TDI CMOS图像传感器曝光时间优化方法研究

为了提高时间延迟积分互补金属氧化物半导体(TDI CMOS)图像传感器的成像质量,研究了TDI CMOS图像传感器中曝光时间的选取对成像质量的影响。基于行滚筒曝光读出原理,分别分析了曝光时间对信噪比(SNR)和调制传递函数(MTF)的影响机理,根据分析结果,提出在级数已选定的情况下,曝光时间的选取存在最优值,此时得到的图像质量较好。为验证结论,基于自主研发的TDI CMOS图像传感器芯片及现场可编程门阵列(FPGA)开发板,搭建了TDI CMOS图像传感器成像测试系统。实验中采用MTF×SNR作为评价图像质量的指标,实验结果表明,在选定的相机参数下,积分级数为8级,光强为20 lx时,TDI CMOS图像传感器曝光时间选取64 ms时所得到的图像质量最好,此时MTF×SNR最大。     

三代像增强器透射式GaAs阴极光电发射稳定性研究

为了解决三代像增强器管内阴极灵敏度下降问题,用质谱计对激活工艺过程进行质量检测,并确定了激活工艺参数,通过对阴极原子级洁净表面获得和激活铯、氧提纯工艺参数优化研究,对制备的透射式GaAs阴极光电发射稳定性进行在线试验,结果表明:在10-9 Pa真空环境中,优化工艺激活的光电阴灵敏度(1 500 A/lm)稳定,而且500 h不下降,铟封到管内的阴极灵敏度下降与真空度降低和有害气体污染有关。     

Modeling random telegraph signal noise in CMOS image sensor under low light based on binomial distribution

The random telegraph signal noise in the pixel source follower MOSFET is the principle component of the noise in the CMOS image sensor under low light. In this paper, the physical and statistical model of the random telegraph signal noise in the pixel source follower based on the binomial distribution is set up. The number of electrons captured or released by the oxide traps in the unit time is described as the random variables which obey the binomial distribution. As a result,the output states and the corresponding probabilities of the first and the second samples of the correlated double sampling circuit are acquired. The standard deviation of the output states after the correlated double sampling circuit can be obtained accordingly. In the simulation section, one hundred thousand samples of the source follower MOSFET have been simulated,and the simulation results show that the proposed model has the similar statistical characteristics with the existing models under the effect of the channel length and the density of the oxide trap. Moreover, the noise histogram of the proposed model has been evaluated at different environmental temperatures.     

三代微光像增强器制管工艺对阴极光电发射性能的影响

主要论述制管工艺对光电阴极发射性能的影响。通过分析仪器和光学检测方法对管子阴极制备的台内及台外工艺质量进行了在线追踪和监测．结果表明，影响台外工艺质量的主要因素是外延材料缺陷多、发射层表面氧化、杂质污染、掺杂浓度不均匀、掺杂浓度陡度变化小及GaAs与玻璃粘接产生的应力大；影响台内工艺质量的主要因素为阴极激活真空度低于8×10^-8Pa．真空残气H2O．CO．CO2及C分压大于10^-8Pa．阴极激活铯和氧源提纯不彻底。利用透反射光照法激活台内对组件表面测线．发现发射层表面针孔、裂纹和发雾是造成阴极发射性能低的关键因素。     

微光像增强器的最新发展动向

综述了近年来微光像增强器发展的现状和动向。目前微光器件主要向第四代近贴聚焦像增强器发展，其技术突破一是采用无膜MCP；二是光电阴极采用自动门控电源和红外热像与微光夜视光学融合技术。夜视仪向小巧、轻便和价廉的单兵头盔及单甲双目手持微光眼镜和微光轻武器瞄准仪发展。最后指出微光器件寿命是实现实用化的关键。