4,5-Dicyanoimidazole-promoted synthesis of dinucleoside polyphosphates and their analogs

A general and efficient P(V)–N activation method for the preparation of symmetrical and asymmetrical dinucleoside polyphosphates (Np_nN′s, n=2–4) and P²,P³-CX₂-dinucleoside tetraphosphates (X=H, F, and Cl) has been established. Twenty-two dinucleoside polyphosphates and their phosphonate analogs were synthesized from nucleoside 5′-phosphoropiperidates with 4,5-dicyanoimidazole as the activator in good to high yields.     

Assessment of the various ionization methods in the analysis of metal salen complexes by mass spectrometry

Metal salen complexes are one of the most frequently used catalysts in enantioselective organic synthesis. In the present work, we compare a series of ionization methods that can be used for the mass spectral analysis of two types of metalosalens: ionic complexes (abbreviated as Com⁺X^?) and neutral complexes (NCom). These methods include electron ionization and field desorption (FD) which can be applied to pure samples and atmospheric pressure ionization techniques: electrospray ionization (ESI), atmospheric pressure chemical ionization (APCI) and atmospheric pressure photoionization (APPI) which are suitable for solutions. We found that FD is a method of choice for recording molecular ions of the complexes containing even loosely bonded ligands. The results obtained using atmospheric pressure ionization methods show that the results depend mainly on the structure of metal salen complex and the ionization method. In ESI spectra, Com⁺ ions were observed, while in APCI and APPI spectra both Com⁺ and [Com + H]⁺ ions are observed in the ratio depending on the structure of the metal salen complex and the solvent used in the analysis. For complexes with tetrafluoroborate counterion, an elimination of BF₃ took place, and ions corresponding to complexes with fluoride counterion were observed. Experiments comparing the relative sensitivity of ESI, APCI and APPI (with and without a dopant) methods showed that for the majority of the studied complexes ESI is the most sensitive one; however, the sensitivity of APCI is usually less than two times lower and for some compounds is even higher than the sensitivity of ESI. Both methods show very high linearity of the calibration curve in a range of about 3 orders of magnitude of the sample concentration. Copyright © 2014 John Wiley & Sons, Ltd.     

Improvement of window thermal performance using aerogel insulation film for building energy saving

In buildings, windows have a major influence on space heating demand and indoor environment both with respect to climate and daylight. To reduce the window coefficient of the overall heat transmission, we use aerogel. Aerogels have a high surface area, low density, open pore structure, and excellent insulation properties. We mixed pressure sensitive adhesive and aerogel (10, 15, and 20 mass%) using a homogenizer. A mixture of the adhesives and silica aerogels attached film can reduce thermal conductivity. Silica aerogels are characterized by a surface area analyzer (BET), a Fourier transform infrared spectrometer, a thermogravimetry (TG) analyzer, and probe tack method. Thermal conductivity was measured by a TCi thermal conductivity analyzer.     

Preparation of thermal-enhanced epoxy resin adhesive with organic PCM for applying wood flooring

Epoxy resins are well-known materials that show beneficial properties, such as high tensile strength and modulus, good adhesive properties, low cost, and ease of processing and environmental advantages. However, epoxy resin adhesive has no characteristic of thermal storage. Latent heat storage is one of the favorable kinds of thermal energy storage methods considered for energy saving and thermal efficiency in various fields, such as solar air conditioning systems and buildings. So we prepared thermal-enhanced epoxy resin adhesive by using PCM. This paper addresses the effects of n-hexadecane and sodium lauryl sulfate on the thermal properties and chemical properties of epoxy resin adhesive and HEAC, using differential scanning calorimetry, thermal gravimetric analysis, and Fourier transform-infrared spectroscopy. Also, we evaluated the applicability of composite epoxy resin adhesive to wood-based flooring using n-hexadecane, through measurement of bonding strength from universal testing machine analysis.