基于垂直结构的有机光发射晶体管制备与性能研究

制备了一种有机垂直光发射晶体管, 兼具有机发光二极管的发光和晶体管的开关调节两个功能.其结构为一个有机发光单元垂直堆叠在一个电容单元上,两单元通过一个共有的源电极连在一起.当电容单元被充电时,积累在源电极的电荷能有效地调节源极与有机层之间的载流子注入势垒,从而达到控制源漏输出电流的大小,最终控制发光单元发光的强度.实验结果表明,器件可提供02 mA的输出电流,其大小可驱动发光单元发光,工作电压（开启电压）为6 V.这种垂直集成方案,实现了器件多功能化,为有机发光二极管有源矩阵驱动的实际应用提供了一种新的解决方法. 关键词： 有机光发射晶体管 垂直 电容     

基于有限元方法的有机场效应晶体管特性模拟与实验验证

采用有限元方法,借助多物理场软件COMSOL模拟了底栅顶接触结构有机场效应晶体管电位和载流子浓度随源漏电压Vds的变化。模拟结果表明,当固定栅压V_g=-10 V时,改变V_(ds)从0~-10 V,对于电位分布,从栅极到源漏电极竖直方向有渐进的变化,而从源极到漏极的水平方向呈现由大到小明显的梯度变化。对于载流子浓度,观察到沟道处从源极向漏极逐渐减少,在靠近漏极的区域减少得尤为明显,而当源漏电压等于栅极电压时,产生夹断现象。进一步将模拟结果与实际制备的器件性能进行了对比,模拟结果与实验数据所显示的分布趋势大体相同,印证了模拟的合理性。由此表明,采用模拟方法分析有机场效应晶体管的器件特性,对于实际制备器件具有重要的指导意义。     

基于NPB的垂直构型有机发光晶体管的光电特性研究

通过将有机空穴阻挡材料BCP薄层插入垂直构型有机发光晶体管器件ITO/NPB（40nm）/Al（30nm）/NPB（20nm）/Alq₃（55nm）/Al中的不同位置对器件光电特性的影响来研究器件漏电流较大的原因以及器件中具体的载流子过程.充分证明了栅极注入的空穴对沟道中的电流有贡献.进而通过用LiF薄层修饰漏极来增强电子的注入并减小漏电流,得到了相对稳定的发光晶体管器件,其发光强度有很大提高并可很好地由栅极电压来进行调控.更换发光材料层容易得到不同颜色的发光晶体管. 关键词： 垂直构型有机发光晶体管（VOLET） 静电感应晶体管（SIT） N')" href="#">NPB （N N′-diphenyl-N')" href="#">N′-diphenyl-N N′-bis（1-naphtyl）-1')" href="#">N′-bis（1-naphtyl）-1 1′-biphenyl-4     

高功率微波作用下高电子迁移率晶体管的损伤机理

本文针对高电子迁移率晶体管在高功率微波注入条件下的损伤过程和机理进行了研究,借助SentaurusTCAD仿真软件建立了晶体管的二维电热模型,并仿真了高功率微波注入下的器件响应.探索了器件内部电流密度、电场强度、温度分布以及端电流随微波作用时间的变化规律.研究结果表明,当幅值为20 V,频率为14.9 GHz的微波信号由栅极注入后,器件正半周电流密度远大于负半周电流密度,而负半周电场强度高于正半周电场.在强电场和大电流的共同作用下,器件内部的升温过程同时发生在信号的正、负半周内.又因栅极下靠近源极侧既是电场最强处,也是电流最密集之处,使得温度峰值出现在该处.最后,对微波信号损伤的高电子迁移率晶体管进行表面形貌失效分析,表明仿真与实验结果符合良好.     

