A compact I－V model for lightly-doped-drain MOSFETs

A novel model for lightly-doped-drain (LDD) MOSFETs is proposed, which utilizes the empirical hyperbolic tangent function to describe the I－V characteristics. The model includes the strong inversion and subthreshold mechanism, and shows a good prediction for submicron LDD MOSFET. Moreover, the model requires low computation time consumption and is suitable for design of MOSFETs devices and circuits.     

Effects of Low-Damage Plasma Treatment on the Channel 2DEG and Device Characteristics of AlGaN/GaN HEMTs

We investigate the effects of remote nitride-based plasma treatment on the channel carrier and device characteristics of AlGaN/GaN high electron mobility transistors(HEMTs).A 200 W NH₃/N₂ remote plasma causes little degeneration of carrier mobility and an increase in electron density due to surface alteration,which results in a decrease in sheet resistance and an increase in output current by 20-30%.Improved current slump,suppressed gate leakage current,and improved Schottk...     

高质量氧化镓单晶及肖特基二极管的制备

本文采用导模法生长技术,成功制备了高质量掺Si氧化镓(β-Ga₂O₃)单晶,掺杂浓度为2×10¹⁸ cm^-3。晶体呈现淡蓝色,通过劳厄衍射、阴极荧光(CL)及拉曼测试对晶体的基本性质进行了表征,结果表明晶体质量良好。紫外透过光谱证明该晶体的禁带宽度约为4.71 eV。此外,在剥离衬底上,采用电子束蒸发、光刻和显影技术制备了垂直结构的肖特基二极管,平均击穿场强E_Ava为2.1 MV/cm,导通电阻3 mΩ·cm²,展示了优异性能。     

恒流应力下E2PROM隧道氧化层的退化特性研究

在电容测量的基础上研究了薄隧道氧化层在恒定Fowler-Nordheim(F-N)隧穿电流下的退化情况.这种退化是恒流应力和时间的函数,对恒流应力大小的依赖性更加强烈,隧道氧化层在F-N电流下的退化是注入电荷密度(Qinj)的函数.在较低Qinj下氧化层中发生正电荷俘获,在较高Qinj下发生负电荷俘获,导致栅压变化的反复.     

Various Recipes of SiNx Passivated AlGaN/GaN High Electron Mobility Transistors in Correlation with Current Slump

The current slump of different recipes of SiN~ passivated AIGaN/GaN high electron mobility transistors （HEMTs） is investigated. The dc and pulsed current-voltage curves of AIGaN/GaN HEMTs using different recipes are analyzed. It is found that passivation leakage has a strong relationship with NH3 flow in the plasma-enhanced chemical vapor phase deposition process, which has impacted on the current collapse of SiNs passivated devices. We analyze the pulsed IDS -- VDS characteristics of different recipes of SiNx passivation devices for different combinations of gate and drain quiescent biases （VGso, VDSO） of （0, 0）, （-6, 0）, （-6, 15） and （0, 15）V. The possible mechanisms are the traps in SiNxpassivation capturing the electrons and the surface states at the SiNx/AIGaN interface, which can affect the channel of two-dimensional electron gas and cause the current collapse.     

Improved device performance of recessed-gate AlGaN/GaN HEMTs by using in-situ N2O radical treatment

The N₂O radicals in-situ treatment on gate region has been employed to improve device performance of recessed-gate AlGaN/GaN high-electron-mobility transistors (HEMTs). The samples after gate recess etching were treated by N₂O radicals without physical bombardment. After in-situ treatment (IST) processing, the gate leakage currents decreased by more than one order of magnitude compared to the sample without IST. The fabricated HEMTs with the IST process show a low reverse gate current of 10^-9 A/mm, high on/off current ratio of 10⁸, and high f_T×L_g of 13.44 GHz· μm. A transmission electron microscope (TEM) imaging illustrates an oxide layer with a thickness of 1.8 nm exists at the AlGaN surface. X-ray photoelectron spectroscopy (XPS) measurement shows that the content of the Al-O and Ga-O bonds elevated after IST, indicating that the Al-N and Ga-N bonds on the AlGaN surface were broken and meanwhile the Al-O and Ga-O bonds formed. The oxide formed by a chemical reaction between radicals and the surface of the AlGaN barrier layer is responsible for improved device characteristics.     

Depth-dependent mosaic tilt and twist in GaN epilayer:An approximate evaluation

An approach based on depth-sensitive skew-angle x-ray diffraction （SAXRD） is presented for approximately evalu- ating the depth-dependent mosaic tilt and twist in wurtzite c-plane GaN epilayers. It is found that （103） plane and （101） plane, among the lattice planes not perpendicular to the sample surface, are the best choices to measure the depth profiles of tilt and twist for a GaN epilayer with a thickness of less than 2 μm according to the diffraction geometry of SAXRD. As an illustration, the depth-sensitive （103）/（101） ω-scans of a 1.4-μm GaN film grown by metal-organic chemical vapor deposition on sapphire substrate are measured and analyzed to show the feasibility of this approach.     

Improved performance of AlGaN/GaN HEMT by N2O plasma pre-treatment

The influence of an N_2O plasma pre-treatment technique on characteristics of AlGaN/GaN high electron mobility transistor(HEMT) prepared by using a plasma-enhanced chemical vapor deposition(PECVD) system is presented.After the plasma treatment,the peak transconductance(g_m) increases from 209 mS/mm to 293 mS/mm.Moreover,it is observed that the reverse gate leakage current is lowered by one order of magnitude and the drain current dispersion is improved in the plasma-treated device.From the analysis of frequency-dependent conductance,it can be seen that the trap state density(D_T) and time constant(τ_T) of the N20-treated device are smaller than those of a non-treated device.The results indicate that the N_2O plasma pre-pretreatment before the gate metal deposition could be a promising approach to enhancing the performance of the device.     

N型槽栅金属-氧化物-半导体场效应晶体管抗热载流子效应的研究

用二维器件仿真软件MEDICI模拟分析了N型槽栅金属-氧化物-半导体场效应晶体管的热载流 子特性及其对器件性能所造成的损伤,并与相应常规平面器件进行了比较,同时用器件内部 物理量的分布对造成两种结构器件特性不同的原因进行了解释.结果表明槽栅器件对热载流 子效应有明显的抑制作用,但槽栅器件对热载流子损伤的反应较平面器件敏感. 关键词： 槽栅MOSFET 热载流子效应 界面态 特性退化     

Negative bias-induced threshold voltage instability and zener/interface trapping mechanism in GaN-based MIS-HEMTs

We investigate the instability of threshold voltage in D-mode MIS-HEMT with in-situ SiN as gate dielectric under different negative gate stresses.The complex non-monotonic evolution of threshold voltage under the negative stress and during the recovery process is induced by the combination effect of two mechanisms.The effect of trapping behavior of interface state at SiN/AlGaN interface and the effect of zener traps in AlGaN barrier layer on the threshold voltage instability are opposite to each other.The threshold voltage shifts negatively under the negative stress due to the detrapping of the electrons at SiN/AlGaN interface,and shifts positively due to zener trapping in AlGaN barrier layer.As the stress is removed,the threshold voltage shifts positively for the retrapping of interface states and negatively for the thermal detrapping in AlGaN.However,it is the trapping behavior in the AlGaN rather than the interface state that results in the change of transconductance in the D-mode MIS-HEMT.