Effect of Al Doping on Properties of SiC Films

Undoped and Al-doped 3C-SiC films are deposited on Si（100） substrates by low-pressure chemical vapour deposition. Effects of aluminium incorporation on crystallinity, strain stress, surface morphology and growth rate of SiC films have been investigated. The x-ray diffraction patterns and rocking curves indicate that the crystallinity is improved with aluminium doping. Raman scatting patterns also demonstrate that the strain stress in SiC films is released due to the incorporation of Al ions and the increase of film thickness. Furthermore, due to the catalysis of surface reaction which is induced by trimethylaluminium, the growth rate is increased greatly and the growth process varies from three-dimensional island-growth mode to step-flow growth mode.     

Characterization of electrodeposited Bi2S3 thin films by holographic interferometry

Optical non destructive evaluation methods, using lasers as the object illumination source, include holographic interferometry. It is widely used to measure stress, strain, and vibration in engineering structures. Double exposure holographic interferometry (DEHI) technique is used to determine thickness and stress of electrodeposited bismuth trisulphide (Bi₂S₃) thin films for various deposition times. The same is tested for other concentration of the precursors. It is observed that, increase in deposition time, increases thickness of thin film but decreases stress to the substrate. The structural, optical and surface wettability properties of the as deposited films have been studied using X-ray diffraction (XRD), optical absorption and contact angle measurement, respectively. The X-ray diffraction study reveals that the films are polycrystalline with orthorhombic crystal structure. Optical absorption study shows the presence of direct transition with band bap 1.78 eV. The water contact angle measurement shows hydrophobic nature of Bi₂S₃ thin film surface.     

Biaxial stresses, surface roughness and microstructure in evaporated TiO2 films with different deposition geometries

The residual stresses, surface roughness and microstructure in titanium oxide films prepared by electron-beam evaporation and deposited with different geometries were investigated, with particular focus on the in-plane anisotropy of the biaxial stresses and microstructures. Thin films were deposited with various deposition angles on B270 glass substrates and silicon wafers. Two different types of deposition geometries were studied. The residual stress in the thin films was examined by a phase-shifting Twyman-Green interferometer. The optical constants, biaxial stress and surface roughness were found to be related to the evolution of the anisotropic microstructures in the films. The results revealed that the anisotropic stresses that developed in the evaporated titanium oxide films were dependent upon the deposition geometry and microstructure of the films.     

STRESS ANALYSIS IN CUBIC BORON NITRIDE FILMS BY X-RAY DIFFRACTION USING sin2 ψ METHOD

The boron nitride (BN) films containing cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN) were prepared by radio frequency a ssisted thermal filament chemical vapor deposition. The stress and strain in BN films were investigated by X-ray diffraction analysis using the sin² ψ method. The results showed that both c-BN and h-BN in the same film have similar values of elastic strain, however, the compressive stress in c-BN is much greater than that in h-BN for the same film. Both stress and strain gradually decre ased with the increase of substrate temperature (T_s). The effective stress in the films calculated by the effective stress model increased with the increase of T_s. Furthermore, the dependence of effective stress in the films on T_s was also investigated.     

溅射功率对直流磁控溅射Ti膜结构的影响

 采用直流磁控溅射方法制备了纯Ti膜,研究了不同功率下Ti膜的沉积速率、表面形貌及晶型结构,并对其应力进行了研究。研究表明：薄膜的沉积速率随溅射功率的增加而增加,当溅射功率为20 W时,原子力显微镜(AFM)图像显示Ti膜光洁、致密,均方根粗糙度最小可达0.9 nm。X射线衍射(XRD)分析表明薄膜的晶体结构为六方晶型,Ti膜应力先随溅射功率增大而增大,在60 W时达到最大值（为945.1 MPa）,之后随溅射功率的增大有所减小。     

柔性基周期性厚度梯度薄膜的应变效应

可控的表面微结构在柔性电子、仿生器件和能源材料等方面均具有重要的应用价值.本文采用编织铜网作为掩模板,利用磁控溅射技术在柔性聚二甲基硅氧烷(PDMS)基底上制备具有周期分布的厚度梯度金属银薄膜,研究了薄膜在单轴压缩/拉伸过程中的形貌演化规律.实验发现,在单轴机械载荷作用下,银薄膜表面将形成相互垂直的条纹褶皱和多重裂纹.膜厚的梯度变化调制了薄膜的面内应力分布,导致褶皱在膜厚较小处率先形成,并逐渐扩展到膜厚较大区域,而裂纹则基本限定在膜厚较小区域.基于应力理论和有限元计算,对周期性厚度梯度薄膜的褶皱和裂纹的形貌特征、演化行为和物理机制进行了深入分析.该研究将有助于加深对非均匀薄膜体系的应变效应的理解,并有望通过梯度薄膜的结构设计在柔性电子等领域获得应用.     

