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261.
The anisotropic strain of a nonpolar (1120) a-plane GaN epilayer on an r-plane (1102) sapphire substrate, grown by low-pressure metal-organic vapour deposition is investigated by Raman spectroscopy. The room-temperature Raman scattering spectra of nonpolar a-plane GaN are measured in surface and edge backscattering geometries. The lattice is contracted in both the c- and the m-axis directions, and the stress in the m-axis direction is larger than that in the c-axis direction. On the surface of this sample, a number of cracks appear only along the m-axis, which is confirmed by the scanning electron micrograph. Atomic force microscopy images reveal a significant decrease in the root-mean-square roughness and the density of submicron pits after the stress relief. 相似文献
262.
文章基于蓝宝石衬底采用脉冲金属有机物化学气相淀积(MOCVD)法生长的高迁移率InAlN/GaN材料,其霍尔迁移率在室温和77 K下分别达到949和2032 cm2/Vs,材料中形成了二维电子气(2DEG). 进一步引入1.2 nm的AlN界面插入层形成InAlN/AlN/GaN结构,则霍尔迁移率在室温和77 K下分别上升到1437和5308 cm2/Vs. 分析样品的X射线衍射、原子力显微镜测试结果以及脉冲MOCVD生长方法的特点,发现InAlN/GaN材料的结晶质量较高,与GaN晶格匹配的InAlN材料具有平滑的表面和界面. InAlN/GaN和InAlN/AlN/GaN材料形成高迁移率特性的主要原因归结为形成了密度相对较低(1.6×1013-1.8×1013 cm-2)的2DEG,高质量的InAlN晶体降低了组分不均匀分布引起的合金无序散射,以及2DEG所在界面的粗糙度较小,削弱了界面粗糙度散射.
关键词:
InAlN/GaN
脉冲金属有机物化学气相淀积
二维电子气
迁移率 相似文献
263.
Reveal the large open-circuit voltage deficit of all-inorganicCsPbIBr2 perovskite solar cells
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Due to excellent thermal stability and optoelectronic properties, all-inorganic perovskite is one of the promising candidates to solve the thermal decomposition problem of conventional organic—inorganic hybrid perovskite solar cells (PSCs), but the larger voltage loss (Vloss) cannot be ignored, especially CsPbIBr2, which limits the improvement of efficiency. To reduce Vloss, one promising solution is the modification of the energy level alignment between the perovskite layer and adjacent charge transport layer (CTL), which can facilitate charge extraction and reduce carrier recombination rate at the perovskite/CTL interface. Therefore, the key issues of minimum Vloss and high efficiency of CsPbIBr2-based PSCs were studied in terms of the perovskite layer thickness, the effects of band offset of the CTL/perovskite layer, the doping concentration of the CTL, and the electrode work function in this study based on device simulations. The open-circuit voltage (Voc) is increased from 1.37 V to 1.52 V by replacing SnO2 with ZnO as the electron transport layer (ETL) due to more matching conduction band with the CsPbIBr2 layer. 相似文献
264.
Effects of electrical stress on the characteristics and defect behaviors in GaN-based near-ultraviolet light emitting diodes
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Ying-Zhe Wang 《中国物理 B》2022,31(6):68101-068101
The degradation mechanism of GaN-based near-ultraviolet (NUV, 320-400 nm) light emitting diodes (LEDs) with low-indium content under electrical stress is studied from the aspect of defects. A decrease in the optical power and an increase in the leakage current are observed after electrical stress. The defect behaviors are characterized using deep level transient spectroscopy (DLTS) measurement under different filling pulse widths. After stress, the concentration of defects with the energy level of 0.47-0.56 eV increases, accompanied by decrease in the concentration of 0.72-0.84 eV defects. Combing the defect energy level with the increased yellow luminescence in photoluminescence spectra, the device degradation can be attributed to the activation of the gallium vacancy and oxygen related complex defect along dislocation, which was previously passivated with hydrogen. This study reveals the evolution process of defects under electrical stress and their spatial location, laying a foundation for manufacture of GaN-based NUV LEDs with high reliability. 相似文献
265.