离子凝胶薄膜栅介石墨烯场效应管

在石墨烯场效应晶体管栅介结构中引入具有良好电容特性或极化特性的材料可改善晶体管性能.本文采用化学气相沉积制备的石墨烯并以PVDF-[EMIM]TF2N离子凝胶薄膜(ion-gel film)作为介质层制备底栅型石墨烯场效应管(graphene-based field effect transistor, GFET),研究其电学特性以及真空环境和温度对GFET性能的影响.结果表明离子凝胶薄膜栅介石墨烯场效应晶体管表现出良好的电学特性,室温空气环境中,与SiO_2栅介GFET相比, ion-gel膜栅介GFET开关比(J_(on)/J_(off))和跨导(g_m)分别提高至6.95和3.68×10~(–2) mS,而狄拉克电压(V_(Dirac))低至1.3 V;真空环境下ion-gel膜栅介GFET狄拉克电压最低可降至0.4 V;随着温度的升高, GFET的跨导最高可提升至6.11×10~(–2) mS.     

柔性有机发光二极管柔性电极薄膜的研究进展

柔性有机发光二极管(FOLED)具有机械柔韧性好、低功耗、驱动电压低、高色域、宽视角、响应速度快等优点,在柔性显示、柔性照明、可穿戴设备等方面显示了广阔的应用前景。虽然柔性OLED研究与应用已经有了很大程度的进展,但要实现产业化,稳定性、效率及其电极等方面都需要进一步完善。本文介绍了柔性衬底与导电电极的制备及处理方法,并对柔性OLED的发展趋势进行了展望。     

Fabrication of substrate-free double-side emitting flexible device based on silver nanowire-polymer composite electrode

Flexible light emitting diodes are a promising component for future electronic devices, but require a simple structure and fast fabrication method. Organic light emitting diodes are a viable option as they are lightweight, thin, and flexible. However, they currently have costly fabrication procedures, complicated structures, and are sensitive to water and oxygen, which hinder widespread application. Here, we present a novel approach to fabricate flexible light emitting devices by employing Ag nanowire/polymer composite electrodes and ZnS phosphor particles. The composite electrode was fabricated using inverted layer processing, and used as both a bottom electrode and a dielectric layer. The high mechanical stability of the composite allowed the device to be free standing and mechanically flexible, eliminating the need for any additional support. Using Ag nanowires in both the top and bottom electrodes made a double-sided light emitting device that could be applied to wearable lightings or flexible digital signages.     

InGaZnO薄膜晶体管泄漏电流模型

研究了非晶氧化锌镓铟薄膜晶体管(amorphous InGaZnO thin-film transistor,InGaZnO TFT)的泄漏电流模型.基于Poole-Frenkel热发射效应和热离子场致发射效应的泄漏电流产生机制,分别得到了高电场和低电场条件下的载流子产生-复合率.在此基础上推导得到了InGaZnO TFT的分段式泄漏电流-电压数学模型,并利用平滑函数得到了关断区和亚阈区连续统一的泄漏电流模型.所提出的泄漏电流模型的计算值和TCAD模拟值与实验结果较为吻合.利用所提出的InGaZnO TFT泄漏电流模型和TCAD模拟,讨论了InGaZnO TFT不同的沟道宽度、沟道长度和栅介质层厚度对泄漏电流值的影响.研究结果对InGaZnO TFT集成传感电路的设计具有一定参考价值.     

Comparative studies of Ge and Si p-channel metal-oxide-semiconductor field-effect-transistors with HfSiON dielectric and TaN metal gate

