非晶硅薄膜太阳能电池的紫外激光刻蚀工艺

为提高电池的光电转换效率,通过改善激光刻蚀工艺,采用355 nm紫外纳秒激光分别进行了ZnO：Al薄膜（AZO）刻蚀（P1）、非晶硅薄膜（-Si）刻蚀（P2）和背电极刻蚀（P3）研究。采用万用表测量P1隔离电阻,采用电子扫描显微镜（SEM）和三维激光扫描仪测量刻槽的微结构和三维成像,激光拉曼散射光谱检测非晶硅薄膜刻蚀边缘的晶化。实验结果表明,当刻蚀速度600 mm/s,重复频率40 kHz,功率1.74 W的紫外激光刻蚀ZnO：Al薄膜时,刻槽的隔离效果最佳,达20 M; 紫外激光刻蚀能够有效地减小激光热效应引起的热影响和刻槽边缘的晶化范围,提高非晶硅薄膜电池的性能。     

Terahertz surface plasmon polaritons in textured metal surfaces formed by square arrays of metallic pillars

In this paper, we investigate numerically the characteristics of surface plasmon polaritons (SPPs) sustained by two-dimensional arrays of metallic pillars protruding out of planar metal surfaces at terahertz (THz) frequencies. Various shapes of the pillars are analyzed, and it is shown that the pillar shape only has weak influence on the dispersion of spoof SPPs. However, the loss of spoof SPPs is closely dependent on the pillar shape. It is also shown that spoof SPPs on textured surfaces with pillars can exhibit much better confinement than those on pierced surfaces with holes.     

亚波长孔阵列的太赫兹波异常透射研究

利用太赫兹时域光谱（THz-TDS）系统,在5—300 K温区下测量了在厚度约200 nm的金属Nb薄膜刻蚀的亚波长圆孔阵列的异常THz波透射情况.实验结果表明,在03—2 THz波段,具有亚波长孔阵结构的金属Nb薄膜的异常透射现象波谱的峰位置与CST（computer simulation technology）软件仿真模拟的结果一致,峰值随温度降低有逐渐增强的趋势. 关键词： 亚波长孔阵列 THz时域光谱技术 异常透射     

Co与Cu掺杂ZnO薄膜的制备与光致发光研究

采用溶胶-凝胶旋涂法在玻璃衬底上制备了Co, Cu单掺杂及Co,Cu共掺杂ZnO薄膜.用金相显微镜观察了Co与Cu掺杂对ZnO薄膜形貌的影响.X射线衍射（XRD）研究揭示所有ZnO薄膜样品都存在（002）择优取向,在Cu单掺的ZnO薄膜中晶粒尺寸最大.对所有样品的室温光致发光测量都观察到较强的蓝光双峰发射和较弱的绿光发射,其中长波长的蓝光峰和绿光峰都能够通过掺杂进行控制.对不同掺杂源的ZnO薄膜发光性能进行了分析,认为蓝光峰来源于电子由导带底到锌空位能级的跃迁及锌填隙到价带顶的跃迁,绿光峰是由于掺杂造成的 关键词： ZnO薄膜 溶胶-凝胶 Co Cu掺杂 光致发光     

Initial-boundary value problems for a class of nonlinear thermoelastic plate equations

This paper studies initial-boundary value problems for a class of nonlinear thermoelastic plate equations. Under some certain initial data and boundary conditions, it obtains an existence and uniqueness theorem of global weak solutions of the nonlinear thermoelstic plate equations, by means of the Galerkin method. Moreover, it also proves the existence of strong and classical solutions.     

An improved boundary element-free method （IBEFM） for two-dimensional potential problems

The interpolating moving least-squares (IMLS) method is discussed first in this paper. And the formulae of the IMLS method obtained by Lancaster are revised. Then on the basis of the boundary element-free method (BEFM), combining the boundary integral equation (BIE) method with the IMLS method, the improved boundary element-free method (IBEFM) for two-dimensional potential problems is presented, and the corresponding formulae of the IBEFM are obtained. In the BEFM, boundary conditions are applied directly, but the shape function in the MLS does not satisfy the property of the Kronecker δ function. This is a problem of the BEFM, and must be solved theoretically. In the IMLS method, when the shape function satisfies the property of the Kronecker δ function, then the boundary conditions, in the meshless method based on the IMLS method, can be applied directly. Then the IBEFM, based on the IMLS method, is a direct meshless boundary integral equation method in which the basic unknown quantity is the real solution of the nodal variables, and the boundary conditions can be applied directly and easily, thus it gives a greater computational precision. Some numerical examples are presented to demonstrate the method.     

The effects of current-path patterns on magnetotransport in spatially-confined structures by Monte Carlo simulation

Simulations are performed on clusters of finite size to study the effects of size and current-path structure on magnetotransport in spatially-confined samples. Magnetotransport networks are established and calculated based on fractal structures including Koch curves and percolation backbones extracted from regular lattices. The structure pattern of clusters is shown to play an important role in the magnetotransport behaviours by affecting the magnetoresistance fluctuations due to spin disorder in the systems of small size, which suggests the possibility of controlling the magnetotransport by the design of current-path configurations.     

米兰花化学成分的GC-MS分析

采用超声波提取米兰花.然后对其化学成分进行GC-MS分析.从米兰花中分离确定了27种主要成分,其中萜类物质含量相对较高.     

Complete chaotic synchronization mechanism of polarization mode of VCSEL with anisotropic optical feedback

We numerically investigate the complete chaotic synchronization mechanism of polarization mode of VCSEL with anisotropic optical feedback. Firstly, the synchronization quality of the x-linear polarization (LP) mode and the y-LP mode are both periodically changed with the angle θ between the polarizer and the light axes. Secondly, in a enough large scale region of the feedback coefficient and the injection current, where each LP mode can obtained good synchronization quality when the angle θ exists in the former half period region and the injection current is fixed at a certain value, which is over the threshold current. Under this condition, their synchronization quality is independent of the polarization states. By contrast, in the latter half period region of the angle θ where each LP mode can be obtained very instable and inferior synchronized quality. At last, the robustness of the synchronization scheme is sensitive to the internal and external parameter mismatch between the transmitter-VCSEL and the receiver-VCSEL.     

Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

The as-cutted sapphire wafers are planarized by the grinding and polishing two-step machining processes with micrometer B₄C and nanometer silica as abrasives, respectively. The material removal rates (MRRs) of two processes are measured. During the polishing process, the MRR increases with the down-pressure increased, whereas the rotational speeds have less effect on the MRR. The alkaline colloidal silica is more favorable than the acidic to polish sapphire wafer. The ground and polished surfaces of the substrate are compared by scanning electron microscopy, atomic force microscopy, and X-ray rocking curves. Our results show that B₄C abrasives are effective in elimination of the ununiformity in thickness within a wafer. The colloidal silica can achieve a nanoscale flatness of wafer, but the lasting polishing time seems unfavorable. The polishing process is also analyzed in terms of chemical mechanical polishing mechanism.