Neue Wege zu Polysilanen

Summary Disilane derivatives undergo disproportionation reactions to polysilanes. Investigated were 1,2-dimethyldisilane and 1,2-dimethyltetrachlorodisilane with catalysts like NH₄Cl, AgCN, and Nacyanamide. In case of 1,2-dimethyldisilane, with more than catalytic amounts of NH₄Cl, a nitrogen containing polysilane is formed. Two new compoundsMeSiH(NCO)₂ andMe ₂Si₂(NCO)₄ were synthesized and characterized. The last one leads to a polymer at heating. Additionally an electrochemical formation of polydimethylsilane is described.

     

Error linear complexity measures for multisequences

Complexity measures for sequences over finite fields, such as the linear complexity and the k-error linear complexity, play an important role in cryptology. Recent developments in stream ciphers point towards an interest in word-based stream ciphers, which require the study of the complexity of multisequences. We introduce various options for error linear complexity measures for multisequences. For finite multisequences as well as for periodic multisequences with prime period, we present formulas for the number of multisequences with given error linear complexity for several cases, and we present lower bounds for the expected error linear complexity.     

Some Notes on the Linear Complexity of Sidel’nikov-Lempel-Cohn-Eastman Sequences

We continue the study of the linear complexity of binary sequences, independently introduced by Sidel’nikov and Lempel, Cohn, and Eastman. These investigations were originated by Helleseth and Yang and extended by Kyureghyan and Pott. We determine the exact linear complexity of several families of these sequences using well-known results on cyclotomic numbers. Moreover, we prove a general lower bound on the linear complexity profile for all of these sequences.     

The stresses in single lap joints with a functionally graded adhesive bondline: an efficient modelling approach

In this work, an efficient analytical model for the stress analysis of single lap joints with a functionally graded adhesive bondline is proposed which considers peel as well as shear stresses in the adhesive. The model takes into account the nonlinear geometric characteristics of a single lap joint under tensile loading and allows for the analysis of various adhesive Young's modulus variations. The obtained stress distributions are compared to results of detailed Finite Element analyses and show a good agreement for several single lap joint configurations. In addition, different adhesive Young's modulus distributions and their effect on the peel and shear stresses are studied and discussed in detail. (© 2016 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)