Low Temperature Bonding of Ceramics by Sol-Gel Processing

Sol-gel bonds were produced between smooth, clean silicon or polycrystalline alumina substrates by spin-coating solutions containing partially hydrolysed silicon alkoxides onto both substrates. The two coated substrates were assembled and the resulting sandwich was fired at temperatures ranging from 300 to 600°C. The influence of the sol-gel chemistry on the film microstructure and interfacial fracture energy was investigated using a wide range of techniques, including ellipsometry, FTIR, TG-DTA, rheology, TEM and micro-indentation. For silicon wafers, an optimum water-alkoxide molar ratio of 10 and hydrolysis water pH of 2 were found. Such conditions led to relatively dense films (>90%), resulting in bonds with significantly higher fracture energy (3.5 J/m²) than those obtained using classical water bonding (typically 1.5 J/m²). Aging of the coating solution was found to decrease the bond strength. Poly-crystalline alumina substrates were similarly bonded at 600°C; the optimised silica sol-gel chemistry yielded interfaces with fracture energy of 4 J/m².     

Two modes of electroluminescence from single‐walled carbon nanotubes

The electroluminescence from single‐walled carbon nanotube field effect transistors is spectrally resolved, and shows two distinct modes of light emission. The vast majority of nanotubes have spectrally broad emission consistent with the spectrum of blackbody radiation. Much more rarely, superposed on the broad emission is a single narrow (<50 meV) peak which is consistent with expectation for electron–hole recombination. The narrow emission is strong even at lower biases and in general has greater peak intensity than the broadband emission. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)