低成本衬底上多晶硅薄膜电池的探索

在低成本、两种纯度的P^ 颗粒硅带衬底(SSP)上，采用RT化学气相沉积(CVD)技术制备了多晶硅薄膜电池。无论高纯硅粉还是低纯硅粉制备的SSP衬底杂质含量都很高且表面凹凸不平；采用4μm／min的沉积速率和钝化作用得到了高质量外延多晶硅薄膜。通过扩散工艺制成的多晶硅薄膜太阳电池的转换效率分别为6．25％(高纯硅粉制成的SSP衬底)和4．5％(低纯硅粉制成的SSP衬底)。     

Hot-Carrier Effects on Total Dose Irradiated 65 nm n-Type Metal-Oxide-Semiconductor Field-Effect Transistors

The influence of total dose irradiation on hot-carrier reliability of 65 nm n-type metal-oxide-semiconductor fieldeffect transistors(nMOSFETs) is investigated.Experimental results show that hot-carrier degradations on irradiated narrow channel nMOSFETs are greater than those without irradiation.The reason is attributed to radiation-induced charge trapping in shallow trench isolation(STI).The electric field in the pinch-off region of the nMOSFET is enhanced by radiation-induced charge trapping in STI,resulting in a more severe hot-carrier effect.     

Multilayer laser printing for Organic Thin Film Transistors

Functional laser printed Organic Thin Film Transistors (OTFTs) have been achieved from multilayer substrates composed with semiconductor and electrodes. The p-type copper phthalocyanine (CuPc) was used to form the active layer. Different kinds of metallic materials were used for source and drain electrodes. Multilayer donor substrates were prepared by the successive depositions of materials by either thermal evaporation under vacuum or laser printing. The materials were transferred together in a single step onto a receiver substrate by laser pulses in the picosecond regime. The latter substrate formed the gate and the dielectric of the transistor. The results are compared with the step-by-step laser printing process, where electrodes and organic layer were successively printed from two different donor substrates. The multilayer laser printing reveals an improvement of the performances of the OTFT devices.     

双异质结结构的双极型有机薄膜晶体管的研制

制备了基于F₁₆CuPc和CuPc的双异质结结构的双极型有机薄膜晶体管。该器件的载流子迁移率是相同工艺制备的F₁₆CuPc和CuPc双层单异质结有机薄膜晶体管器件的4~5倍。同时,该双异质结结构还能调整载流子的阈值电压,减少双层结构对薄膜厚度等工艺条件的苛刻要求。这种双异质结结构为提升双极型有机薄膜晶体管器件的性能提供了一种有效方法。     

Total Ionizing Dose Effects of 55-nm Silicon-Oxide-Nitride-Oxide-Silicon Charge Trapping Memory in Pulse and DC Modes

The ~(60)Co-γ ray total ionizing dose radiation responses of 55-nm silicon-oxide-nitride-oxide-silicon(SONOS) memory cells in pulse mode(programmed/erased with pulse voltage) and dc mode(programmed/erased with direct voltage sweeping) are investigated. The threshold voltage and off-state current of memory cells before and after radiation are measured. The experimental results show that the memory cells in pulse mode have a better radiation-hard capability. The normalized memory window still remains at 60% for cells in dc mode and 76% for cells in pulse mode after 300 krad(Si) radiation. The charge loss process physical mechanisms of programmed SONOS devices during radiation are analyzed.     

Organic Thin Film Field Effect Transistors with PMMA-GMA Gate Dielectric

We fabricate organic thin films using the copolymer of methyl methacrylate and glycidyl methacrylate （PMMA- GMA） as a gate dielectric with a simple top-contact structure. Copper phthalocyanine （CuPc） TFTs are fabricated and the influences of annealing on the performance are studied. The mobilities increase from 2.5 × 10^3 cm^2/Vs to 4.2 × 10^3 cm^2/Vs and threshold voltages decrease from -18 V to -10 V after annealing. The good performances of the devices approach those obtained with inorganic gate dielectric materials such as silicon dioxide under the same technical conditions. It is fully proven that PMMA-GMA is a competitive candidate as an excellent gate insulation layer.     

