探空集成传感器设计

微型化、集成化可以使得传感系统减少体积、重量 ,降低成本 ,提高系统的可靠性 ,具有重要的科学意义。本文设计了一个用于测量大气湿度、温度和气压检测微型集成传感器。考虑到MEMS加工工艺兼容性 ,分别采用空气导热检测法、铂电阻法和电容法对湿度、温度、压力进行检测 ,并且进行了理论计算 ,设计了加工工艺步骤 ,制作出雏形器件     

探空集成传感器设计

微型化、集成化可以使得传感系统减少体积、重量,降低成本,提高系统的可靠性,具有重要的科学意义.本文设计了一个用于测量大气湿度、温度和气压检测微型集成传感器.考虑到MEMS加工工艺兼容性,分别采用空气导热检测法、铂电阻法和电容法对湿度、温度、压力进行检测,并且进行了理论计算,设计了加工工艺步骤,制作出雏形器件.     

一种新型的CMOS集成湿度传感器

利用MEMS技术 ,对一种新型CMOS湿度传感器进行理论分析、模拟以及结果讨论。该湿度传感器采用标准CMOS工艺制造 ,采用梳状铝电极结构、梳状多晶硅加热结构 ,衬底接地 ,感湿介质采用聚酰亚胺 ,利用商业软件Coventor进行模拟绘制出敏感电容与相对湿度的曲线图。接口电路采用开关电容电路 ,输出可测电压信号 ,利用Microsim公司的Pspice模拟电路得到相对湿度与输出电压曲线关系     

一种新型的CMOS集成湿度传感器

利用MEMS技术,对一种新型CMOS湿度传感器进行理论分析、模拟以及结果讨论.该湿度传感器采用标准CMOS工艺制造,采用梳状铝电极结构、梳状多晶硅加热结构,衬底接地,感湿介质采用聚酰亚胺,利用商业软件Coventor进行模拟绘制出敏感电容与相对湿度的曲线图.接口电路采用开关电容电路,输出可测电压信号,利用Microsim公司的Pspice模拟电路得到相对湿度与输出电压曲线关系.     

基于SOI的集成硅微传感器芯片的制作

为满足小体积、多参数测量的要求,采用SOI硅片,设计了一种测量三轴加速度、绝对压力、温度参数的单片集成硅微传感器,其中加速度、绝对压力传感器基于掺杂硅压阻效应,温度传感器基于掺杂硅电阻温度效应.根据集成传感器的结构,制定了相应的制备工艺步骤.针对芯片上各电阻间金属引线的可靠性问题和加速度传感器质量块吸附问题提出了有效的改进方法.最后给出了集成传感器芯片的性能测试结果.     

一种新型的CMOS集成湿度传感器

利用MEMS技术，对一种新型CMOS湿度传感器进行理论分析、模拟以及结果讨论。该湿度传感器采用标准CMOS工艺制造，采用梳状铝电极结构、梳状多晶硅加热结构，衬底接地，感湿介质采用聚酰亚胺，利用商业软件Coventor进行模拟绘制出敏感电容与相对湿度的曲线图。接口电路采用开关电容电路，输出可测电压信号，利用Microsim公司的Pspice模拟电路得到相对湿度与输出电压曲线关系。     

智能集成传感器系统的研究进展

介绍了具有高级智能，即含有微控制器的集成传感器系统的基本结构，其硬件、软件实现方式，以及这种高智能集成传感器系统的发展给传感器系统设计带来的影响。讨论了根据不同需要，采用适当的通信方式，以扩大高智能集成传感器系统的应用范围。给出了典型的例子，介绍了国外智能集成传感器系统研究的最新进展。     

新型集成压力与温度MEMS传感器

本文提出一种MEMS传感器,单片集成温度和气压的检测单元。该传感器采用SOI硅片的上层硅作为压阻薄膜,因此各管芯的薄膜厚度有良好的一致性。传统的背面体硅腐蚀方法未被采用,因为碱性溶液腐蚀体硅会在<111>面自停止,形成57.4°的斜坡,从而增大管芯面积,取而代之的是ICP深硅刻蚀。片上集成两个PN结,结区面积呈比例,可以实现温度检测功能。测试表明在-40-100℃之间都有良好的线性度,PN结的离子注入工艺与压阻注入工艺完全兼容,减少了工艺成本。     

温湿度传感器纵横谈

开开色色的温度传感器温度的测量是从金属（物质）的热胀冷缩开始。水银温度计至今仍是各种温度测量的计量标准。可是它的缺点是只能近距离观测，而且水银有毒，玻璃管易打碎，先进国家和大城市已不允许生产。代替水银的有酒精温度计和金属簧片温度计，它们虽然没有毒性，...     

