电子元器件的破坏性物理分析

随着我国社会经济的快速发展,电子技术发展迅猛,逐渐被各个领域所使用。但是电子元器件在使用过程中经常会发生破坏情况,从而对相关设备的正常运行产生严重影响。基于此,本文就对电子元器件的破坏性物理分析进行详细的阐述,以期为电子元器件检修工作提供参考依据。     

电子元器件的破坏性物理分析

电子元器件在设备运行过程中极易发生破坏,因此关于电子元器件的破坏性物理分析对于相关设备的运行及维护方面具有十分重要的作用,并且对于提高电子元器件的质量及使用效果也具有十分重要的积极作用,由此达到对电子元器件在相关设备中运行状态及破损情况形成充分的理解与认识。文章就电子元器件破坏性物理分析对于电子元器件品质及相关设备运行的意义作用进行了探讨,对电子元器件的破坏性物理分析作出详细阐述。     

元器件破坏性物理分析方法的定制开发

随着航天器研制技术的不断进步,大量不同于传统半导体器件的新型元器件以及微组装结构的组件级元器件越来越多地被选用,在对这些类别的元器件进行破坏性物理分析（DPA）时没有可适用的标准规范,采用定制开发的技术方法是解决途径之一。通过对某型视频处理组件的DPA工程实践案例的介绍,探讨了DPA方法的定制开发过程以及需要重点关注的事项。     

电子元器件破坏性物理分析中几个难点问题的分析

通过对电子元器件破坏性物理分析（DPA）试验中遇到的几个难点问题的分析、讨论，强调了在DPA试验中对发现的问题和缺陷进行认真分析和评价的重要性。通过深入理解试验目的来灵活应用标准，可以使DPA试验的可操作性更强，更能准确、客观地反映元器件的固有可靠性水平。     

破坏性物理分析(DPA)技术促进国产电子元器件质量提高

简要介绍了破坏性物理分析（DPA）技术的概况和发展，重点介绍了信息产业部电子第五研究所DPA实验室应用DPA技术促进国产军用电子元器件质量提高的几个实际例子。     

电子元器件破坏性物理分析中几个问题的探讨

通过对电子元器件破坏性物理分析(DPA)试验中发现的混合电路中塑封器件检查、X射线检查密封宽度判据、剪切强度判据和半导体二极管芯片目检等问题进行分析、探讨,加强对DPA试验评价电子元器件固有可靠性机理的认识,以实现恰当、灵活运用标准开展DPA工作。     

破坏性物理分析(DPA)在评价元器件质量水平方面的作用

破坏性物理分析(DPA)技术是保证电子元器件质量的关键技术,在电子元器件的生产过程中以及上机前,在保证电子元器件质量一致性、可靠性等方面有着广泛且重要的应用优势.但目前国内没有充分应用此技术,严重的限制了国内电子元器件质量的提高,尤其是民用电子元器件普遍存在或多或少的隐蔽的质量缺陷.     

基于破坏性物理分析的假冒翻新器件识别方法

假冒翻新电子元器件大量存在于当前电子产品领域。基于破坏性物理分析技术,探讨了如何识别假冒翻新器件;阐述了利用外部目检、 X射线检查、声学扫描显微镜检查和内部目检等技术手段识别假冒翻新器件的具体方法,以期为减少假冒翻新器件、提高产品的可靠性提供一定的指导。     

军工产品电子元器件的选用探讨

随着现代武器装备的不断完善和发展,各种军工产品电子元器件尤其是微电子器件在军工产品装备上的应用越来越广泛,电子元器件的选择和使用就日益显得重要。本文结合军工产品用电子产品元器件选择和使用的实际情况,着重就元器件选择和使用过程中的采购、筛选、破坏性物理分析以及失效分析进行了探讨,给出了军工产品用电子元器件的选择和使用准则。     

研制产品电子元器件的质量控制

电子元器件是电子产品的最基本单元,没有可靠的元器件就不可能有高可靠的电子产品。对电子元器件应从选用、二次筛选、质量跟踪、建立远器件质量数据库等方面进行有效的控制,从而确保装机电子元器件的质量。     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.     