Enhanced Total Ionizing Dose Hardness of Deep Sub-Micron Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effect Transistors by Applying Larger Back-Gate Voltage Stress

Owing to the fifll isolation and minimization of the silicon active volume, silicon-on-insulator （SOI） tech- nology has better resistance against transient ionizing effects like single event effects （SEE） or latch up.However, the total ionizing dose （TID） irradiation responses of SOI transistors are more complex than bulk-silicon devices. In addition to the gate and par- asitic field leakage current, which are common to SOI and bulk-silicon devices, irradiation induced charges trapped in the SOI buried oxide （BOX） can also affect SOI device performance. Typically, there is a par- asitic edge transistor in the back-gate of SOI devices paralleled with the main transistor, which is formed by the corner region of the silicon island. Due to the high electric field induced by the back-gate voltage at the corner of the silicon island, the threshold of the parasitic edge transistor is lower than the main transistor, resulting in a sub-threshold hump in the transfer characteristic of the back-gate transistor. Even though the threshold of the parasitic edge tran- sistor is lower than the main transistor, it is still larger than zero, which has no effect on the front- gate of devices. However, the sub-threshold hump in the back-gate is the ＇Achilles heel＇ for total dose responses of deep sub-micron SOI n-type metal-oxide- semiconductor field-effect transistors （MOSFETs） iso- lated by shallow trench isolation （STI）. As reported in Refs., the threshold of the parasitic edge transis- tor is negative shifted by radiation-induced charges trapped in STI, leading to off-state leakage in the front-gate of devices.     

电离辐射诱导的旁观者效应研究

列举了一些具有代表性的研究结果， 概括介绍了一些产生旁观者效应的可能机制以及辐照引起的活性氧基团或分子、 细胞通讯和细胞因子在旁观者效应中的重要作用. 此外， 还讨论了旁观者效应的表达程度与辐照剂量和射线品质的关系. 旁观者效应的研究结果表明: 辐射产生的潜在危害可能要比以前估计的大， 这给如何评估辐射对人类造成的危害带来了新的冲击. Recent studies have indicated that biological effects, such as chromosomal aberration, gene mutation and cell death and so on, can be induced in cells that are not traversed by radiation directly. This phenomenon has been termed as bystander effects. In this paper, a few representative studies were reported and the possible mechanisms underlying the bystander effects were summarized. The reactive oxygen species (ROS) induced by ionizing radiation, cellular communication and some factors play important roles. Besides, the expression extent of bystander effects depended on radiation dose and quality were discussed. Bystander effects suggest that potential health risks associated with radiation exposure may be greater than those of original thought and this makes ultimate impact on human radiation risk assessment.     

非晶InGaZnO薄膜晶体管驱动OLED像素电路的仿真研究

为解决非晶InGaZnO薄膜晶体管(a-IGZO TFT)因其阈值电压漂移而导致的OLED电流衰减的问题,本文研究了基于a-IGZO TFT的有源矩阵有机发光显示(AMOLED)像素电路的阈值电压补偿问题。利用实验室制备的a-IGZO TFT器件进行参数提取后建立的SPICE仿真模型并进行仿真计算,对电压驱动型2T1C和4T1C的像素电路进行稳定性的比较研究,证明了4T1C电路对阈值漂移有非常好的补偿效果,并指出增加存储电容值和驱动TFT的宽长比可有效提高OLED电流的保持能力。     

硅薄膜材料的光电导谱分析

利用甚高频等离子体增强化学气相沉积法（VHF-PECVD）,通过改变氢稀释比制备出一系列硅薄膜样品。由弱光条件下光电导谱分析了材料的吸收系数及缺陷态密度,结果表明随着氢稀释比的增加,材料的长波响应增大,缺陷态密度（NS）逐渐减小,当大于16.7时,NS开始增加,这是杂质与晶粒间界相互作用的结果。     

New Method of Total Ionizing Dose Compact Modeling in Partially Depleted Silicon-on-Insulator MOSFETs

On the basis of a detailed discussion of the development of total ionizing dose(TID) effect model,a new commercial-model-independent TID modeling approach for partially depleted silicon-on-insulator metal-oxidesemiconductor field effect transistors is developed.An exponential approximation is proposed to simplify the trap charge calculation.Irradiation experiments with ~(60)Co gamma rays for IO and core devices are performed to validate the simulation results.An excellent agreement of measurement with the simulation results is observed.     

