全文获取类型
收费全文 | 232篇 |
免费 | 22篇 |
国内免费 | 18篇 |
专业分类
化学 | 190篇 |
晶体学 | 3篇 |
力学 | 7篇 |
综合类 | 2篇 |
数学 | 38篇 |
物理学 | 32篇 |
出版年
2022年 | 1篇 |
2021年 | 9篇 |
2020年 | 5篇 |
2019年 | 5篇 |
2018年 | 4篇 |
2017年 | 3篇 |
2016年 | 14篇 |
2015年 | 12篇 |
2014年 | 13篇 |
2013年 | 22篇 |
2012年 | 30篇 |
2011年 | 17篇 |
2010年 | 15篇 |
2009年 | 10篇 |
2008年 | 14篇 |
2007年 | 10篇 |
2006年 | 12篇 |
2005年 | 8篇 |
2004年 | 7篇 |
2003年 | 11篇 |
2002年 | 5篇 |
2001年 | 8篇 |
2000年 | 5篇 |
1999年 | 9篇 |
1998年 | 2篇 |
1996年 | 4篇 |
1994年 | 4篇 |
1993年 | 4篇 |
1991年 | 1篇 |
1990年 | 1篇 |
1989年 | 2篇 |
1988年 | 1篇 |
1986年 | 1篇 |
1985年 | 1篇 |
1983年 | 2篇 |
排序方式: 共有272条查询结果,搜索用时 656 毫秒
81.
82.
Quoc Dat Nghiem Chi Thanh Nguyen Dong‐Pyo Kim 《Journal of polymer science. Part A, Polymer chemistry》2008,46(13):4594-4601
High molecular weight poly(vinyl)silazane were synthesized successfully by reversible addition fragmentation chain transfer (RAFT) polymerization in toluene at 120 °C, using dithiocarbamate derivatives and 2,2′‐azobis‐isobutyrylnitrile (AIBN) as the RAFT agents and thermal initiator, respectively. The polymerization of a vinylcyclicsilazane oligomer with 82.5% conversion was readily controlled to increase the molecular weight from 1000 to 12,000 g/mol with a narrow polydispersity <1.5. The resulting polymer showed a high ceramic yield of 70 wt % at 1000 °C. Moreover, the approach was extended successfully to the synthesis of poly(vinyl)silazane‐block‐polystyrene as an inorganic–organic diblock copolymer. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4594–4601, 2008 相似文献
83.
A theoretical model was developed to evaluate the reduction of structure-borne noise generated by an axially symmetric ring force which is applied on the interior of the cylindrical shell. The vibrating cylindrical shell is coated with a microvoided elastomer that is acoustically soft material designed for the reduction of the generated noise. The analytical model is a two-layer shell structure comprised of a cylindrical shell and an outer layer (coating) that is perfectly bonded to the cylindrical shell. The outer and inner surfaces of the coated shell are in contact with water and air, respectively. The analysis for this problem is based on the theory of elasticity, acoustic wave equations, and pertinent boundary conditions. Effects of various parameters such as coating thickness and material properties on the noise reductions are presented. 相似文献
84.
Synthesis and properties of UV curable polyvinylsilazane as a precursor for micro‐structuring
下载免费PDF全文
![点击此处可从《先进技术聚合物》网站下载免费的PDF全文](/ch/ext_images/free.gif)
Photosensitive acrylated polyvinylsilazanes were prepared by reacting a diacrylate containing compound, 1,1‐bis (acryloyloxyethyl) ethyl isocyanate (BAEI), with polyvinylsilazane (PVSZ) and utilized as an inorganic photoresist for generating SiCN‐based ceramic microstructures. The acrylate‐modified polymers (m‐PVSZ) were characterized by 1H‐NMR, 13C‐NMR and FT‐IR methods to determine the chemical reaction mechanism. Differential photo‐calorimeter and FT‐IR analysis were employed to examine its photosensitive properties. Line patterns were fabricated by a UV nano‐imprinting method; multi‐layered octagon structures were fabricated by a two‐photon absorption stereolithography process. The results indicate that m‐PVSZ is quite a novel inorganic photoresist for the fabrication of micro ceramic structures. Copyright © 2015 John Wiley & Sons, Ltd. 相似文献
85.
86.
Dr. Chi Kyung Kim Taeho Kim In‐Young Choi Min Soh Dr. Dohoung Kim Young‐Ju Kim Dr. Hyunduk Jang Hye‐Sung Yang Dr. Jun Yup Kim Dr. Hong‐Kyun Park Dr. Seung Pyo Park Sangseung Park Dr. Taekyung Yu Prof. Byung‐Woo Yoon Prof. Seung‐Hoon Lee Prof. Taeghwan Hyeon 《Angewandte Chemie (International ed. in English)》2012,51(44):11039-11043
87.
E. M. Choi Y. H. Cui S. H. Kwon A. R. Kim H. S. Choi S. J. Lee S. G. Pyo 《固体物理学:研究快报》2014,8(2):146-149
We report the development of a Ti–Ti bonding process at a low bonding temperature below 200 °C using chemically surface‐activated Ti thin films and a reliable evaluation method for measuring the Ti–Ti bond strength by means of atomic force microscopy (AFM). Using Ti as an interlayer enables void‐free bonding because Ti exhibits fast diffusion and oxide solubility. On the other hand, wafer bonding is an important processing step for 3D circuit integration that requires a high reliability of the process. However, the reliability of bonding‐strength values obtained by employing conventional measurement devices is limited by comparably large measurement errors and restricted the availability of suitable sample material. In this study, the use of AFM to measure the bonding strength is proposed. The interfacial bonding properties depend on the Ti deposition parameters. A bonding temperature of 200 °C was found to be appropriate for the development of a low bonding temperature wafer‐bonding process. The pretreatment methods like plasma activation and chemical activation at 200 °C result in a Ti bonding strength of approximately 8.22 J/m2, sufficient for applications in 3D circuit integration. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim) 相似文献
88.
89.
The Landau levels of scalar QED undergo continuous transitions under a homogeneous, time-dependent magnetic field. We analytically formulate the Klein–Gordon equation for a charged spinless scalar as a Cauchy initial value problem in the two-component first order formalism and then put forth a measure that classifies the quantum motions into the adiabatic change, the nonadiabatic change, and the sudden change. We find the exact quantum motion and calculate the pair-production rate when the magnetic field suddenly changes as a step function. 相似文献
90.