Ge and Si p-channel metal--oxide--semiconductor field-effect-transistors (p-MOSFETs) with hafnium silicon oxynitride (HfSiON) gate dielectric and tantalum nitride (TaN) metal gate are fabricated. Self-isolated ring-type transistor structures with two masks are employed. W/TaN metal stacks are used as gate electrode and shadow masks of source/drain implantation separately. Capacitance--voltage curve hysteresis of Ge metal--oxide--semiconductor (MOS) capacitors may be caused by charge trapping centres in GeO7340Q, 7325http://cpb.iphy.ac.cn/CN/10.1088/1674-1056/19/5/057302https://cpb.iphy.ac.cn/CN/article/downloadArticleFile.do?attachType=PDF&id=111774Ge substrate, transistor, HfSiON, hole mobilityProject supported by the National Basic Research Program of China (Grant No.~2006CB302704).Ge and Si p-channel metal--oxide--semiconductor field-effect-transistors (p-MOSFETs) with hafnium silicon oxynitride (HfSiON) gate dielectric and tantalum nitride (TaN) metal gate are fabricated. Self-isolated ring-type transistor structures with two masks are employed. W/TaN metal stacks are used as gate electrode and shadow masks of source/drain implantation separately. Capacitance--voltage curve hysteresis of Ge metal--oxide--semiconductor (MOS) capacitors may be caused by charge trapping centres in GeO$_{x}$ ($1Ge;substrate;transistor;HfSiON;hole;mobilityGe and Si p-channel metal-oxide-semiconductor field-effect-transistors(p-MOSFETs) with hafnium silicon oxynitride(HfSiON) gate dielectric and tantalum nitride(TaN) metal gate are fabricated.Self-isolated ring-type transistor structures with two masks are employed.W/TaN metal stacks are used as gate electrode and shadow masks of source/drain implantation separately.Capacitance-voltage curve hysteresis of Ge metal-oxide-semiconductor(MOS) capacitors may be caused by charge trapping centres in GeOx(1 < x < 2).Effective hole mobilities of Ge and Si transistors are extracted by using a channel conductance method.The peak hole mobilities of Si and Ge transistors are 33.4 cm2/(V.s) and 81.0 cm2/(V.s),respectively.Ge transistor has a hole mobility 2.4 times higher than that of Si control sample.     

Influence of high energy electron irradiation on the characteristics of polysilicon thin film transistors

The influence of high energy electron (23 MeV) irradiation on the electrical characteristics of p-channel polysilicon thin film transistors (PSTFTs) was studied. The channel 220 nm thick LPCVD (low pressure chemical vapor deposition) deposited polysilicon layer was phosphorus doped by ion implantation. A 45 nm thick, thermally grown, SiO2 layer served as gate dielectric. A self-alignment technology for boron doping of the source and drain regions was used. 200 nm thick polysilicon film was deposited as a gate electrode. The obtained p-channel PSTFTs were irradiated with different high energy electron doses. Leakage currents through the gate oxide and transfer characteristics of the transistors were measured. A software model describing the field enhancement and the non-uniform current distribution at textured polysilicon/oxide interface was developed. In order to assess the irradiation-stimulated changes of gate oxide parameters the gate oxide tunneling conduction and transistor characteristics were studied. At MeV dose of 6×10¹³ el/cm², a negligible degradation of the transistor properties was found. A significant deterioration of the electrical properties of PSTFTs at MeV irradiation dose of 3×10¹⁴ el/cm² was observed.     

Electroluminescence with micro-watt output from ultra-small sized Si quantum dots/amorphous SiO2 multilayers prepared by laser crystallization method

We report the fabrication of Si quantum dots (QDs)/SiO₂ multilayers by using KrF excimer laser (248 nm) crystallization of amorphous Si/SiO₂ multilayered structures on ITO coated glass substrates. Raman spectra and transmission electron microscopy demonstrate the formation of Si QDs and the size can be controlled as small as 1.8 nm. After laser crystallization, Al electrode is evaporated to obtain light emitting devices and the room temperature electroluminescence (EL) can be detected with applying the DC voltage above 8 V on the top gate electrode. The luminescent intensity increases with increasing the applied voltage and the micro-watt light output is achieved. The EL behaviors for samples with different Si dot sizes are studied and it is found that the corresponding external quantum efficiency is significantly enhanced in sample with ultra-small sized Si QDs.     

有机电致发光白光器件的研究进展

在十多年的时间里,有机电致发光二极管(Organic Lightemitting Diodes,OLEDs)的研究和应用取得了长足的进展。有机电致发光器件具有许多优点,例如:自发光、视角宽、响应快、发光效率高、温度适应性好、生产工艺简单、驱动电压低、能耗低、成本低等,因此有机电致发光器件极有可能成为下一代的平板显示终端。有机电致发光白光器件因为可以用于全彩色显示和照明,已成为OLED研究中的热点。介绍了有机电致发光白光器件的研究进展,按发光的性质将白光器件分为荧光器件和磷光器件两类,按发光层数将白光器件分为单层和多层器件,对相关材料、器件结构、发光机理等方面进行了讨论。     