Electrical Studies on Pentacene Thin Film Transistors with Different Channel Widths

In order to conduct electrical studies on organic thin film transistors, top-contact devices are fabricated by growing polycrystalline films of freshly synthesized pentacene over Si/SiO2 substrates with two different channel widths under identical conditions. Reasonable field effect mobilities in order of 10^-2-10^-3 cm^2V^-1s^-1 are obtained in these devices. An elaborative electrical characterization of all the devices is undertaken to study the variance in output saturation current, field effect mobility, and leakage current with aging under ambient conditions. As compared to the devices with longer channel width, the devices with shorter channel width exhibit better electrical performance initially. However, the former devices sustain the moderate performance much longer than the latter ones.     

电离总剂量对纳米SRAM器件单粒子翻转敏感性的影响

电离总剂量（TID）与单粒子效应（SEE）是纳米SRAM器件在航天应用中的主要威胁。随着CMOS工艺的进步,两种辐射效应在纳米SRAM器件中的协同效应出现了一些新现象,有必要进一步开展深入研究。利用γ射线以及不同种类重离子对两款纳米SRAM器件开展了辐照实验,研究了不同辐照参数、测试模式以及数据图形条件下,电离总剂量对单粒子翻转（SEU）敏感性的影响。研究结果表明,γ射线辐照过后,存储单元中反相器开关阈值减小,漏电流增大,导致SRAM存储单元抗翻转能力降低,SEU截面有明显增大;未观察到"印记效应",数据图形对测试结果没有明显影响;多位翻转（MBU）比例无明显变化。     

Performance Improvement of Organic Thin Film Transistors Based on Gate Insulator Polymethyl-Methacrylate-co-Glyciclyl-Methacrylate

Organic thin transistors （OTFTs） on indium tin oxide glass substrates are prepared with polymethyl-methacrylate-co-glyciclyl-methacrylate （PMMA-GMA） as the gate insulator layer and copper phthalocyanine as the organic semiconductor layer. By controlling the thickness, the average roughness of surface is reduced and the OTFT performance is improved with leak current decreasing to 10^-11 A and on/off ratio of 10^4. Under the condition of drain-source voltage -20 V, a threshold voltage of -3.5 V is obtained. The experimental results show that PMMA-GMA is a promising insulator material with a dielectric constant in a range of 3.9-5.0.     

新型低功耗金属氧化物TFT集成行驱动电路

金属氧化物薄膜晶体管(TFT)属于耗尽型器件,其集成的TFT的行驱动电路一般采用双负电源方案,存在与外围驱动芯片的匹配困难和功耗较大的不足。本文设计了一种新型耦合电路结构,可以产生比负电源更低的电压从而完全关闭输出模块的下拉晶体管,防止氧化物TFT耗尽模式引起的电流泄露问题,并由此设计了新型氧化物TFT行驱动电路拓扑。由于只采用一个负电源,其电源电压范围比采用双负电源方案的小,从而节省了功耗且有利于与外围驱动芯片的匹配连接。实验结果表明,基于刻蚀阻挡层(ESL)结构的氧化物TFT工艺,在玻璃衬底上成功制备了该行驱动电路,在电阻负载R_L=3 kΩ和容性负载C_L=30 pF下,所设计的行驱动电路在33.3 kHz时钟频率下实现脉宽10μs的全摆幅输出,每级功耗仅为160μW。基于新型耦合电路结构的行驱动电路能够满足60 Hz的刷新频率的1 980×1 080分辨率的显示需求。     

新型硅薄膜太阳能电池混合陷光结构

针对应用于薄膜太阳能电池的一种混合陷光结构进行了分析研究,该结构由位于电池正面的电介质颗粒和位于电池背面的金属颗粒构成.运用有限时域差分法模拟分析了正面电介质颗粒与背面金属颗粒对光吸收增强的不同作用范围.运用电场图分析了其对光吸收增强的机制,包括两种颗粒的散射作用和金属纳米颗粒的表面等离子体近场增强作用.分别优化了正面电介质颗粒和背面金属颗粒的材料、大小等参量,获得了一种优化后的混合陷光结构.实验表明带有这种混合陷光结构的电池短路电流密度相对于参考电池提高了30.3%,该方法为提高薄膜太阳能电池效率提供了新思路.     