直流等离子体化学汽相沉积法合成的金刚石膜的内应力研究

研究了直流等离子体化学汽相沉积(CVD)法合成的金刚石膜内应力随甲烷浓度、沉积温度的变化关系。实验研究表明,金刚石膜的总内应力随沉积条件变化十分敏感。压缩应力是由非金刚石成份及氢等杂质引起的,而伸张应力可由膜中高密度的微空和内面积导致的晶粒间界弛豫模型来解释。     

硅油基底表面铁薄膜的生长机理及表面有序结构

利用直流溅射方法在液体基底(硅油)表面成功制备出金属铁薄膜系统，研究了其生长机理及特征的表面有序结构.实验发现铁薄膜的生长过程与液相基底表面非磁性金属薄膜的情况类似，基本服从二阶段生长模型.连续铁薄膜中可观测到尺寸巨大的圆盘形有序结构，其生长演化与溅射功率、沉积时间和真空环境中的生长时间等实验条件密切相关.实验证明，此类有序结构是在薄膜内应力作用下，铁原子及原子团簇在液体表面自由扩散迁移，并最终在硅油基底表面某些区域成核凝聚所致.在较大溅射功率和沉积时间条件下，圆盘外部区域的铁薄膜中形成周期分布的波纹褶皱，其波长约为10 μm，波峰基本与圆盘的边界平行.进一步研究表明：在沉积过程中，由于沉积铁原子的局域能量作用，导致硅油的表面层结构发生改变而形成一聚合物层；在随后的冷却过程中，聚合物层的强烈收缩使铁薄膜处于很大的压应力场中，促使薄膜起皱形成波纹结构. 关键词： 液体基底 铁薄膜 生长机理 有序结构     

Effect of intrinsic stress on the optical properties of nanostructured ZnO thin films grown by rf magnetron sputtering

In this paper we report the effect of deposition temperature on the structural and optical properties of ZnO thin films prepared by rf magnetron sputtering. The films grown at lower deposition temperatures were in a state of large compressive stress, whereas the films grown at higher temperature (450 °C) were almost stress free. In the absorption spectra, the ZnO excitonic and the Zn surface plasmon resonance (SPR) peaks have been observed. A redshift in the optical band gap of ZnO films has also been observed with the increase in the deposition temperature. The shift in the band gap calculated from the size effect did not match with the observed shift values and the observed shift has been attributed to the compressive stress present in the films.     

Interplay of surface morphology, strain relief, and surface stress during surfactant mediated epitaxy of Ge on Si

Lattice-mismatch-induced surface or film stress has significant influence on the morphology of heteroepitaxial films. This is demonstrated using Sb surfactant-mediated epitaxy of Ge on Si(111). The surfactant forces a two-dimensional growth of a continous Ge film instead of islanding. Two qualitatively different growth regimes are observed. Elastic relaxation: Prior to the generation of strain-relieving defects the Ge film grows pseudomorphically with the Si lattice constant and is under strong compressive stress. The Ge film relieves strain by forming a rough surface on a nm scale which allows partial elastic relaxation towards the Ge bulk lattice constant. The unfavorable increase of surface area is outbalanced by the large decrease of strain energy. The change of film stress and surface morphology is monitored in situ during deposition at elevated temperature with surface stress-induced optical deflection and high-resolution spot profile analysis low-energy electron diffraction. Plastic relaxation: After a critical thickness the generation of dislocations is initiated. The rough phase acts as a nucleation center for dislocations. On Si(111) those misfit dislocations are arranged in a threefold quasi periodic array at the interface that accommodate exactly the different lattice constants of Ge and Si. Received: 1 April 1999 / Accepted: 17 August 1999 / Published online: 6 October 1999     