发光层掺杂对红光OLED性能影响研究

制备高效率、高亮度的红光有机发光二极管是显示器实现全彩色的关键,对高性能的红光有机发光二极管器件研究具有十分重要的意义.本文主要研究了掺杂剂(DCJTB)浓度对红光有机发光二极管性能影响.实验采用真空热蒸镀的方法,选取结构为ITO／2-TNATA(20 nm)/NPB(30 nm)/AlQ(50 nm):(X%)DCJTB／AlQ(30 nm)／LiF(0.8 nm)／Al(100 nm)的红光器件,在高准确度膜厚控制仪的监控下,实现了有机薄膜功能材料的精确蒸镀.研究表明:红光掺杂剂掺杂浓度为(2.5~3.0)%时,在12 V电压下,可以得到发光亮度最高达到8 900 cd/m²,发光效率大于2.8 cd/A,且发光光谱波长为610~618 nm较为理想的红光有机发光二极管器件.     

高电子迁移率晶体管放大器高功率微波损伤机理

在TCAD半导体仿真环境中,建立了0.25 m栅长的AlGaAs/InGaAs高电子迁移率晶体管(HEMT)低噪声放大器与微波脉冲作用的仿真模型,基于器件内部的电场强度、电流密度和温度分布的变化,研究了1 GHz的微波从栅极和漏极注入的损伤机理。研究结果表明,从栅极注入约40.1 dBm的微波时,HEMT内部峰值温度随着时间的变化振荡上升,最终使得器件失效,栅下靠源侧电流通道和强电场的同时存在使得该位置最容易损伤;从漏极注入微波时,注入功率的高低会使器件内部出现不同的响应过程,注入功率存在一个临界值,高于该值,器件有可能在第一个周期内损伤,损伤位置均在漏极附近。在1 GHz的微波作用下,漏极注入比栅极注入更难损伤。     

Electrical in‐situ characterisation of interface stabilised organic thin‐film transistors

We report on the electrical in‐situ characterisation of organic thin film transistors under high vacuum conditions. Model devices in a bottom‐gate/bottom‐contact (coplanar) configuration are electrically characterised in‐situ, monolayer by monolayer (ML), while the organic semiconductor (OSC) is evaporated by organic molecular beam epitaxy (OMBE). Thermal SiO₂ with an optional polymer interface stabilisation layer serves as the gate dielectric and pentacene is chosen as the organic semiconductor. The evolution of transistor param‐ eters is studied on a bi‐layer dielectric of a 150 nm of SiO₂ and 20 nm of poly((±)endo,exo‐bicyclo[2.2.1]hept‐5‐ene‐2,3‐dicarboxylic acid, diphenylester) (PNDPE) and compared to the behaviour on a pure SiO₂ dielectric. The thin layer of PNDPE, which is an intrinsically photo‐patternable organic dielectric, shows an excellent stabilisation performance, significantly reducing the calculated interface trap density at the OSC/dielectric interface up to two orders of magnitude, and thus remarkably improving the transistor performance. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

基于数据线控制发光的A-IGZO薄膜晶体管集成AMOLED像素电路

本文提出了一种采用铟镓锌氧化物（IGZO）薄膜晶体管（TFT）的有源矩阵有机发光二极管（AMOLED）显示器的新型补偿结构。它利用数据线关闭电源和驱动晶体管之间的控制晶体管,以抑制编程期间的泄漏电流。在所提出的电路和传统电路之间进行电路性能的比较,表明所提出的像素电路可以有效地补偿驱动晶体管的阈值电压偏移和迁移率变化。当V_TH飘移2 V和μ增加30%时,I_OLED误差率可以分别降低至小于5%和9%。此外,由于使用同时驱动方法,因此所需的最小编程时间可以被详细推导出来。所提出的像素电路的编程能力和机制已经通过FPGA平台和离散的场效应器件所证实。尽管所提出的像素电路具有非常简单的驱动结构,但它能够提高补偿精度。     

