Vibrational Spectroscopic Study on Ion Solvation and Association of Lithium Perchlorate in 4-Methoxymethyl-ethylene Carbonate

Solvation interaction and ion association in solutions of lithium perchlorate/4-methoxymethyl-ethylene carbonate （MEC） have been studied by using Infrared and Raman spectra as a function of concentration of lithium perchlorate. The splitting of ring deformation band and ring ether asymmetric stretching band, and the change of carbonyl stretching band suggest that there should be a strong interaction between Li^＋ and the solvent molecules, and the site of solvation should be the oxygen atom of carbonyl group. The apparent solvation number of Li^＋ was calculated by using band fitting technique. The solvation number was decreased from 3.3 to 1.1 with increasing the concentration of LiClO4/MEC solutions. On the other hand, the band fitting for the ClO4^- band revealed the presence of contact ion pair, and free ClO4^- anion in the concentrated solutions.     

氧化锡表面的原子簇模型计算

Cluster models of SnO2(110) face and oxygen vacancies and oxygen adsorption on its surface have been calculated by EHMO method. The results show that a tin atom with a coordination number of four is the adsorption center, because the total energy of cluster model becomes lower when an oxygen atom adsorpts on the tin atom with a coordination number of four. The tin atom with this coordination number gains and loses electrons more easily than tin atoms with a coordination number of five. All tin atoms in the cluster of SnO2(110) face are Sn4+.     

欧盟拟就特殊人群食品要求出台新规

据新欧洲(NEWEUROPE)消息，欧洲议会公共卫生委员会就修改特殊食品标签及其内容有关要求达成一致意见。新要求将普通食品与特殊用途食品进行区分，包括低卡路里食品。     

新方法可更精确测定木制文物年代

据日本媒体报道，日本科学家开发的一种新方法能精确测定遗址或文物所使用木材的年龄。这种方法不分树种，只需少量木材样本，就能精确到以年为单位。     

封装对大功率半导体激光器阵列热应力及Smile的影响

提出一种采用双铜-金刚石的"三明治"封装结构,利用有限元分析方法研究了其与传统的Cu+Cu W硬焊料封装结构激光器的热应力与Smile.对比模拟结果发现新封装结构热应力降低43.8%,Smile值增加95%.在次热沉热膨胀系数与芯片材料匹配的情况下,使用弹性模量更大的次热沉材料,可对芯片层热应力起到更好的缓冲作用.以硬焊料封装结构为例,分析了负极和次热沉厚度对器件Smile的影响.结果表明负极片厚度从50μm增加到300μm,器件工作结温降低2.26℃,Smile减小0.027μm,芯片的热应力增加22.95 MPa.当次热沉与热沉的厚度比小于29%时,Smile随次热沉厚度增加而增加;而当次热沉厚度超过临界点后,Smile随次热沉厚度增加而减小.当次热沉厚度达到临界点(2300μm)时,硬焊料封装的半导体激光器具有最大的Smile值3.876μm.制备了Cu W厚度分别为300μm和400μm的硬焊料封装976 nm激光器,并测量了其发光光谱.通过对比峰值波长漂移量,发现Cu W厚度增加了100μm,波长红移增加了1.25 nm,根据温度和应力对波长的影响率可知应力减小了18.05 MPa.测得两组器件的平均Smile值分别为0.904μm和1.292μm.实验证明增加Cu W厚度可减小芯片所受应力,增大Smile值.     

Ni/TPC催化剂的制备、表征及在秸秆热解燃气重整中的应用

以废弃汽车外轮胎热解后的副产物轮胎热解焦（Tyre pyrolysis char，TPC）为原料，利用均匀沉淀法制备以轮胎焦为载体的负载型Ni/TPC催化剂，采用EDX、SEM、XRD、TG、BET手段对催化剂进行了表征与分析，同时使用管式炉测试了Ni/TPC催化剂在秸秆热解燃气重整中的催化性能，并考察了热解温度、保温时间、镍负载量及催化时间对秸秆热解燃气重整效果的影响。研究结果表明，TPC富含焦和金属，Ni/TPC催化剂分散均匀，热稳定性好，比表面积为62 m²/g。催化剂活性测试显示，Ni/TPC催化剂用于作物秸秆热解燃气重整具有很强的催化活性，可显著提高燃气中可燃气体含量；热解温度在750℃、保温时间10 min、30%的Ni负载量时Ni/TPC催化剂的催化效率最高，连续使用850 min后，燃气中的H₂含量仍相对提高到50%以上，长时间使用后活性结构由Ni₃ZnC_0.7转变成FeNi₃，催化活性依然较强且趋于稳定，TPC可以作为良好的新型镍基催化剂载体。