硫镓银晶体(112)面蚀坑形貌研究

本文报道了一种能在室温下对硫镓银晶体(112)面进行择优腐蚀的新腐蚀液配方,采用新腐蚀液对改进的Bridgman法生长的AgGaS2晶体进行腐蚀,用扫描电镜对蚀坑进行了观察,得到了清晰的(112)面蚀坑形貌,形状为三角锥形.初步解释了蚀坑的形成原因.AgGaS2晶体低指数的{100}面的腐蚀速度较慢,在腐蚀过程中逐渐显露出来,最终使晶体(112)面呈现出三角锥形蚀坑形貌.     

中远红外非线性光学晶体AgGaS2、AgGaSe2和AgGa1-xInxSe2研究进展

综合报道了本实验室关于黄铜矿类I-III-VI2型系列晶体的研究进展。采用两温区气相输运温度振荡法合成出高纯、单相、致密的多晶材料,在三温区立式炉中用坩埚旋转下降法生长出AgGaS2、AgGaSe2和AgGa1-xInxSe2等系列单晶体,X射线单晶衍射谱和回摆谱表明晶体的结晶性好,结构完整;红外透过率接近理论值,吸收系数低于0.017 cm-1,表明生长的晶体光学质量高。研究出一种新的能对AgGa1-xInxSe2晶体(112)晶面进行择优腐蚀的腐蚀剂:(30 g CrO3+10 mL H2O)∶H4PO4(85%)∶HNO3(65～68%)∶HF(40%)=10∶10∶10∶2(体积比),在60℃下腐蚀40 min,能够清晰地显示出AgGa1-xInxSe2晶体(112)面取向一致的三角形腐蚀坑,边界清晰,蚀坑密度大约为105/cm2数量级。采用自行研制的晶体定向切割新方法,加工出AgGa1-xInxSe2-OPO器件,获得了3～5μm的激光输出,光-光转换效率达21%。     

碲锌镉单晶体的(110)面蚀坑形貌观察

本文报道了一种能够在室温下择优腐蚀碲锌镉(CZT)单晶体(110)晶面的腐蚀液配方,并对富Cd生长的CZT晶体蚀坑形貌进行了扫描电镜观察.结果表明晶体(110)面腐蚀坑形状为三角形,并初步对蚀坑的成因进行了分析,估算出CZT(110)面蚀坑密度约为103～105/cm2数量级.这说明富Cd原料的改进布里奇曼法可以生长出低蚀坑密度的CZT单晶体.     

CdGeAs2单晶体的腐蚀研究

报道了一种新型的CdGeAs2晶体择优腐蚀剂,配方为:H2O2(30;): NH4OH(含NH325;-28;): NH4Cl(5mol/L): H2O=1 mL: 1.5 mL: 1.5 mL: 2 mL.将经机械研磨、物理抛光和溴甲醇化学抛光处理后的表面平整无划痕的CdGeAs2晶片,在40 ℃下超声振荡腐蚀数分钟,采用金相显微镜和SEM进行蚀坑观察.结果表明,新型腐蚀剂对CdGeAs2晶体(204)和(112)晶面择优腐蚀效果显著,蚀坑取向一致,具有很强的立体感;(204)晶面蚀坑呈三角锥形,(112)晶面蚀坑呈五边形,从晶体结构上对蚀坑形成机理进行了分析讨论.     

磷锗锌单晶体的腐蚀研究

报道了一种新的ZnGeP2晶体择优腐蚀剂及其腐蚀工艺,即先采用研磨、物理机械抛光和HCl+HNO3热化学抛光获得表面平整无划痕的ZnGeP2晶片,然后将晶片在室温下采用HF(40;):HNO3(65;):CH3COOH(99.5;):H2O:I2=2 mL:2 mL:1 mL:1 mL:4 mg腐蚀剂超声振荡腐蚀8 min;在扫描电镜下观察到ZGP(110)和(204)晶面的腐蚀坑,蚀坑形貌清晰,具有立体感,(110)晶面蚀坑呈四边形,(204)晶面蚀坑呈五边形,取向一致,蚀坑密度(EPD)约为104/cm2.从理论上对蚀坑形貌的形成机理进行了分析.     

