3D Uranyl Organic Frameworks Supported by Rigid Octadentate Carboxylate Ligand: Synthesis,Structure Diversity,and Luminescence Properties

Seven three dimensional (3D) uranyl organic frameworks (UOFs), formulated as [NH₄][(UO₂)₃(HTTDS)(H₂O)] ( 1 ), [(UO₂)₄(HTTDS)₂](HIM)₆ ( 2 , IM=imidazole), [(UO₂)₄(TTDS)(H₂O)₂(Phen)₂] ( 3 , Phen=1,10-phenanthroline), [Zn(H₂O)₄]_0.5[(UO₂)₃(HTTDS)(H₂O)₄] ( 4 ), and {(UO₂)₂[Zn(H₂O)₃]₂(TTDS)} ( 5 ), {Zn(UO₂)₂(H₂O)(Dib)_0.5(HDib)(HTTDS)} ( 6 , Dib=1,4-di(1H-imidazol-1-yl)benzene) and [Na]{(UO₂)₄[Cu₃(u₃-OH)(H₂O)₇](TTDS)₂} ( 7 ) have been hydrothermally prepared using a rigid octadentate carboxylate ligand, tetrakis(3,5-dicarboxyphenyl)silicon(H₈TTDS). These UOFs have different 3D self-assembled structures as a function of co-ligands, structure-directing agents and transition metals. The structure of 1 has an infinite ribbon formed by the UO₇ pentagonal bipyramid bridged by carboxylate groups. With further introduction of auxiliary N-donor ligands, different structure of 2 and 3 are formed, in 2 the imidazole serves as space filler, while in 3 the Phen are bound to [UO₂]²⁺ units as co-ligands. The second metal centers were introduced in the syntheses of 4–7 , and in all cases, they are part of the final structures, either as a counterion ( 4 ) or as a component of framework ( 5 − 7 ). Interesting, in 7 , a rare polyoxometalate [Cu₃(μ₃-OH)O₇(O₂CR)₄] cluster was found in the structure. It acts as an inorganic building unit together with the dimer [(UO₂)₂(O₂CR)₄] unit. Those uranyl carboxylates were sufficiently determined by single crystal X-ray diffraction, and their topological structures and luminescence properties were analyzed in detail.     

MODs vs. NPs: Vying for the Future of Printed Electronics

This Minireview compares two distinct ink types, namely metal-organic decomposition (MOD) and nanoparticle (NP) formulations, for use in the printing of some of the most conductive elements: silver, copper and aluminium. Printing of highly conductive features has found purpose across a broad array of electronics and as processing times and temperatures reduce, the avenues of application expand to low-cost flexible substrates, materials for wearable devices and beyond. Printing techniques such as screen, aerosol jet and inkjet printing are scalable, solution-based processes that historically have employed NP formulations to achieve low resistivity coatings printed at high resolution. Since the turn of the century, the rise in MOD inks has vastly extended the range of potentially applicable compounds that can be printed, whilst simultaneously addressing shelf life and sintering issues. A brief introduction to the field and requirements of an ink will be presented followed by a detailed discussion of a wide array of synthetic routes to both MOD and NP inks. Unindustrialized materials will be discussed, with the challenges and outlook considered for the market leaders: silver and copper, in comparison with the emerging field of aluminium inks.