生物环境中的集成传感器

用于侵入性及非侵入性患者监视的固态集成传感器已逐渐可行并令人瞩目,因为这种传感器尺寸缩小,更可靠并结合了单片信号处理.对于许多生物和生理研究程序及一些临床应用,患者的侵入性监视已成为重要的焦点.这些应用包括很广的领域,从物理和化学生物事件的简单测量,如记录单个神经细胞内电化学产生生物势的放电,到增强或恢复障碍功能的全     

集成风速计片上系统的计算机模拟

将MEMS器件与CMOS电路集成在同一个芯片上具有体积小、噪声小、便于控制、易于大批量生产等优点 ,本文从风速计的工作场入手 ,运用了有限元、数据拟合、等效电路及SPICE宏单元的方法对片上系统进行模拟 ,从而直接模拟出信号状况 ,有利于片上处理电路和控制电路的匹配设计 ,提高了设计效率。文中给出了风速计流体场的有限元分析结果 ,并通过拟合的方法将输出的温度差输出到电路等效的热堆 ,信号和噪声经过片上集成的放大器输出到芯片外 ,有利于温度场、热敏感元件、放大电路的优化设计     

应用于MEMS气密性封装测试的微型湿度传感器的设计与制作

MEMS器件的封装一直是MEMS技术的难点之一 ,在封装设计中 ,如何测试封装的有效性就显得尤为重要。本文叙述了一种基于MEMS技术的微型湿度传感器的原理、设计以及工艺流程。在其上进行气密性封装 ,则可通过对封装内的湿度测量来判断该封装的气密性能。在设计中 ,充分考虑了尺寸、工艺以及灵敏度等各方面要求。制作采用的是传统的光刻、刻蚀工艺。该湿度传感器结构简单 ,易于制作 ,其性能能够满足气密性封装测试的要求     

仿纤毛MEMS三轴振动传感器的设计

A biomimetic three-dimensional piezoresistive vibration sensor based on MEMS technology is reported.The mechanical properties of the sensor are analyzed and the static and dynamic characteristics of the sensor are simulated by ANSYS Workbench12.0.The structure was made by MEMS processes including lithography,ion implantation,PECVD,etching,etc.Finally,the sensor is tested by using a TV5220 sensor auto calibration system.The results show that the lowest sensitivity of the sensor is 394.7 V/g and can reach up to 460.2 V/g,and the dimension coupling is less than 0.6152%,and the working frequency range is 0–1000 Hz.     

MEMS双光纤位移声传感器设计与分析

提出了一种新型强度调制型光纤传感器的理论模型。该模型使用单模光纤,讨论了光在准直透镜中的传播规律,利用光学透镜的准直作用,即矩阵光学原理和高斯耦合理论实现光强调制。强度型光纤传感器采用微电机系统MEMS结构的压力振动膜片拾取振动位移,通过分析施加在膜片上压力的变化及膜片尺寸得到影响双光纤位移传感器灵敏度的相关参数。仿真结果表明:合理的选择参数可以使传感器的灵敏度在不增加结构复杂性的前提下较传统方法有103量级的提高。     

微流路生物芯片的研制

运用光刻、刻蚀技术在载玻片上刻蚀出条宽70μm、深30μm、长7cm的沟槽，与另一载玻片键合，形成一微流路沟道，研制出了用于生物电泳技术的微流路生物芯片。在该芯片的研制中，克服了湿法腐蚀、断线、键合等技术难题。该芯片已经交付合作单位使用，能够满足应用中的基本性能要求。     