退火温度对非晶铟钨氧薄膜晶体管特性的影响

非晶铟钨氧(a-IWO)薄膜晶体管(TFT)具有高迁移率和高稳定性的优点,但其适合于实际生产的制备工艺条件尚有待摸索。本文研究了退火温度对a-IWO TFT电学特性影响的基本规律和内部机理。实验结果表明,随着退火温度的升高,a-IWO TFT的场效应迁移率也相应增加,这是由于高温退火下a-IWO薄膜中氧空位含量增多并进而导致载流子浓度增加的缘故。此外,a-IWO TFT的亚阈值摆幅和阈值电压在200℃下退火达到最佳,我们认为主要原因在于此时a-IWO薄膜的表面粗糙度最小并形成了最佳的前沟道界面状态。     

溶胶凝胶法制备透明IZO薄膜晶体管

采用溶胶凝胶法制备了非晶铟锌氧化物(a-IZO)薄膜,并作为薄膜晶体管(TFT)的有源层制备了a-IZO TFT。研究了IZO薄膜中铟锌比对薄膜性质及a-IZO TFT器件性能的影响。结果表明:溶胶凝胶法制备的IZO薄膜经低温(300℃)退火后为非晶结构,薄膜表面均匀平整、致密,颗粒大小为20 nm左右,并具有高透过率(>85%)。IZO薄膜中的铟锌比对薄膜的电学性能和TFT器件特性影响显著,增加In含量有利于提高薄膜和器件的迁移率。当铟锌比为3∶2时,所获得的薄膜适合于作为薄膜晶体管的有源层,制备的IZO-TFT经过相对低温(300℃)退火处理具有较好的器件性能,阈值电压为1.3 V,载流子饱和迁移率为0.24 cm2·V-1·s-1,开关比(Ion∶Ioff)为105。     

Synthesis and Characterization of a Polycrystalline Ionic Thin Film by Large-Scale Molecular-Dynamics Simulation

A simulation methodology for the synthesis of polycrystalline, ionic thin films is developed. The method involves the preparation of a polycrystalline substrate onto which a thin film is subsequently grown by crystallization from the melt. A detailed structural analysis of a textured sixteen-grain FeO film, with a grain size of approximately 4.7 nm, shows that the interiors of the grains are almost perfect single crystals with only a very few vacancies and no interstitials. The grains are delineated by 001 tilt grain boundaries; as expected, the low-angle grain boundaries in the film consist of arrays of dislocations, while the high-angle grain boundaries are relatively narrow and well ordered.     

Influence of Total Ionizing Dose Irradiation on Low-Frequency Noise Responses in Partially Depleted SOI nMOSFETs

Total ionizing dose effect induced low frequency degradations in 130 nm partially depleted silicon-on-insulator(SOI) technology are studied by ~(60) Co γ-ray irradiation. The experimental results show that the flicker noise at the front gate is not affected by the radiation since the radiation induced trapped charge in the thin gate oxide can be ignored. However, both the Lorenz spectrum noise, which is related to the linear kink effect(LKE) at the front gate, and the flicker noise at the back gate are sensitive to radiation. The radiation induced trapped charge in shallow trench isolation and the buried oxide can deplete the nearby body region and can activate the traps which reside in the depletion region. These traps act as a GR center and accelerate the consumption of the accumulated holes in the floating body.It results in the attenuation of the LKE and the increase of the Lorenz spectrum noise. Simultaneously, the radiation induced trapped charge in the buried oxide can directly lead to an enhanced flicker noise at the back gate. The trapped charge density in the buried oxide is extracted to increase from 2.21×10~(18)eV~(-1)cm~(-3) to 3.59×10~(18)eV~(-1)cm~(-3) after irradiation.