外电场对InGaAsP/InP量子阱内激子结合能的影响

在有效质量近似下采用变分法计算了InGaAsP/InP量子阱内不同In组分下的激子结合能,分析了结合能随阱宽和In组分的变化情况,并且讨论了外加电场对激子结合能的影响. 结果表明：激子结合能是阱宽的一个非单调函数,随阱宽的变化呈现先增加后减小的趋势;随着In组分增大,激子结合能达到最大值的阱宽相应变小,这与材料的带隙改变有关;在一定范围内电场的存在对激子结合能的影响很小,但电场强度较大时会破坏激子效应. 关键词： 激子 InGaAsP/InP量子阱 结合能 电场     

Damascene Array Structure of Phase Change Memory Fabricated with Chemical Mechanical Polishing Method

A damascene structure of phase change memory （PCM） is fabricated successfully with the chemical mechanical polishing （CMP） method, and the CMP of Ge2Sb2Te5 （GST） and Ti films is investigated. The polished surface of wafer is analysed by scanning electron microscopy （SEM） and an energy dispersive spectrometer （EDS）. The measurements show that the damascene device structure of phase change memory is achieved by the CMP process. After the top electrode is deposited, dc sweeping test on PCM reveals that the phase change can be observed. The threshold current of array cells varies between 0.90mA and 1.15mA.     

Study on the delamination of tungsten thin films on Sb2Te3

To investigate the reliability of electrode materials for chalcogenide random access memory （C-RAM） applications, the geometry and time evolution of the worm-like delamination patterns on a tungsten/Sb2Te3 bilayer system surface are observed by field emission scanning electronic microscope （FESEM） and optical microscopy. The tungsten film stress and interface toughness are estimated using a straight-side model. After confirming the instability of this system being due to large compressive stress stored in the tungsten film and relative poor interface adhesion, a preliminary solution as the inset of a TiN adhesion layer is presented to improve the system performances.     

Structure and Electrical Properties of Ge2Sb2Te5 Thin Film Used for Ovonic Unified Memory

Annealing temperature effects on the structure and electrical resistance of Ge2Sb2Te5 thin film were studied. The crystallization and melting temperature of the thin film are about 175℃ and 610℃ respectively. The structure of the as-deposited and the annealed film at different annealing temperatures are identified by the x-ray diffraction     

Mechanism of amorphous Ge2Sb2Te5 removal during chemical mechanical planarization in acidic H2O2 slurry

In this paper, chemical mechanical planarization (CMP) of amorphous Ge2Sb2Te5 (a-GST) in acidic H2O2 slurry is investigated. It was found that the removal rate of a-GST is strongly dependent on H2O2 concentration and gradually increases with the increase in H2O2 concentration, but the static etch rate first increases and then slowly decreases with the increase in H2O2 concentration. To understand the chemical reaction behavior of H2O2 on the a-GST surface, the potentiodynamic polarization curve, surface morphology and cross-section of a-GST immersed in acidic slurry are measured and the results reveal that a-GST exhibits a from active to passive behavior for from low to high concentration of H2O2 . Finally, a possible removal mechanism of a-GST in different concentrations of H2O2 in the acidic slurry is described.     

Cation Effect on Copper Chemical Mechanical Polishing

We examine the effect of cations in solutions containing benzotriazole （BTA） and H202 on copper chemical mechanical polishing （CMP）. On the base of atomic force microscopy （AFM） and material removal rate （MRR） results, it is found that ammonia shows the highest MRR as well as good surface after CMP, while KOH demonstrates the worst performance. These results reveal a mechanism that small molecules with lone-pairs rather than molecules with steric effect and common inorganic cations are better for copper CMP process, which is indirectly confirmed by open circuit potential （OCP）.     

Simulation of SET Operation in Phase-Change Random Access Memories with Heater Addition and Ring-Type Contactor for Low-Power Consumption by Finite Element Modeling

A three-dimensional finite element model for phase change random access memory （PCRAM） is established for comprehensive electrical and thermal analysis during SET operation. The SET behaviours of the heater addition structure （HS） and the ring-type contact in bottom electrode （RIB） structure are compared with each other. There are two ways to reduce the RESET current, applying a high resistivity interracial layer and building a new device structure. The simulation resuIts indicate that the variation of SET current with different power reduction ways is little. This study takes the RESET and SET operation current into consideration, showing that the RIB structure PCRAM cell is suitable for future devices with high heat efficiency and high-density, due to its high heat efficiency in RESET operation.     

由Pb过量引起的镧钛酸铅铁电薄膜性能异常的研究

采用金属有机物热分解法制备了不同La含量和不同Pb过量的镧钛酸铅铁电薄膜．在研究铁电性时发现：薄膜样品在极化达到饱和之前，电滞回线会出现束腰现象，束腰现象只与薄膜中的Pb过量有关．随Pb过量的增加和La含量的减少，镧钛酸铅薄膜电滞回线的束腰程度加剧．在C-V特性测试中发现：在Pb过量的样品中，C-V曲线会出现异常的四峰现象，随偏压升高或频率增大，异常程度逐渐减弱甚至会转变成正常的双峰．进一步研究表明：这两种实验现象是统一的，可以用铁电薄膜电畴的钉扎效应解释．由于Pb过量使正常的钙钛矿薄膜中出现了多余的Pb 关键词：