Induced twisted-grain-boundary phases in the binary mixtures of a cholesteric and a nematic compound

Thermodynamical, optical-texture and dielectric studies have been performed to study the phase diagram of the binary system of 5-cholesten-3β-ol-octanoate and 4-n-nonyloxybenzoic acid. It is observed that low concentrations of 5-cholesten-3β-ol-octanoate (2–30?mol?%) in 4-n-nonyloxybenzoic acid induce a mean-field phase diagram derived by Renn within the framework of the chiral Chen–Lubenski model. Various optical textures of the twisted-grain-boundary (TGB) phases under different conditions of molecular anchoring have been observed. Weak transitions related to the TGB phases have been detected by temperature dependent dielectric spectroscopy.     

Temperature dependence of volume and surface symmetry energy coefficients of nuclei

The thermal evolution of the energies and free energies of a set of spherical and near-spherical nuclei spanning the whole periodic table are calculated in the subtracted finite-temperature Thomas–Fermi framework with the zero-range Skyrme-type KDE0 and the finite-range modified Seyler–Blanchard interaction. The calculated energies are subjected to a global fit in the spirit of the liquid-drop model. The extracted parameters in this model reflect the temperature dependence of the volume symmetry and surface symmetry coefficients of finite nuclei, in addition to that of the volume and surface energy coefficients. The temperature dependence of the surface symmetry energy is found to be very substantial whereas that of the volume symmetry energy turns out to be comparatively mild.     

Oxidative Esterification of Benzaldehyde and Deactivated Aromatic Aldehydes with N-Bromosuccinimide-pyridine

Whereas the oxidative esterification of benzaldehyde to methyl benzoate with N-bromosuccinimide (NBS)-pyridine requires dark conditions and 5 equivalents each of NBS and K₂CO₃ and gave only moderate yield (52%) of the product (McDonald et al. J. Org. Chem. 1989, 54, 1213), simple change of base to pyridine gave the desired product in 83% gas chromatographic yield with only 1 equivalent each of NBS and pyridine. Moreover, the reaction could be conducted without exclusion of light. Aromatic aldehydes bearing electron-withdrawing substituents at meta/para position yielded the corresponding methyl esters in still better yields.

Supplemental materials are available for this article. Go to the publisher's online edition of Synthetic Communications® to view the free supplemental file.     

Structural designing,spectral and computational studies of bioactive Schiff's base ligand and its transition metal complexes

Transition metal complexes of Mn(II) and Ni(II) have been synthesized with novel bioactive Schiff's base ligand. Schiff's base ligand i.e. benzoylacetone‐bis(2‐amino‐4‐methylbenzothioazole) has been synthesized via condensation reaction between 2‐amino‐4‐methylbenzothioazole and benzoylacetone in 2:1 ratio, respectively. Synthesized ligand has been characterized using elemental analysis, infra‐red, ¹H–NMR and mass spectroscopy techniques. Characterization of complexes was based on magnetic moment, molar conductance, elemental analysis, electronic spectra, infra‐red and EPR spectroscopic techniques. Molar conductance data suggest that metal complexes are non‐electrolytic in nature. Therefore, these complexes are formulated as [M(L)X₂], where M = Mn(II), Ni(II), L = Schiff's base ligand, X = Cl^?, CH₃COO^?, NO₃^?. Data of characterization study suggest octahedral geometry for Mn(II) and Ni(II) complexes. Geometry of metal complexes was also optimized with the help of computational study i.e. molecular modelling. Computational study also suggests octahedral geometry for complexes. Free ligand as well as its all metal complexes have been screened against the growth of pathogenic bacteria (E.coli, S.aureus) and fungi (C.albicans, C.krusei, C.parapsilosis, C.tropicalis) to assess their inhibition potential. The inhibition data revealed that metal complexes exhibit higher inhibition potential against the growth of bacteria and fungi microorganisms than free ligand.     

