Laser-Induced Graphene Conductive Fabric Decorated with Copper Nanoparticles for Electromagnetic Interference Shielding Application

To meet the demands for flexible electromagnetic interference(EMI) shielding materials, a type of conductive fabric is prepared by generating three-dimensional(3D) porous laser-induced graphene(LIG) in situ on the surface of the aramid fabric(AF) and then electroless plating copper. After LIG treatment, the porous AF demonstrates admirable conductivity due to the generation of graphene. The superior surface resistance of the conductive fabric can reach 1.57 Ω/sq after copper deposition, and the ...     

一种高可靠性金属镀层FR-4导电复合材料的制备

5G通讯技术对基站的可靠性要求越来越高。本文选用玻璃布基板(FR-4)基材作为印制电路(PCB)基底，通过简单高效的化学镀技术在其表面沉积金属，得到具有高可靠性金属镀层的FR-4导电复合材料。在本研究中，将3-氨基丙基三乙氧基硅烷偶联剂(KH550)和3-(2,3-环氧丙氧)丙基甲基二甲氧基硅烷偶联剂(KH562)引入氯金酸溶液中，制备了金纳米颗粒/聚合物刷(AuNPs/PB)催化溶液。KH562中的环氧基经开环反应与KH550中的氨基形成仲氨基和羟基，通过螯合作用吸附AuNPs,从而在FR-4基材表面建立较高结合强度的催化层。此外，还研究了KH562浓度对金属层结合力的影响，结果表明：当KH562浓度为10%时，AuNPs的吸附效果最好。以生成的AuNPs/PB为催化中心，通过化学镀技术可以在其表面沉积金属层得到高可靠性的导电复合材料。