Structural and optical features of nanoporous silicon prepared by electrochemical anodic etching

Nanoporous silicon (NPS) samples were prepared by electrochemical anodic etching of p-type (0 0 1) silicon wafers in HF solution, and some of them were aged in air. The nanostructural, optical and chemical features of the NPS were investigated in terms of etching and aging conditions. The surface of the porous Si exhibits an etched layer with a thickness of 30–40 nm; this layer appears to consist of aggregates of 5–10 nm size nano-crystallites. The NPS exhibited broad photoluminescence (PL) spectra with its peak in the red light region (740 nm). After aging the porous samples for 4 weeks in air, we observed the PL intensity became approximately a fifth of that of the as-prepared one, along with a blue shift. It is very likely that the blue shift of the PL peak was caused by the shrinkage of the Si nano-crystallites due to the oxidation in the surface of the nano-crystallites.     

Photoluminescence studies of porous silicon microcavities

Narrow photoluminescence peaks with a full-width at half-maximum of 14–20 nm are obtained from porous silicon microcavities (PSM) fabricated by the electrochemical etching of a Si multilayer grown by molecular beam epitaxy. The microcavity structure contains an active porous silicon layer sandwiched between two distributed porous silicon Bragg reflectors; the latter were fabricated by etching a Si multilayer doped alternatively with high and low boron concentrations. The structural and optical properties of the PSMs are characterised by scanning electron microscopy and photoluminescence (PL). The wavelength of the narrow PL peaks could be tuned in the range of 700–810 nm by altering the optical constants.     

Flat layered structure and improved photoluminescence emission from porous silicon microcavities formed by pulsed anodic etching

Single-mode, highly directional and stable photoluminescence (PL) emission has been achieved from porous silicon microcavities (PSMs) fabricated by pulsed electrochemical etching. The full width at half maximum (FWHM) of the narrow PL peak available from a freshly etched PSM is about 9 nm. The emission concentrates in a cone of 10° around the normal of the sample, with a further reduced FWHM of ∼5.6 nm under angle-resolved measurements. Only the resonant peak is present in such angle-resolved PL spectra. No peak broadening is found upon exposure of the freshly prepared PSM to a He-Cd laser beam, and the peak becomes somewhat narrower (∼5.4 nm) after the PSM has been stored in an ambient environment for two weeks. At optimized etching parameters, even a 4-nm FWHM is achievable for the freshly etched PSM. In addition, scanning electron microscopy (SEM) plane-view images reveal that the single layer porous Si formed by pulsed current etching is more uniform and flatter than that formed by direct current (dc) etching, demonstrated by the well-distributed circular pores with small size in the former in comparison with the irregular interlinking pores in the latter. The SEM cross-section images show the existence of oriented Si columns of 10 nm diameter along the etching direction within the active layer, good reproducibility and flat interfaces. It is thus concluded that pulsed current etching is superior to dc etching in obtaining flat interfaces within the distributed Bragg reflectors because of its minor lateral etching. Received: 7 March 2001 / Accepted: 23 July 2001 / Published online: 30 October 2001     

Amorphous Si/insulator multilayers grown by vacuum deposition and electron cyclotron resonance plasma treatment

a-Si/insulator multilayers have been deposited on (0 0 1) Si by electron gun Si evaporation and periodic electron cyclotron resonance plasma oxidation or nitridation. Exposure to an O or N plasma resulted in the formation of a thin SiO₂ and SiN_x layer whose thickness was self-limited and controlled by process parameters. For thin-layer (2 nm) Si/SiO₂ and Si/SiN_x multilayers no visible photoluminescence (PL) was observed in most samples, although all exhibited weak “blue” PL. For the nitride multilayers, annealing at 750°C or 850°C induced visible PL that varied in peak energy with Si layer thickness. Depth profiling of a-Si caps on thin insulating layers revealed no detectable contamination for the SiN_x layers, but substantial O contamination for the SiO₂ films.     