Molecular dynamics investigations on polishing of a silicon wafer with a diamond abrasive

During the final stages of polishing silicon wafers, much of the interactions between silicon and diamond abrasive takes place at the silicon asperities. These interactions, leading to material removal, were investigated in a MD simulation of polishing of a silicon wafer with a diamond abrasive under dry conditions. Simulations were conducted with silicon asperities of different geometries, different abrasive configurations, and polishing speeds. Under the conditions of polishing, the silicon atoms from the asperities were found to bond chemically to the surface of the diamond abrasive. Continued transverse motion of the diamond abrasive (relative to the silicon asperity) leads to tensile pulling, necking, and ultimate separation of the silicon asperity material instead of conventional material removal in polishing (chip formation) involving cutting/ploughing, which takes place in the absence of chemical bonding between the abrasive and the asperity material. This phenomenon has not been reported previously in the literature. The thrust and cutting forces initially increase due to the increase in the number of asperity atoms affected finally reaching a maximum. This is followed by a decrease of these forces due to tensile pulling and formation of individual strings followed by ultimate separation or breakage of the final string. The ratio of thrust force (F _z ) to the cutting force (F _x ), i.e. |(F _z /F _x )| was found to increase continuously to a maximum of ～0.8 followed by continuous decrease to ～0.25. This is in contrast to a more or less constant value of ～2 in the case of tools with rounded radii or tools with large negative rake angles, where material is removed in the form of chips ahead of the tool. Three regions of the asperity have been identified that are useful in the development of a phenomenological model for polishing that enables computation of material removal rates: (1) the region directly in front of the abrasive for which the probability of the removal of an asperity atom is close to unity, (2) the distant region where this probability is nearly zero, and (3) an intermediate region from which the probability of removal is close to half.     

QSAR Study on Binding Affinity of PATs (Rodenticides) to the [3H]-Mepyramine-Labelled H1 Receptor In Rat and Guinea Pig Brain

Abstract

The binding of a series of PAT analogues (rodenticides) to the [³H]-mepyramine-labelled H₁ receptor in rat and guinea pig brain was investigated topologically using negentropy (N), molecular redundancy (MRI), first-order molecular connectivity (¹X _v ), Wiener (W), and Szeged (Sz) indices. Multiple regression analyses showed that MRI provided excellent results upon introduction of indicator parameters. Predictive ability of the proposed models was discussed using cross-validation parameters.     

222Rn measurements in drinking water and annual effective dose for the adult population around a coal-based and atomic power plant in Uttar Pradesh,India

Journal of Radioanalytical and Nuclear Chemistry - Dissolved radon (222Rn) in drinking water has been measured using SMART RnDuo, a continuous radon monitor. Water samples have been collected from...     

Cl insertion on Si(100)-(2x1): etching under conditions of supersaturation

We use scanning tunneling microscopy to show that Cl2 dosing of Cl-saturated Si(100)-(2x1) surfaces at elevated temperature leads to uptake beyond "saturation" and allows access to a new etching pathway. This process involves Cl insertion in Si-Si dimer bonds or backbonds, diffusion of the inserted Cl, and ultimately desorption of SiCl2. Investigations into the etch kinetics reveal that insertion occurs via a novel form of Cl2 dissociative chemisorption that is mediated by dangling bond sites. Upon dissociation, one Cl atom adsorbs at the dangling bond while the other can insert.     

Curing and thermal behaviour of a flame retardant cycloaliphatic epoxy resin based on phosphorus containing poly(amide–imide)s

The curing behaviour of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate was investigated by the dynamic differential scanning calorimetry (DSC) using phosphorus-containing poly(amide–imide)s (PAIs) having free amine groups, 4,4′-diaminodiphenylmethane (PM) and p-phenylenediamine (PA), in the ratio of 1:1. The PAIs were prepared by co-polymerization of diimide–diacid (DIDA) and phosphorus-containing triamines having phenylene moiety. l-Tryptophan and pyromellitic anhydride were used to synthesize DIDA. Triamines used in the synthesis PAIs were tris(3-aminophenyl) phosphine (TAP), tris(3-aminophenyl) phosphine oxide (TAPO) and bis(3-aminophenyl) aminotolyl phosphine (BAP). TAP-, TAPO- and BAP-containing PAIs were designated as PTAP, PTAPO and PBAP, respectively. These PAIs with free amine groups were characterized by FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of PAIs and PM or/and PA in the ratios of 0:1, 1:0 and 0.5:0.5 was used for investigation. DSC was used to study the curing of epoxy by recording the DSC scans at heating rates of 10 °C min^?1. Thermal stability of epoxy resin cured isothermally was evaluated by recording thermo gravimetric traces in nitrogen atmosphere at the heating rate of 20 °C min^?1. All samples are highly stable, and the 10 % mass loss found was in the range of 335–520 °C. The percent char yield was highest in case of resin sample E/PM/PTAPO. The flame-retardant properties of cured epoxy resins were investigated by the limiting oxygen index test (LOI) and UL94 test. When phosphorus was incorporated in epoxy resin, the epoxy resin system met the UL94 V-0 classification and the LOI reached at 37.8, because of nitrogen–phosphorus synergistic effect.