三温区坩埚下降法生长硫镓银晶体

本文通过对硫镓银单晶生长习性的分析研究,设计组装了三温区单晶炉,采用三温区坩埚下降法生长出了外形完整、无裂纹的AgGaS2单晶体,尺寸达10mm×25mm.实验测定了AgGaS2晶体的差热分析曲线和红外透射谱,以及单晶{112}解理面的X射线衍射谱,结果表明生长晶体的质量较高.     

硫镓银单晶生长新方法探索

在同一安瓿中一次性合成、生长出了外形完整、无裂纹的AgGaS2单晶体,尺寸达φ10mm×20mm.并进行了X射线能谱元素分析,测定了AgGaS2多晶粉末衍射谱,以及单晶体的红外透射谱,同时得到了(112)、(024)面的X射线单晶衍射谱,结果表明生长的单晶体可用于器件研究.     

垂直布里奇曼法生长铜单晶体的研究

Cu单晶在中子和X射线单色器及激光核聚变靶材等领域有重要应用前景.本文采用自制的硅钼棒单晶生长炉和特制的镀碳石英生长坩埚,采用垂直布里奇曼法在30 ℃/cm的温度梯度下,以10 mm/d的下降速度生长出较高质量的铜单晶体.生长的晶体经多次研磨抛光腐蚀处理后进行X射线衍射分析和金相分析,显示出(200)晶面尖锐的X射线衍射峰和规则的方形蚀坑,表明生长的晶体结构完整.     

pH值对KDP晶体位错结构的影响

在一定的过饱和度下,分别用点状和片状籽晶在不同pH值溶液中生长出了KDP晶体.利用化学腐蚀法对KDP晶体的不同晶面进行了腐蚀,得到了清晰的位错蚀坑.应用光学显微镜对位错蚀坑的分布特点和密度做了观察分析,发现很多位错蚀坑成线状排布.pH值对KDP晶体位错密度有较大影响,低pH值条件下生长出的晶体位错密度较大.测试了KDP晶体样本的透过率,结果表明位错密度对KDP晶体的透过率没有明显的影响.     

硒铟镓银单晶体(112)面蚀坑形貌观察

研究出一种能在室温下对AgGa0.8In0.2Se2晶体(112)面进行择优腐蚀的新腐蚀液配方,提出了一种适合AgGa0.8In0.2Se2晶体择优腐蚀的新工艺。采用改进的Bridgman法生长出AgGa0.8In0.2Se2晶体,对晶体进行定向切割出(112)面晶片;然后对晶片进行研磨、机械抛光,使其表面平整无划痕;再将晶片用新腐蚀液,浓HNO3(65%～68%)∶浓HCl(35%～38%)=1∶2.5(体积比),在室温下腐蚀5min,同时进行超声振荡。采用金相显微镜对腐蚀后的晶片表面进行观察,发现清晰的蚀坑形貌,形状近似为正三角形,并对(112)面蚀坑的形成及其形貌成因进行了理论分析。     

连续离子层吸附反应(SILAR)法制备AgGaS2纳米薄膜及性能表征

采用连续离子层吸附反应(SILAR)法,通过500℃退火在玻璃衬底上制备出AgGaS2纳米薄膜.使用X射线衍射(XRD)、扫描电镜(SEM)、X射线能谱(EDS)、紫外可见(UV-Vis)谱和光致发光(PL)谱等对纳米薄膜的物相、形貌、化学配比和光学性能进行了定性和定量表征.XRD测试结果表明,实验获得产物为黄铜矿结构AgGaS2,并观测到(112)面和(224)面.使用Scherrer公式估算了AgGaS2产物的晶粒平均粒度大小约为30 nm.SEM观测到的AgGaS2纳米薄膜外形均匀一致,沉积紧密,薄膜沉积的纳米平均颗粒直径约为18～ 26 nm.EDS测试结果显示AgGaS2纳米薄膜中Ag、Ga和S三元素的原子相对百分含量为25.12;,26.66;和49.93;,其化学计量比几近于1∶1∶2物质的量比.通过紫外可见透过光谱得到截止波长为470.1 nm,禁带宽度为2.64 eV.室温PL测试发现发光中心在456 nm,与AgGaS2晶体发光中心相比产生了约40nm的蓝移.以上结果充分表明SILAR法是一种制备AgGaS2纳米薄膜的有效方式.     