Investigation of structural and optical properties of nanoporous GaN film

The structural and optical characteristics of porous GaN prepared by Pt-assisted electroless etching under different etching durations are reported. The porous GaN samples were investigated by scanning electron microscopy (SEM), high-resolution X-ray diffraction (HR-XRD), photoluminescence (PL) and Raman scattering. SEM images indicated that the density of the pores increased with the etching duration; however, the etching duration has no significant effect on the size and shape of the pores. XRD measurements showed that the (0 0 0 2) diffraction plane peak width of porous samples was slightly broader than the as-grown sample, and it increased with the etching duration. PL measurements revealed that the near band edge peak of all the porous samples were red-shifted; however, the porosity-induced PL intensity enhancement was only observed in the porous samples; apart from that, two additional strain-induced structural defect-related PL peaks observed in as-grown sample were absent in porous samples. Raman spectra showed that the shift of E₂ (high) to lower frequency was only found in samples with high density of pores. On the contrary, the absence of two forbidden TO modes in the as-grown sample was observed in some of porous samples.     

Ellipsometric spectroscopy study of photoluminescent Si/SiO2 systems obtained by magnetron co-sputtering

Si nanograins embedded in silica matrix were obtained by magnetron cosputtering of both Si and SiO₂ at different substrate temperature (200–700°C) and thermal annealing at 1100°C. The samples were characterized by ellipsometric spectroscopy, high-resolution electron microscopy observations and photoluminescence. The highest excess of Si atoms was found to be incorporated for deposition temperature near 400–500°C, giving rise to a maximum PL and a shift of the peak position towards lower energy. These features might be interpreted in terms of quantum size effects and of density of grains, even though the interface states seem to be involved in the improvement of the photoluminescence efficiency.     

An AFM study of the processing of hydrogen passivated silicon(1 1 1) of a low miscut angle

We present atomic force microscopy (AFM) measurements from a passivated silicon crystal miscut by 0.1° and show the etching regime to be significantly different from surfaces with a larger miscut angle. A simple kinetic model is developed to explain the results and is used to derive the optimal etching conditions for nominally flat Si(1 1 1)–(1×1)H. We show that small changes in miscut angle can alter the kinetic steady state and promote the formation of deep etch pits, even on the least stable, miscut surface. Collisions of steps with these pits result in arrays of stable, self-aligned ‘etch hillocks' over micron dimensions. Following preparation, we use AFM to observe the initial growth of native oxide on the Si(1 1 1)–(1×1)H surface, and demonstrate that AFM is a sensitive probe to surface oxidation in the sub-monolayer regime.     

Preparation of atomically clean and flat Si(1 0 0) surfaces by low-energy ion sputtering and low-temperature annealing

Si(1 0 0) surfaces were prepared by wet-chemical etching followed by 0.3–1.5 keV Ar ion sputtering, either at elevated or room temperature (RT). After a brief anneal under ultrahigh vacuum (UHV) conditions, the resulting surfaces were examined by scanning tunneling microscopy. We find that wet-chemical etching alone cannot produce a clean and flat Si(1 0 0) surface. However, subsequent 300 eV Ar ion sputtering at room temperature followed by a 700 °C anneal yields atomically clean and flat Si(1 0 0) surfaces suitable for nanoscale device fabrication.     

Depth dependence of photoluminescence and chemical bonding in porous silicon

Porous silicon (PS) is studied by stepwise peeling of the surface layer to clarify the non-uniformity in the photoluminescence (PL) and correlate it with the in-depth chemical bonding and structure of the 30 μm thick layer. The PL intensity grows by an order of magnitude after the peeling off of the first 10 μm and decreases five times in the next 5 μm while the peak maximum position shifts from 730 to 800 nm. X-ray photoelectron spectroscopy (XPS) measurements show that Si–Si and Si–O bonds are present both on the surface and below, and the preferential oxidation state of silicon changes from 3+ and 4+ on the surface to 1+ and 2+ below 10 μm. Using Raman spectroscopy silicon nanocrystals are shown to exist. Their mean size can be estimated at about 3 nm. These results show that the strongest PL comes from a region in the PS layer where silicon nanocrystallites are surrounded by oxides with a low level of oxidation and not from the strongly oxidized surface layer.     

