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循环流化床(CFB)煤/焦气化反应的研究Ⅱ.温度、氧含量及煤种对CFB气化反应的影响 总被引:8,自引:0,他引:8
报道了两种煤/焦(西山焦煤飞灰、神木煤),在小型循环流化床(CFB)气化反应装置上,以二氧化碳及氧气混合物为气化介质,在不同条件(900~970°C,0~30%氧含量)下的气化反应的研究。结果表明,提高气化温度,气化反应速度提高,尾气中可燃气体浓度(CO,H2,CH4)、碳转化率及气化效率明显提高。气化介质中的氧含量增加,CO浓度、碳转化率及气化强度明显增加。反应性高、挥发分多的煤种更适合在CFB气化反应装置上进行气化反应。 相似文献
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在5×10-5mol·L-1Bi(Ⅲ)溶液中,增加络合剂邻吡啶甲酸的浓度,用示差脉冲极谱法研究铋 邻吡啶甲酸体系。通过计算机分析程序求解体系的质量平衡方程及拟合试验络合物形成曲线,优化得到铋和邻吡啶甲酸形成的络合物BiL2+和BiL+2的稳定常数,分别为7.51±0.03和13.92±0.04。 相似文献
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This paper reports that an atomic scale study of [\bar {1}10]
symmetrical tilt grain
boundary (STGB) has been made with modified analytical embedded atom
method (MAEAM) for 44 planes in three noble metals Au, Ag and Cu. For
each metal, the energies of two crystals ideally joined together are
unrealistically high due to very short distance between atoms near
the grain boundary (GB) plane. A relative slide between grains in the
GB plane results in a significant decrease in GB energy and a minimum
value is obtained at specific translation distance. The minimum
energy of Cu is much higher than that of Ag and Au, while the minimum
energy of Ag is slightly higher than that of Au. For all the three
metals, the three lowest energies correspond to identical (111),
\mbox(113) and \mbox(331) boundary successively for two
translations considered; from minimization of GB energy, these
boundaries should be preferable in [\bar {1}10] STGB for noble
metals. This is consistent with the experimental results. In
addition, the minimum energy increases with increasing reciprocal
planar coincidence density \Sigma, but decreases with
increasing relative interplanar distance d /a. 相似文献
39.
Yield strengths and stress induced crackles in copper films:effects of substrate and passivated layer 总被引:4,自引:0,他引:4
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Yield strengths in unpassivated and 530 nm TiN passivated Cu films deposited on Ti, high-speed steel and Ni substrates have been measured by x-ray diffraction (XRD) in combination with the four-point bending method. The results show that, although the texture and average grain size, investigated by XRD and transmission electron microscopy respectively, do not vary with different substrate, the yield strength of the Cu film increases obviously when a thin passivated layer is present and varies slightly with substrates. Many crackles appear in the passivated Cu film on Ti substrate but do not appear in other samples. The experimental results have been explained satisfactorily with an expression for the yield strength of thin films given previously. 相似文献
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