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941.
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944.
本文讨论了冲击波后温度弛豫的理论方法。和R. Grover及P.A. Urtiew不同,采用了非傅里叶热传导理论,结果和实验十分符合,而实验结果用傅里叶热传导理论是无法解释的。当时间趋于无穷时,这两种方法的结果又趋于一致,文章中作了物理原因的解释。 相似文献
945.
946.
叙述微通道板的噪声,着重介绍微通道板固定图案噪声及其简便新颖而又实用的一种测试方法,给出测试结果并进行分析。 相似文献
947.
Qian-Qian Luo Chuan-Tao Zheng Xiao-Liang Huang Lei Liang Da-Ming Zhang Yi-Ding Wang 《Optical and Quantum Electronics》2013,45(9):999-1015
Generic model and thorough investigation are proposed for a novel $1\times 2$ 1 × 2 polymer electro-optic (EO) switch based on one-group $2N+1$ 2 N + 1 vertical-turning serial-coupled microrings. For realizing boxlike flat spectrum as well as low crosstalk and insertion loss, resonance order and coupling gaps are optimized. The MRR switches with $N \ge 1$ N ≥ 1 reveal favorable boxlike spectrum as when compared with the simple device with only one microring ( $N = 0$ N = 0 ). For obtaining $<-30\,\text{ dB }$ < - 30 dB crosstalk under through-state, the dependency of switching voltage on $N$ N is determined as $7.19 \times \text{ exp }(-N/0.72) + 1.72\,(\text{ V })$ 7.19 × exp ( - N / 0.72 ) + 1.72 ( V ) . Under the operation voltages of 0 V (drop state) and the predicted switching voltages (through state), the device performances are analyzed, and $1 \le N \le 10$ 1 ≤ N ≤ 10 is required for dropping the insertion loss (drop state) below 10 dB. The crosstalk of the ten devices ( $N = 1-10$ N = 1 - 10 ) are $< -19.5\,\text{ dB }$ < - 19.5 dB under drop state and $< -28.7\,\text{ dB }$ < - 28.7 dB under through state, and the insertion losses of the devices ( $N = 1-10$ N = 1 - 10 ) are $< 9.715\,\text{ dB }$ < 9.715 dB under drop state and $< 1.573\,\text{ dB }$ < 1.573 dB under through state. The device also has ultra-compact footprint size of only 0.33–1.06 mm, which is only 1/10–1/3 of those of our previously reported polymer EO switches based on directional coupler or Mach–Zehnder interferometer structures. Therefore, the proposed device is capable of highly integration onto optical networks-on-chip. 相似文献
948.
H. J. Zhang S. Z. Zhao K. J. Yang G. Q. Li D. C. Li J. Zhao 《Applied physics. B, Lasers and optics》2013,112(2):185-192
Using electro-optic (EO) modulator and GaAs saturable absorber, a diode-pumped doubly Q-switched and mode-locked (QML) YVO4/Nd:YVO4 laser at 1.06 μm is realized. The experimental results show that the number of the mode-locking pulses underneath the Q-switched envelope decreased with increasing pump power. With an output coupling of 6.5 %, the single mode-locking pulse underneath the Q-switched envelope with 1 kHz repetition rate was obtained when the pump power exceeded 4.65 W. At a pump power of 8.25 W for an output coupling of 10 %, a stable mode-locking pulse train at a repetition rate of 1 kHz was achieved with pulse energy as high as 582 μJ and pulse duration of about 580 ps, corresponding to a peak power of 1 MW. Using a hyperbolic secant square function and considering the Gaussian distribution of the intracavity photon density, the coupled rate equations for diode-pumped doubly QML YVO4/Nd:YVO4 laser are given and the numerical solutions of the equations are basically in accordance with the experimental results. 相似文献
949.
W. C. Ren B. Liu Z. T. Song X. Z. Jing B. C. Zhang Y. H. Xiang H. B. Xiao J. Xu G. P. Wu R. J. Qi S. Q. Duan Q. Q. Yu S. L. Feng 《Applied Physics A: Materials Science & Processing》2013,112(4):999-1002
The gap filling of phase change material has become a critical module in the fabrication process of phase change random access memory (PCRAM) as the device continues to scale down to 45 nm and below. However, conventional physical vapor deposition process cannot meet the nanoscale gap fill requirement anymore. In this study, we found that the pulsed deposition followed by inductively coupled plasma etching process showed distinctly better gap filling capability and scalability than single-step deposition process. The gap filling mechanism of the deposit–etch–deposit (DED) process was briefly discussed. The film redeposition during etching step was the key ingredient of gap filling improvement. We achieved void free gap filling of phase change material on the 30 nm via with aspect ratio of 1:1 by two-cycle DED process. The results provided a rather comprehensive insight into the mechanism of DED process and proposed a potential gap filling solution for 45 nm and below technology nodes for PCRAM. 相似文献
950.