相转移催化羰基化合成丙二酸二乙酯的研究

在相转移催化剂存在下，使用原位制备的钴催化剂实现了氯乙酸乙酯的常压羰基化，丙二酸二乙酯收率达８０％以上。讨论了溶剂、相转移催化剂等对反应的影响。     

原子荧光光谱测定化妆品中痕量铅

介绍氢化物发生－原子荧光光谱法对化妆品中铅含量的定量分析方法，并研究原子荧光光谱测定铅的分析条件。方法检出限低，精密度高，准确性好，可用于测定化妆品中的痕量铅。     

表面残留有机沾污物的TOF－SIMS及XPS研究

飞行时间次级离子质谱（ＴＯＦ－ＳＩＭＳ）结合Ｘ射线光电子能谱（ＸＰＳ）分析了用化学方法清洗后、银片上残留的未知的有机物。结果显示，有机沾污物主要是一些含１８～３０碳原子、碳链饱和度很高的酮类和酯类化合物；个别有机物可能是硬脂酰胺。这种结构特点使有机物中的Ｃ＝Ｏ基团易于采取氧原子指向基体表面的取向，通过带部分负电荷的氧原子与金属基体镜像力的作用而增强粘附。ＴＯＦ－ＳＩＭＳ二维离子像显示有机沾污物在银片表面上呈极稀薄的均匀分布。     

以交联聚丙烯酸甲酯为载体的多乙烯多胺／铜（Ⅱ）络合物的合成及其对尿素的吸附性

以大孔交联聚丙烯酸甲酯为原料，引入多乙烯多胺［Ｈ（ＮＨＣＨ２ＣＨ２）ｎＮＨ２，ｎ＝２，３，４］配体，络合二价铜离子，合成出一系列以交联聚内烯酸甲酯为载体的多乙烯多胺／铜（Ⅱ）络合物，研究了这类高分子络合物在不同条件下对尿素的吸附性能。结果说明，在载体树脂相同时．配体不同的络合物树脂对尿素的吸附性能有很大差异，以二乙烯三胺或三乙烯四胺为配体，产物树脂对尿素的吸附量较大，而以四乙烯五胺为配体则吸附量较小。在尿素浓度１３０ｍｇ／ｄｌ、吸附时间８小时、介质为ｐＨ＝７的Ｎａ２ＨＰＯ４－ＮａＨ２ＰＯ４缓冲溶液、温度１８℃时，该类高分子络合物对尿素的最大吸附量达到７５．２ｍｇ／ｇ。     

反式—[(μ—Cl)_2Pd_2(DEHSO)_2Cl_2]配合物的合成及其结构

用萃取法合成反式-[(μ-Cl)_2Pd_2(DEHSO)_2Cl_2](DEHSO系二(2-乙基已基)亚砜的简写),对配合物进行了组成分析、摩尔电导、差热-热重、紫外、红外测试,并经X射线单晶结构分析,确定了配合物的晶体和分子结构。     

The Translative Kissing Number of Cartesian Product of two Convex Bodies, one of which is Two-Dimensional

This article discusses the relation between the translative kissing numbers of convex bodies K ₁, K ₂ and K ₁ K ₂. As an application of the main theorem, we find that the translative kissing number of B Q, where B is a 24-dimensional ball and Q is a two-dimensional non-parallelogram convex domain, is 1375926.     

Cairns港口海底沉积物中五种甾醇的分离

从澳大利亚Cairns港口海底沉积物中分离出五种甾醇化合物, 其中两种是具有植物生长调节活性的菜油甾醇和菜子甾醇。     

Study on Dyeing Performance of Cationic Water-soluble Sulphur Black on Silk

A novel polyquaternaryammonium cationic sulphur black dye was synthesized and its dyeing behavior on silk was studied. The dye exhibited excellent dyeing fixation of up to 98.2 %,as well as excellent dyeing fastness on silk.     

Sacrificial adhesion promotion layers for copper metallization of device structures

The adhesion of copper films to adjacent device layers including TiN, Ta, and TaN diffusion barriers is a crucial reliability issue for integrated circuits. We report that ultrathin layers of poly(acrylic acid) (PAA) prepared on barrier surfaces or on the native oxide of Si wafers dramatically increase the interfacial adhesion of Cu films deposited by the H2 assisted reduction of bis(2,2,7-trimethyloctane-3,5-dionato)copper in supercritical carbon dioxide. Similar improvements were achieved on Si wafers using a simple vapor phase exposure of the substrate to acrylic acid prior to metallization. The deposited films and the substrate/Cu interfaces were analyzed by X-ray photoelectron spectroscopy (XPS), electron microscopy, atomic force microscopy, and variable-angle spectroscopic ellipsometry. No trace of the adhesion layer was detected at the interface, indicating it was sacrificial at the deposition conditions used. Moreover, the presence and subsequent decomposition of the PAA layer during deposition substantially reduced or eliminated metal oxides at the substrate interface. For depositions on PAA-treated Si wafers, copper was present primarily as Cu0 at the interface and Si was present only as Si0. On PAA-treated Ta substrates, XPS analysis indicated Ta was present primarily as Ta0 at the metallized interface whereas Ta2O5 dominated the interface of samples prepared without the adhesion layers. The technique can be extended to patterned substrates using adsorption of acrylic acid or thermal/UV polymerization of acrylic acid.     

钙离子室温交联聚丙烯酸酯无皂水溶胶的研究

研究了Ca^2 聚丙烯酸酯无皂水溶胶交联乳液的制备条件，考察了交联温度、交联剂用量对涂膜性能的影响。结果表明Ca^2 加入无皂水溶胶中的最低温度为40℃，交联反应于室温下即完全发生，交联膜具有较好的耐热、耐水性能。用TEM以及电导滴定对交联机理进行了初步探讨，发现交联反应主要发生在胶乳表面．COO^-与Ca^2 之间。