研究. 使用中心波长和脉宽分别为800 nm和130 fs的钛蓝宝石激光器和荧光倒置显微镜搭建了飞秒激光直写微纳加工平台, 研究了在不同的实验条件下对6H-SiC的光学加工情况, 采用扫描电子显微镜对加工结构进行表征. 通过分析不同的激光功率和不同的曝光时间等实验条件下加工的分辨率, 发现分辨率随着激光功率的减小而提高, 随扫描速度的增大而提高, 且能突破光学衍射极限. 最终获得125 nm的加工线宽, 并加工了加工线宽240 nm, 周期1.0 μm的线阵列. 研究结果为微机电系统(MEMS)的微器件设计开创了新的思路, 对发展MEMS器件具有重要意义. 关键词： 飞秒激光直写 超衍射加工 6H-SiC 微机电系统