Ti--Al based ohmic contacts to n-type 6H-SiC with P+ ion implantation

The Ti--Al ohmic contact to n-type 6H-SiC has been fabricated. An array of TLM (transfer length method) test patterns with Au/Ti/Al/Ti/SiC structure is formed on N-wells created by P⁺ ion implantation into Si-faced p-type 6H-SiC epilayer. The specific contact resistance \rho _c as low as 8.64×10^-6\Omega\cdot cm² is achieved after annealing in N₂ at 900℃ for 5\,min. The sheet resistance R_sh of the implanted layers is 975\Omega/\sqcap\!\!\!\!\sqcup. X-ray diffraction (XRD) analysis shows the formation of Ti_-3SiC₂ at the metal/n-SiC interface after thermal annealing, which is responsible for the low resistance contact.     

Study of （Ga,Mn）N prepared by Mn-ion implantation using optical techniques

This paper reports that （Ga, Mn）N is prepared using implantation of 3at.% Mn Ions into undoped GaN. Structural characterization of the crystals was performed using x-ray diffraetion（XRD）. Detailed XRD measurements have revealed the characteristic of Mn-ion implanted GaN with a small contribution of other compounds. With Raman spectroscopy measurements, the spectra corresponding to the intrinsic GaN layers demonstrate three Raman active excitations at 747, 733 and 566 cm-1 identified as EI（LO）, A1 （LO） and E~, respectively. The Mn-doped GaN layers exhibit additional excitations at 182, 288, 650 725, 363, 506cm^-1 and the vicinity of E~ mode. The modes observed at 182, 288, 650 725em 1 are assigned to macroscopic disorder or vacancy-related defects caused by Mn-ion implantation. Other new phonon modes are assigned to Mnx-Ny, Gax-Mny modes and the local vibrational mode of Mn atoms in the （Ga, Mn）N, which are in fair agreement with the standard theoretical results.     

质子和1MeV中子在硅中能量沉积的模拟计算

在现有中子截面数据和粒子与物质相互作用的理论基础上,编写了计算中子非电离能量损失(NIEL)和电离能量损失(IEL)程序,利用该程序和引进的TRIM95程序计算了1MeV中子和质子在硅中IEL和NIEL的大小和分布等,并对计算结果进行了分析和比较.     

功率AlGaAs/GaAs HBT自加热频率特性

提出了一种功率AlGaAs/GaAs HBT的自加热温度模型,讨论了在大电流条件下,器件晶格温度升高和基区扩展效应对HBT器件频率特性的影响,并对器件的晶格温度、截止频率和最高振荡频率在自加热条件下的变化分别进行了计算和模拟.     

4H-SiC晶体中Vsi本征缺陷研究

采用平面波展开和第一原理赝势法对4H-SiC理想晶体及与Vsi有关的电中性微观本征缺陷(Vsi、Vc-Vsi 、Vc-C、Vsi-Si)的超晶胞进行计算.结果发现:0 K且忽略原子驰豫时,电中性本征缺陷VC-C和Vsi的形成能相差为4.472eV,在此基础上分析了亚稳定型本征缺陷Vsi向稳定型本征缺陷Vc-C转化的理论依据及转化方式,首先发生转移的是h晶格位置上的Si原子,与非故意掺杂4H-SiC外延材料在氙光激励作用下的ESR结果吻合较好.     

Edge termination study and fabrication of a 4Hben SiC junction barrier Schottky diode

The 4H-SiC junction barrier Schottky (JBS) diodes terminated by field guard rings and offset field plate are designed, fabricated and characterized. It is shown experimentally that a 3-μm P-type implantation window spacing gives an optimum trade-off between forward drop voltage and leakage current density for these diodes, yielding a specific on-resistance of 8.3 mΩ·cm². A JBS diode with a turn-on voltage of 0.65 V and a reverse current density less than 1 A/cm² under 500 V is fabricated, and the reverse recovery time is tested to be 80 ns, and the peak reverse current is 28.1 mA. Temperature-dependent characteristics are also studied in a temperature range of 75 ℃-200 ℃. The diode shows a stable Schottky barrier height of up to 200 ℃ and a stable operation under a continuous forward current of 100 A/cm².     

6H-SiC Schottky barrier source／drain NMOSFET with field-induced source／drain extension

A novel SiC Schottky barrier source/drain NMOSFET (SiC SBSD-NMOSFET) with field-induced source/drain (FISD) extension is proposed and demonstrated by numerical simulation for the first time. In the new device the FISD extension is induced by a metal field-plate lying on top of the passivation oxide, and the width of Schottky barrier is controlled by the metal field-plate. The new structure not only eliminates the effect of the sidewalls but also significantly improves the on-state current. Moreover, the performance of the present device exhibits very weak dependence on the widths of sidewalls.     

基于2-（2’-吡啶基）苯并咪唑的Znn比例计量型荧光识别

本文以荧光分子2-（2’-吡啶基）苯并咪唑（2．PBI）作为1,1’-联（2-芳杂环）类化合物模型,研究利用其2,2＇-N原子螫合Zn2＋诱导芳环共面化和荧光发射红移实现Zn：＋比例计量检测的可行性。2-PBI在不同体系中的Zn2＋荧光响应行为表明Zn2＋结合将导致最大发射波长明显红移（乙腈36nm;HEPES缓冲液39nm）,具有比例计量型Zn2＋荧光探针的基本特点。2-PBI还具有显著的Zn2＋荧光响应选择性,可以同时作为构建比例计量型探针的信号团和受体的基本骨架。通过对2-BPI的荧光机制和Zn2＋识别行为的分析,提出r以2-PBI为基本骨架构建实用化比例计量型探针的途径。     

MoS2/Si tunnel diodes based on comprehensive transfer technique

Due to the pristine interface of the 2D/3D face-tunneling heterostructure with an ultra-sharp doping profile, the 2D/3D tunneling field-effect transistor (TFET) is considered as one of the most promising low-power devices that can simultaneously obtain low off-state current (I_OFF), high on-state current (I_ON) and steep subthreshold swing (SS). As a key element for the 2D/3D TFET, the intensive exploration of the tunnel diode based on the 2D/3D heterostructure is in urgent need. The transfer technique composed of the exfoliation and the release process is currently the most common approach to fabricating the 2D/3D heterostructures. However, the well-established transfer technique of the 2D materials is still unavailable. Only a small part of the irregular films can usually be obtained by mechanical exfoliation, while the choice of the chemical exfoliation may lead to the contamination of the 2D material films by the ions in the chemical etchants. Moreover, the deformation of the 2D material in the transfer process due to its soft nature also leads to the nonuniformity of the transferred film, which is one of the main reasons for the presence of the wrinkles and the stacks in the transferred film. Thus, the large-scale fabrication of the high-quality 2D/3D tunnel diodes is limited. In this article, a comprehensive transfer technique that can mend up the shortages mentioned above with the aid of the water and the thermal release tape (TRT) is proposed. Based on the method we proposed, the MoS₂/Si tunnel diode is experimentally demonstrated and the transferred monolayer MoS₂ film with the relatively high crystal quality is confirmed by atomic force microscopy (AFM), scanning electron microscopy (SEM), and Raman characterizations. Besides, the prominent negative differential resistance (NDR) effect is observed at room temperature, which verifies the relatively high quality of the MoS₂/Si heterojunction. The bilayer MoS₂/Si tunnel diode is also experimentally fabricated by repeating the transfer process we proposed, followed by the specific analysis of the electrical characteristics. This study shows the advantages of the transfer technique we proposed and indicates the great application foreground of the fabricated 2D/3D heterostructure for ultralow-power tunneling devices.