Effect of strain on the structural and optical properties of Cu-N co-doped ZnO thin films

Polycrystalline ZnO thin films co-doped with Cu and N have been obtained by chemical bath deposition. Introduction of Cu and N causes the change of strained stress in ZnO films, which subsequently affects the structural and optical properties. The dependence of structural and optical properties of the ZnO films on lattice strained stress is investigated by XRD measurement, SEM, PL spectrum, optical reflection and Raman spectrum. The result of photoluminescence of Cu-N co-doped ZnO films indicates that the UV emission peaks shift slightly towards higher energy side with decrease in tensile strain and vise versa. The blue-shift of the absorption edge and up-shift of E2 (high) mode of the films can be observed in the optical reflection and Raman spectra.     

预通三甲基铝对AlN薄膜的结构与应变的影响

采用有机金属化学气相沉积设备用两步生长法在(0001)蓝宝石衬底上制备AlN薄膜。研究了预通三甲基铝(TMAl)使衬底铝化对外延AlN的影响。利用高分辨X射线衍射(XRD)技术和扫描电子显微镜(SEM) 分析了样品的结晶质量以及外延膜中的残余应力。通过SEM观察发现,短时间的预通TMAl处理对AlN薄膜表面的影响不大;但随着预通时间的增加,表面会出现六角形的岛。通过优化TMAl的预通时间可以保护衬底被氮化有利于Al极性面AlN的生长,从而得到的Al极性面AlN表面比较平整;但是预通TMAl时间过长会使衬底表面沉积金属态铝而不容易形成平整的表面。X射线双晶摇摆曲线结果表明:样品的(0002)和(101 2)面的X射线双晶摇摆曲线的半峰宽随着预通TMAl时间的不断增加,由此得出薄膜的晶体质量不断下降。这可以解释为:预通TMAl使形成的晶核不再规则,从而在成核层形成了很多亚颗粒降低了晶体质量。进一步对XRD结果分析,我们也发现了这样的应力变化。这种应力的变化起源可以归结于内应力(岛的合并在其晶界引入的应力)与外应力(晶格失配与热失配引起的应力)共同作用的结果。     

Vacancy formation and strain in low-temperature Cu/Cu(100) growth

The development of compressive strain in metal thin films grown at low temperature has recently been revealed via x-ray diffraction and explained by the assumption that a large number of vacancies were incorporated into the growing films. The results of our molecular dynamics and parallel temperature-accelerated dynamics simulations suggest that the experimentally observed strain arises from an increased nanoscale surface roughness caused by the suppression of thermally activated events at low temperature combined with the effects of shadowing due to off-normal deposition.     

NaF薄膜的脉冲激光沉积法制备与结构研究

 采用脉冲激光沉积(PLD)方法在Si(100)衬底上制备了NaF薄膜。在激光重复频率2 Hz,能量密度3 J/cm²,本底真空度5×10^-5 Pa的条件下,研究衬底温度对薄膜沉积速率及结构的影响。台阶仪分析表明：薄膜的沉积速率随衬底温度增加呈指数函数增加,算出NaF薄膜的反应激活能为48.67 kJ/mol。原子力显微镜分析表明：薄膜致密而光滑,均方根粗糙度为0.553 nm。扫描电镜截面微观形貌分析表明：薄膜呈现柱状结构。X射线衍射分析表明：NaF薄膜为面心立方晶体结构,并具有显著的择优取向;当衬底温度约为400 ℃时,平均晶粒尺寸最大(129.6 nm),晶格微应变最小(0.225%)。     

Optical and hydrophobic properties of co-sputtered chromium and titanium oxynitride films

The chromium and titanium oxynitride films on glass substrate were deposited by using reactive RF magnetron sputtering in the present work. The structural and optical properties of the chromium and titanium oxynitride films as a function of power variations are investigated. The chromium oxynitride films are crystalline even at low power of Cr target (≥60 W) but the titanium oxynitride films are amorphous at low target power of Ti target (≤90 W) as observed from glancing incidence X-ray diffraction (GIXRD) patterns. The residual stress and strain of the chromium oxynitride films are calculated by sin² ψ method, as the average crystallite size decreases with the increase in sputtering power of the Cr target, higher stress and strain values are observed. The chromium oxynitride films changes from hydrophilic to hydrophobic with the increase of contact angle value from 86.4° to 94.1°, but the deposited titanium oxynitride films are hydrophilic as observed from contact angle measurements. The changes in surface energy were calculated using contact angle measurements to substantiate the hydrophobic properties of the films. UV-vis and NIR spectrophotometer were used to obtain the transmission and absorption spectra, and the later was used for determining band gap values of the films, respectively. The refractive index of chromium and titanium oxynitride films increases with film packing density due to formation of crystalline chromium and titanium oxynitride films with the gradual rise in deposition rate as a result of increase in target powers.     

