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受端区二次流的影响,叶片前缘和压力面根部角区端壁难以实现有效冷却。为了实现该区域的冷气覆盖,本文研究了新型冷却结构离散台阶缝的端区气膜冷却特性。离散台阶缝在叶片周向主要覆盖叶片前缘区域,能够集中冷气冷却换热恶劣的区域。本文研究了两种不同离散台阶缝轴向位置(AP1,AP2)和三种不同冷气量(MFR=0.43%,0.88%,1.33%),通过红外热像仪测量端区气膜冷却效率分布。结果表明,增加离散台阶缝与叶片的轴向距离,能够有效提高叶片上游区域的冷却效果,但在通道内部,结果相反。增加冷气量能够提高端壁的气膜冷却效果。此外,应用五孔探针测量叶栅通道喉部附近截面二次流流场特征,解释了通道冷却分布的机理。 相似文献
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We present a new concept of the microfluidic super-resolution near-field structure (MSRENS) based on a microfluidic structure and a super-resolution near-field structure. The near-field distance control, “nano-probe” and scanning can be realized simultaneously using the MSRENS, which is similar to a near-field scanning optical microscope. The design and simulation results are presented. Numerical simulation has demonstrated that the MSRENS with spatial resolution beyond the diffraction limit could be applicable in chemistry, biologics, and many other fields. 相似文献
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The effects of temperature on a surface plasmon studied experimentally and theoretically. SPR resonance (SPR) sensor in Kretschmann configuration are experiments are carried out over a temperature range of 278- 313 K in steps of 5 K. A detailed theoretical model is provided to analyze the variation of performance with varying temperature of the sensing environment. The temperature dependence of the properties of the metal, dielectric, and analyte are studied, respectively. The numerical results indicate that the predictions of the theoretical model are well consistent with the experiment data. 相似文献
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A high voltage silicon-on-insulator lateral insulated gate bipolar transistor with a reduced cell-pitch
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A high voltage( 600 V) integrable silicon-on-insulator(SOI) trench-type lateral insulated gate bipolar transistor(LIGBT) with a reduced cell-pitch is proposed.The LIGBT features multiple trenches(MTs):two oxide trenches in the drift region and a trench gate extended to the buried oxide(BOX).Firstly,the oxide trenches enhance electric field strength because of the lower permittivity of oxide than that of Si.Secondly,oxide trenches bring in multi-directional depletion,leading to a reshaped electric field distribution and an enhanced reduced-surface electric-field(RESURF) effect.Both increase the breakdown voltage(BV).Thirdly,oxide trenches fold the drift region around the oxide trenches,leading to a reduced cell-pitch.Finally,the oxide trenches enhance the conductivity modulation,resulting in a high electron/hole concentration in the drift region as well as a low forward voltage drop(Von).The oxide trenches cause a low anode-cathode capacitance,which increases the switching speed and reduces the turn-off energy loss(Eoff).The MT SOI LIGBT exhibits a BV of 603 V at a small cell-pitch of 24 μm,a Von of 1.03 V at 100 A/cm-2,a turn-off time of 250 ns and Eoff of 4.1×10?3 mJ.The trench gate extended to BOX synchronously acts as dielectric isolation between high voltage LIGBT and low voltage circuits,simplifying the fabrication processes. 相似文献
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A low on-resistance(Ron,sp) integrable silicon-on-insulator(SOI) n-channel lateral double-diffused metal-oxide-semiconductor(LDMOS) is proposed and its mechanism is investigated by simulation.The LDMOS has two features:the integration of a planar gate and an extended trench gate(double gates(DGs));and a buried P-layer in the N-drift region,which forms a triple reduced surface field(RESURF)(TR) structure.The triple RESURF not only modulates the electric field distribution,but also increases N-drift doping,resulting in a reduced specific on-resistance(Ron,sp) and an improved breakdown voltage(BV) in the off-state.The DGs form dual conduction channels and,moreover,the extended trench gate widens the vertical conduction area,both of which further reduce the Ron,sp.The BV and Ron,sp are 328 V and 8.8 m.cm2,respectively,for a DG TR metal-oxide-semiconductor field-effect transistor(MOSFET) by simulation.Compared with a conventional SOI LDMOS,a DG TR MOSFET with the same dimensional device parameters as those of the DG TR MOSFET reduces Ron,sp by 59% and increases BV by 6%.The extended trench gate synchronously acts as an isolation trench between the high-voltage device and low-voltage circuitry in a high-voltage integrated circuit,thereby saving the chip area and simplifying the fabrication processes. 相似文献
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A Tapping—Mode Tuning Fork with a Short Fibre Probe Sensor for a Near—Field Scanning Optical Microscope
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We report on a tapping-mode tuning fork with a short fibre probe sensor for a near-field scanning optical microscope.The method demonstrates how to fabricate the short fibre probe.This tapping-mode tuning fork with a short fibre probe can provide stable and high Q at the tapping frequency of the tuning fork,and can give high-quality near-field scanning optical microscope and atomic force microscope images of samples.We present the results of using the tapping-mode tuning fork with a short fibre probe sensor for a near-field scanning optical microscope performed on an eight-channel silica waveguide. 相似文献