In this paper, we present a high-efficiency S-band gallium nitride (GaN) power amplifier (PA). This amplifier is fabri- cated based on a self-developed GaN high-electron-mobility transistor (HEMT) with 10 mm gate width on SiC substrate. Harmonic manipulation circuits are presented in the amplifier. The matching networks consist of microstrip lines and discrete components. Open-circuited stub lines in both input and output are used to tune the 2rid harmonic wave and match the GaN HEMT to the highest efficiency condition. The developed amplifier delivers an output power of 48.5 dBm (70 W) with a power-added efficiency (PAE) of 72.2% at 2 GHz in pulse condition. When operating at 1.8-2.2 GHz (20% relative bandwidth), the amplifier provides an output power higher than 48 dBm (,-~ 65 W), with a PAE over 70% and a power gain above 15 dB. When operating in continuous-wave (CW) operating conditions, the amplifier gives an output power over 46 dBm (40 W) with PAE beyond 60% over the whole operation frequency range. 相似文献
266.
Influence of compressive strain on the incorporation of indium in InGaN and InAlN ternary alloys
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In order to investigate the influence of compressive strain on indium incorporation in In Al N and In Ga N ternary nitrides,In Al N/Ga N heterostructures and In Ga N films were grown by metal–organic chemical vapor deposition.For the heterostructures,different compressive strains are produced by Ga N buffer layers grown on unpatterned and patterned sapphire substrates thanks to the distinct growth mode;while for the In Ga N films,compressive strains are changed by employing Al Ga N templates with different aluminum compositions.By various characterization methods,we find that the compressive strain will hamper the indium incorporation in both In Al N and In Ga N.Furthermore,compressive strain is conducive to suppress the non-uniform distribution of indium in In Ga N ternary alloys. 相似文献
267.
AlGaN/GaN high electron mobility transistors(HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10 15 cm 2.The dc characteristics of the devices,such as the drain saturation current and the maximum transconductance,decreased after neutron irradiation.The gate leakage currents increased obviously after neutron irradiation.However,the rf characteristics,such as the cut-off frequency and the maximum frequency,were hardly affected by neutron irradiation.The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism.It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas(2DEG) decreased after neutron irradiation.There was no evidence of the full-width at half-maximum of X-ray diffraction(XRD) rocking curve changing after irradiation,so the dislocation was not influenced by neutron irradiation.It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices. 相似文献
268.
Performance of La<sub>2</sub>O<sub>3</sub>/InAlN/GaN metal-oxide-semiconductor high electron mobility transistors
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We report on the performance of La2O3/InAlN/GaN metal-oxide-semiconductor high electron mobility transistors(MOSHEMTs) and InAlN/GaN high electron mobility transistors(HEMTs).The MOSHEMT presents a maximum drain current of 961 mA/mm at Vgs = 4 V and a maximum transconductance of 130 mS/mm compared with 710 mA/mm at Vgs = 1 V and 131 mS/mm for the HEMT device,while the gate leakage current in the reverse direction could be reduced by four orders of magnitude.Compared with the HEMT device of a similar geometry,MOSHEMT presents a large gate voltage swing and negligible current collapse. 相似文献
269.
Accumulation-type GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) with atomic-layerdeposited Al2O3 gate dielectrics are fabricated.The device,with atomic-layer-deposited Al2O3 as the gate dielectric,presents a drain current of 260 mA/mm and a broad maximum transconductance of 34 mS/mm,which are better than those reported previously with Al2O3 as the gate dielectric.Furthermore,the device shows negligible current collapse in a wide range of bias voltages,owing to the effective passivation of the GaN surface by the Al2O3 film.The gate drain breakdown voltage is found to be about 59.5 V,and in addition the channel mobility of the n-GaN layer is about 380 cm2 /Vs,which is consistent with the Hall result,and it is not degraded by atomic-layer-deposition Al2O3 growth and device fabrication. 相似文献
270.