液氮温区集成式数字温度传感器设计

温度传感器是制冷型红外焦平面探测器的重要组成部分,它用于测量探测器工作温度,其输出用于制冷机控制,从而控制探测器温度。探测器的工作温度将直接影响探测器的性能,如信噪比、探测率和盲元率等。针对传统PN结温度传感器需要模拟信号处理电路及易受电磁干扰的弊端,设计了一种基于CMOS工艺的集成式数字温度传感器,可以集成到红外焦平面探测器读出电路中,直接通过SPI接口输出数字测温值。设计的集成式数字温度传感器采用0.35 m CMOS工艺流片,芯片面积为380 m500 m（不包含PAD）,在电源电压2.5 V和采样频率6.1次/s条件下,功耗为300 W,分辨率0.061 6 K。在77 K温度下输出的RMS噪声为0.148 K。测试结果表明,集成式数字温度传感器可以应用于制冷型红外焦平面探测器温度测量。     

Design and implementation of an optimised wireless pressure sensor for biomedical application

This paper presents design and implementation of a wireless pressure sensor system for biomedical application. The system consists of a front-end Micro-Electro- Mechanical System (MEMS) sensing capacitor along with an optimised MEMS-based oscillator for signal conditioning circuit. In this design, vertical fringed comb capacitor is employed due to the advantages of smaller area, higher linearity and larger full scale change in capacitance compared to parallel plate counterparts. The MEMS components are designed in Coventorware design suite and their Verilog-A models are extracted and then imported to Cadence for co-simulation with the CMOS section of the system using AMI 0.6-micron CMOS process. In this paper, an optimisation method to significantly reduce the system power consumption while maintaining the system performance sufficient is also proposed. A phase noise optimisation approach is based on the algorithm to limit the oscillator tail current. Results show that for the pressure range of 0–300 mmHg the device capacitance range of 1.31 pF – 1.98 pF is achieved which results in a frequency sweep of 2.54 GHz – 1.95 GHz. Results also indicate that a 42% reduction of power consumption is achieved when the optimisation algorithm is applied. This characteristic makes the sensor system a better candidate for wireless biomedical applications where power consumption is the major factor. Hai Phuong Le received his B.E. (Hons) degree in Electronic and Computer System Engineering from University of Tasmania, Hobart, Australia in 2000. He received his Ph.D. degree in Microelectronics from Victoria University, Melbourne, Australia in 2005. At present, he is a post-doctoral research fellow and lecturer in the Centre for Telecommunications and Microelectronics, Victoria University. His research and teaching interests include data acquisition system, mixed-signal integrated circuit design and wireless smart sensor systems. Kriyang Shah received his B.E. Degree in Electronics and Communication Engineering from Sardar Patel University, Vallabh Vidyanagar, Gujarat, India and his Master Degree in Microelectronics in 2004. He is currently a Ph.D. research student in the Centre for Telecommunications and Microelectronics, Victoria University, Melbourne, Australia. His research interests include MEMS Sensors, RF MEMS, process integration for MEMS and CMOS and MEMS-CMOS co-simulation. Jugdutt (Jack) Singh received his B.Sc. in Electronics Engineering from University of Brighton, UK and M.Sc. in Electronics Engineering from University of Alberta, Canada in 1978 and 1986 respectively. He completed his Ph.D. at Victoria University, Australia in 1997. Since 1989 he has been at Victoria University, Melbourne, Australia. Currently he is a Professor of Microelectronics in the Centre for Telecommunications and Microelectronics at Victoria University. His major area of research interests are in the RF, analog and mixed signal design, reconfigurable architectures, low power VLSI circuits and systems design. He has published number of articles in education and research in microelectronics and small technologies area. Aladin Zayegh received his B.E. degree in Electrical Engineering from Aleppo University in 1970 and Ph.D. degree from Claude Bernard University, France in 1979. In 1980, he joined the Faculty of Engineering, Tripoli, Libya. Since 1984 he has held lecturing position at Victoria University, Melbourne, Australia. He is currently an Associate Professor and the Head of School in the School of Electrical Engineering, Faculty of Health, Engineering and Engineering and Science at Victoria University. His research interest includes microprocessor-based system, instrumentation, data acquisition and interfacing, and microelectronics.