Failure analysis of leakage current in plastic encapsulated packages

Plastic encapsulated packages exhibit high leakage currents after a few hundred hours in the steam pressure pot test (SPP). The present study investigates two possible causes of leakage current. These are: (a) mold compound, (b) the polyimide tape used for co-planarity of lead frame fingers. The results of this study indicate that the leakage cur-rent is independent of the frame and is not caused by the mold compound. The data indicates that it is the ionic content and acrylic-based adhesive layer of the polyimide tape which cause the leakage current. To eliminate the leakage current, polyimide tape with low ionic content and non acrylic-based adhesive should be used. *Permanent address: School of Physics, Universiti Sains Ma-laysia, 11800 USM Penang, Malaysia.     

塑封器件的贮存环境与使用可靠性

介绍了用潮热环境试验模拟塑封器件在长期贮存时对水汽的吸附以及用潮热试验和焊接热的综合影响来评价塑封器件耐潮湿性能的方法.     

超声波清洗引入的芯片金属化裂纹机理分析

对某塑封器件进行破坏性物理分析(DPA),发现芯片表面存在玻璃钝化层裂纹和金属化层划伤的缺陷。对缺陷部位进行扫描电子显微镜(SEM)检查和能谱(EDS)分析,通过形貌和成分判断其形成原因为开封后的超声波清洗过程中,超声波振荡导致环氧塑封料中的二氧化硅填充颗粒碰撞挤压芯片表面,从而产生裂纹。最后,进行了相关的验证试验。研究结论对塑封器件的开封方法提出了改进措施,对塑封器件的DPA检测及失效分析(FA)有一定借鉴意义。     

Introduction of plastic encapsulated devices in systems operating under severe temperature conditions

In this paper, we describe the evolution of the selection, qualification and implementation methods used to validate the introduction of plastic SMD's into electrical equipment submitted to extreme environmental conditions:The first introduction phase was addressing equipment operating up to 125°C. The selection process was intentionally kept to minimum with emphasis on qualification through mission profile at equipment level. The results in terms of cost, performance, reliability and field feedback experience were extremely positive.The second phase was initiated for operating conditions as high as 175 °C environmental temperature. The selection process of plastic components operating at such extreme conditions, includes a full qualification through mission profile at component level. The experiments using vehicle test boards led to numerous electrical failures originated by a unique failure mechanism: delamination.In consequence, the selection process is being reviewed: a short-test for capability will be run with emphasis on initial behavior versus delamination.Expected benefits are

reduction of overall qualification costs through elimination of complete qualification with mission profile at component level.

faster availability to designers.

     

Metal problems in plastic encapsulated integrated circuits

The long-term reliability of plastic encapsulated integrated circuits in humid environments is ultimately limited by the effects of entering moisture. Degradation of device characteristics may be acceptable in some types of circuits, but catastrophic failures ("opens" and "shorts") are certainly not acceptable. Catastrophic failures can occur in a) the metalization used on the silicon chip itself, b) the internal wires, beam leads or frames, and c) the interfaces between these parts (and others) used in making a complete package. Entry of moisture permits electrochemical corrosion or deplating and replating of metals. This occurs under operating conditions, accelerated by externally applied potentials, and also in the unoperated condition due to EMFs produced by couples between dissimilar metals or by built-in potentials of p-n junctions. Choice of metal systems, platings, and passivation geometries determine the useful life and modes of failure of plastic encapsulated integrated circuits exposed to moisture.     

Impact of pre-conditioning, voltage bias and temperature on reliability of plastic encapsulated microcircuits

This paper investigates the effect of pre-conditioning, voltage bias and test temperature on the reliability of DIP and SOIC packages, molded with four different epoxy compounds, which were subjected to accelerated test conditions.     

军用电子装备应用中的塑封微电路质量保证

近年来,塑封微电路凭借着其在性能、重量、尺寸、成本、采购周期以及可获得性等方面的优势,越来越多地应用在军工电子装备中,其可靠性低的问题就越来越突出。如何将这类塑封微电路更可靠地应用于不同领域的军工电子装备中,并使风险降低到可控的范围,是广大军工电子装备制造单位正在致力探索解决的问题。浅析了塑封微电路应用于军工电子装备中的优缺点,并介绍了某型塑封微电路在地面、航空这两个不同的领域应用所执行的一套质量保证方案。     

破坏性物理分析技术初探

破坏性物理分析(DPA)技术在元器件的生产加工过程中用于生产过程的监控,特别是关键工艺质量分析与监控,对提升元器件的可靠性水平具有其它试验和检验手段无法替代的作用.从元器件生产过程的控制角度,详细讨论了DPA分析技术的试验项目、试验方法,并结合实例阐述了DPA分析技术的应用程序,达到了提高元器件生产过程控制能力与提升产品可靠性的目的.