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71.
N. Tsyntsaru G. Kaziukaitis C. Yang H. Cesiulis H. G. G. Philipsen M. Lelis J.-P. Celis 《Journal of Solid State Electrochemistry》2014,18(11):3057-3064
This study was performed in order to investigate a possibility to obtain Co-W microbumps via electrochemical routes, because this alloy recently has gained attraction as a novel barrier against copper diffusion. In order to be applied in flip-chip technology, barrier layers should be void-free and uniformly deposited on the entire area of a die to ensure high reliability and high performance of wafer bump-solder interface. To meet these requirements, a set of potentiostatic and galvanostatic electrodeposition was carried out from a citrate electrolyte, at pH 5 and at room temperature. The tests done confirm that void-free Co-W bumps with a uniform tungsten content along the bump can be obtained by potentiostatic and galvanostatic electrodeposition. Successful electrodeposition of Cu/Co-W/Sn layers with good adhesion between them and uniformity on the entire array of bumps also was obtained. The XPS data confirm that electrodeposited Co-W layers can act as a good barrier between Sn and Cu. 相似文献
72.
ChemInform is a weekly Abstracting Service, delivering concise information at a glance that was extracted from about 100 leading journals. To access a ChemInform Abstract of an article which was published elsewhere, please select a “Full Text” option. The original article is trackable via the “References” option. 相似文献