Air-stable ambipolar organic field effect transistors with heterojunction of pentacene and N,N'-bis(4-trifluoromethylben-zyl)perylene-3,4,9,10-tetracarboxylic diimide

Fabrication of ambipolar organic field-effect transistors (OFETs) is essential for the achievement of an organic complementary logic circuit. Ambipolar transports in OFETs with heterojunction structures are realized. We select pentacene as a P-type material and N,N'-bis(4-trifluoromethylben-zyl)perylene-3,4,9,10-tetracarboxylic diimide (PTCDI-TFB) as a n-type material in the active layer of the OFETs. The field-effect transistor shows highly air-stable ambipolar characteristics with a field-effect hole mobility of 0.18~cm²/(V.s) and field-effect electron mobility of 0.031~cm²/(V.s). Furthermore the mobility only slightly decreases after being exposed to air and remains stable even for exposure to air for more than 60 days. The high electron affinity of PTCDI-TFB and the octadecyltrichlorosilane (OTS) self-assembly monolayer between the SiO₂ gate dielectric and the organic active layer result in the observed air-stable characteristics of OFETs with high mobility. The results demonstrate that using the OTS as a modified gate insulator layer and using high electron affinity semiconductor materials are two effective methods to fabricate OFETs with air-stable characteristics and high mobility.     

染料掺杂的红色有机薄膜电致发光器件

近年来 ,有机发光二极管 (OL EDs)得到了广泛深入的研究[1～ 3] 。研究工作主要集中在探索新的有机荧光材料、载流子注入和输运材料 ,以及器件的新结构 ,力求得到发光效率高和稳定性好的各种不同颜色的发光。从目前的研究来看 ,尽管蓝色和绿色发光材料的效率已经足够高到实用 ,但红色发光材料仍然存在问题 ,对红色发光进行研究是非常必要的。有两条实现红色发光的途径 :掺杂能发红光的染料和用稀土离子配合物作基质或激活剂。利用能量传递的原理 ,在有机基质材料中掺杂荧光染料是获得高效、长寿命和所希望发光颜色的一种有效而简单的方法…     

有机薄膜晶体管驱动聚合物发光二极管研究

研究了有机薄膜晶体管(OTFT)与聚合物发光二极管(PLED)集成制备技术和相关物理问题.OTFT结构为栅极钽(Ta)/绝缘层五氧化二钽(Ta2O5)/有源层并五苯(Pentacene)/源漏极金(Au);PLED器件结构为ITO/PEDOT:PEO(polyethylene oxide)/P-PPV或MEH-PPV/Ba/Al.PEDOT:PEO,P-PPV和MEH-PPV薄膜层均采用丝网印刷技术,实现了OTFT与PLED器件集成发光.其中OTFT器件的阈值电压为-7V,迁移率为0.91cm2/(V.s),并通过OTFT驱动得到以P-PPV和MEH-PPV为发光层的PLED器件的发光亮度分别达到124和26cd/m2,电流效率分别为12.4和1.1cd/A.利用丝网印刷技术可以有效控制高分子薄膜的沉积区域,实现功能器件的集成.     

Self-aligned-gate AlGaN/GaN heterostructure field-effect transistor with titanium nitride gate

Self-aligned-gate heterostructure field-effect transistor(HFET) is fabricated using a wet-etching method.Titanium nitride(TiN) is one kind of thermal stable material which can be used as the gate electrode.A Ti/Au cap layer is fixed on the gate and acts as an etching mask.Then the T-shaped gate is automatically formed through over-etching the TiN layer in 30% H_2O_2 solution at 95 ℃.After treating the ohmic region with an inductively coupled plasma(ICP) method,an Al layer is sputtered as an ohmic electrode.The ohmic contact resistance is approximately 0.3 Ω·mm after annealing at a low-temperature of 575 ℃ in N_2 ambient for 1 min.The TiN gate leakage current is only 10~(-8) A after the low-temperature ohmic process.The access region length of the self-aligned-gate(SAG) HFET was reduced from 2 μm to 0.3 μm compared with that of the gate-first HFET.The output current density and transconductance of the device which has the same gate length and width are also increased.