Shape of thermal etch pits and crystal structure in tellurium crystals

During the systematic study of thermal etching of tellurium crystals, various shaped thermal etch pits were observed on the {101 0} cleavage faces of this crystal. An attempt has been made to explain the shape of non-dislocation and dislocation etch pits. A simple model based on crystal structure and bonding of atoms has been suggested to explain the shape of etch pits.     

Growth of Li2CO3 Single Crystals by Zone Melting Technique

Li₂CO₃ single crystals have been grown by zone melting technique in carbondioxide atmosphere. The diameter of the grown crystal depends on the growth rate. The quality of the crystal depends on the growth rate, temperature of the molten zone, choice of the seed and the temperature of the auxiliary furnace. The crystal shows cleavage plane. The etch studies on cleavage planes show that the etch pits are always triangular in character.     

Etching of CaF2 single crystals in silica gels

Etching of {111} cleavage faces of CaF₂ crystals in aqueous solution of 50% HCl is carried out in citric acid set silica gel, and the kinetics of growth of etch pits at the sites of dislocations is investigated as a function of temperature, time of etching and height of gel column above the crystal surface. It is observed that the transient period required to initiate etch pit at the sites of a dislocation decreases (1) at particular temperature, with a decrease in gel height, and (2) for a particular gel height, with an increase in the temperature of etching. It is also observed that the morphology of dislocation etch pits remains triangular irrespective of the gel height and the temperature of etching. The results are compared with those of solution etching and discussed.     

Growth and characterization of CdSe single crystals by modified vertical vapor phase method

Good quality, large single crystals of CdSe were grown by the modified growth method (i.e., vertical unseeded vapor phase growth with multi-step purification of the starting material in the same quartz ampoule without any manual transfer between the steps). Lower temperature gradients (8–9°C/cm) at the growth interface were used for the crystal growth. As-grown CdSe crystals was characterized by X-ray diffraction, scanning electron microscopy, energy dispersive analyzer of X-rays, high-resistance instrument measurement, and etch-pit observation. It is found that there are two cleavage faces of (1 0 0) and (1 1 0) orientations on the crystal, the resistivity is about 10⁸ Ω cm, and the density of etch pits is about 10^3–4/cm². The crystal was cut into wafers and was fabricated into detectors. The detectors were tested using an ²⁴¹Am radiation source. γ-ray spectra at 59.5 keV were obtained. The results demonstrated that the quality of the as-grown crystals was good. The crystals were useful for fabrication of room-temperature-operating nuclear radiation detectors. Therefore, the modified growth technique is a promising, convenient, new method for the growth of high-quality CdSe single crystals.     

Growth and dissolution of BaFCl crystals

Single crystals of BaFCl have been growth by flux technique using BaF₂ and BaCl₂. Etching with formic acid revealed dislocation etch pits on (001) cleavage faces of the crystals, at room temperature. The influence of etching parameters such as undersaturation, temperature and concentration of poison in the etchant is studied. Decreasing the undersaturation of formic acid by reducing the percentage of water and increasing the temperature of the etchant were found not to have any effect on the morphology of etch pits. However, as the CdCl₂ poison concentration is gradually increased, the orientation of the pits change from 〈100〉 to 〈110〉 at high concentration.     

热交换法生长c面取向大尺寸蓝宝石晶体的研究

本文使用热交换法直接生长c面取向,尺寸为φ170 mm× 160 mm,重12 kg的蓝宝石晶体.晶体无色透明,内部无散射颗粒.沿c面(0001)方向的晶棒锥光图可观察到同心圆簇的干涉条纹,仅中心较小区域因内应力存在,干涉条纹发生扭曲.将抛光的晶片进行化学腐蚀后,通过金相显微镜检测位错腐蚀坑形貌图,结果显示,腐蚀坑呈三角形,平均位错密度较低,为1.98 × 103 Pits/cm2,X射线衍射半峰宽较小,晶体结构完整.     

Etching Studies on Potassium Dichromate (KBC) Crystals

An investigation of the revelation of dislocations in potassium dichromate (KBC) crystals by etching in water, alcohls, and in inorganic acids mixes with acetone and alcohols is carried out. It is observed that several solutions including water, alcohols and organic acids produce disslocation etch pits on various faces of KBC crystals. Observations of twining and dissolution anisotorpy of (001) faces are also presented. Etching of (001) cleavage faces of same crystals in an etchant composed from 1 part HNO₃ and 3 parts acetone indicates the possible growth of another phase at low temperatures.