Imaging spin-reorientation transitions in consecutive atomic Co layers on Ru(0001)

By means of spin-polarized low-energy electron microscopy, we show that the magnetic easy axis of one to three atomic-layer thick cobalt films on Ru(0001) changes its orientation twice during deposition: One-monolayer and three-monolayer thick films are magnetized in plane, while two-monolayer films are magnetized out of plane. The Curie temperatures of films thicker than one monolayer are well above room temperature. Fully relativistic calculations based on the screened Korringa-Kohn-Rostoker method demonstrate that only for two-monolayer cobalt films does the interplay between strain, surface, and interface effects lead to perpendicular magnetization.     

Strain relaxation and vacancy creation in thin platinum films

Synchrotron based combined in situ x-ray diffractometry and reflectometry is used to investigate the role of vacancies for the relaxation of residual stress in thin metallic Pt films. From the experimentally determined relative changes of the lattice parameter a and of the film thickness L the modification of vacancy concentration and residual strain was derived as a function of annealing time at 130 °C. The results indicate that relaxation of strain resulting from compressive stress is accompanied by the creation of vacancies at the free film surface. This proves experimentally the postulated dominant role of vacancies for stress relaxation in thin metal films close to room temperature.     

FTIR法研究BCN薄膜的内应力

采用射频磁控溅射技术,用六角氮化硼和石墨为溅射靶,以氩气(Ar)和氮气(N₂)为工作气体,在Si(100)衬底上制备出硼碳氮(BCN)薄膜。利用傅里叶变换红外光谱(FTIR)考察了不同沉积参数(溅射功率为80～130 W、衬底温度为300～500 ℃、沉积时间为1～4 h)条件下制备的薄膜样品。实验结果表明,所制备薄膜均实现了原子级化合。并且沉积参数对BCN薄膜的生长和内应力有很大影响,适当改变沉积参数能有效释放BCN薄膜的内应力。在固定其他条件只改变一个沉积参数的情况下,得到制备具有较小内应力的硼碳氮薄膜的最佳沉积条件：溅射功率为80 W、衬底温度为400 ℃、沉积时间为2 h。     

沉积温度对氧化钇稳定氧化锆薄膜残余应力的影响

采用自制掺摩尔分数12%的YzO2的ZrO2混合颗粒料为原料,在不同的沉积温度下用电子束蒸发方法沉积氧化钇稳定氧化锆(YSZ)薄膜样品.利用ZYGO MarkⅢ-GPI数字波面干涉仪对氧化钇稳定氧化锆薄膜的残余应力进行了研究,讨论了沉积温度对残余应力的影响.实验结果表明:随沉积温度升高,氧化钇稳定氧化锆薄膜中残余应力状态由张应力变为压应力.且压应力值随着沉积温度升高而增大;用X射线衍射仪表征了不同沉积温度下氧化钇稳定氧化锆薄膜的微观结构,探讨了薄膜微观结构与其应力的对应关系,并对比了纯ZrO2薄膜表现出的应力状念.     

ZrO2薄膜残余应力实验研究

采用ZYGO MarkⅢ-GPI数字波面干涉仪对电子束蒸发方法制备的ZrO2薄膜中的残余应力进行了研究,讨论了沉积温度、沉积速率等工艺参量对ZrO2薄膜残余应力的影响。实验结果表明：随着沉积温度及沉积速率的升高,ZrO2薄膜中残余应力状态由张应力变为压应力,且压应力值随着沉积温度升高而增大。同时用X射线衍射技术测量分析了不同沉积条件下ZrO2薄膜的微结构组织,探讨了ZrO2薄膜微结构与其应力的对应关系。