On the origin of 1.5 μm luminescence in porous silicon coated with sol–gel derived erbium-doped Fe2O3 films

Sol–gel derived Fe₂O₃ films containing about 10 wt% of Er₂O₃ were deposited on porous silicon by dipping or by a spin-on technique followed by thermal processing at 1073 K for 15 min. The samples were characterized by means of PL, SEM and X-ray diffraction analyses. They exhibit strong room-temperature luminescence at 1.5 μm related to erbium in the sol–gel derived host. The luminescence intensity increases by a factor of 1000 when the samples are cooled from 300 to 4.2 K. After complete removal of the erbium-doped film by etching and partial etching the porous silicon, the erbium-related luminescence disappears. Following this, luminescence at 1.5 μm originating from optically active dislocations (“D-lines”) in porous silicon was detected. The influence of the conditions of synthesis on luminescence at 1.5 μm is discussed.     

Structural and electrical properties of crystalline (1−x)Ta2O5−xTiO2 thin films fabricated by metalorganic decomposition

Polycrystalline (1−x)Ta₂O₅−xTiO₂ thin films were formed on Si by metalorganic decomposition (MOD) and annealed at various temperatures. As-deposited films were in the amorphous state and were completely transformed to crystalline after annealing above 600 °C. During crystallization, a thin interfacial SiO₂ layer was formed at the (1−x)Ta₂O₅−xTiO₂/Si interface. Thin films with 0.92Ta₂O₅–0.08TiO₂ composition exhibited superior insulating properties. The measured dielectric constant and dissipation factor at 1 MHz were 9 and 0.015, respectively, for films annealed at 900 °C. The interface trap density was 2.5×10¹¹ cm⁻² eV⁻¹, and flatband voltage was −0.38 V. A charge storage density of 22.8 fC/μm² was obtained at an applied electric field of 3 MV/cm. The leakage current density was lower than 4×10⁻⁹ A/cm² up to an applied electric field of 6 MV/cm.     

Dislocation-related luminescence in Er-implanted silicon

The behavior of luminescence spectra and structural defects in single crystal Czochralski silicon after erbium implantation at 1–1.8 MeV energies and 1×10¹³ cm⁻² dose with subsequent annealing at 1000–1200°C for 0.25–3 h in argon and a chlorine-containing ambience (CCA) was studied by photoluminescence (PL), transmission electron microscopy and chemical etching/Nomarski microscopy. We have found that annealing in CCA gives rise to dislocation loops and pure edge dislocations with dominant dislocation-related lines in the PL spectrum. Pure edge dislocations are responsible for the appearance of the lines.     

Effect of patterning on thermal agglomeration of ultrathin silicon-on-insulator layer

Effect of patterning on thermal agglomeration of ultrathin silicon-on-insulator (SOI) layer has been studied. A square-shaped 12 nm thick SOI layer was patterned by lithography and by selective etching with a KOH solution. The structural change by ultrahigh vacuum annealing in a temperature range of 900–1100 °C was observed by atomic force microscopy. The agglomeration takes place preferentially from the pattern edges at a lower annealing temperature than that for the unpatterned layer, indicating enhanced diffusion of Si atoms at the edges. Additionally, the patterning causes formation of smaller islands than those for the unpatterned layer, reflecting that the patterning limits the amount of Si atoms supplied for the island formation.     

EXAFS analysis of Er sites in Er–O and Er–F co-doped crystalline Si

We present extended X-ray absorption fine structure (EXAFS) and photoluminescence (PL) analyses of Er–O and Er–F co-doped Si. Samples were prepared by multiple implants at 77 K of Er and co-dopant (O or F) ions resulting in the formation of a2 μm thick amorphous layer uniformly doped with 1×10¹⁹ Er/cm³ and 3×10¹⁹ O/cm³, 1×10²⁰ O/cm³ or 1×10²⁰ F/cm³. EXAFS measurements show that the local environment of the Er sites in the amorphous layers consists of 6 Si first neighbors. After epitaxial regrowth at 620°C for 3 h, Er is fully coordinated with 8 F ions in the Er–F samples, while Si and O ions are concomitantly present in the first shell of O co-doped samples. Post regrowth thermal treatments at 900°C leave the coordination unchanged in the Er+F, while the Er+O (ratio 1 : 10) doped samples present Er sites with a fully O coordinated shell with an average of 5 O atoms and 4 O atoms after 30 s and 12 h, respectively. We have also found that the fine structure and intensity of the high-resolution PL spectra are strongly dependent on the Er-impurity ratio and on thermal process parameters in the Er–O co-doped samples, while this is not observed for the F-doped samples. The most intense PL response at 15 K was obtained for the 1 : 3 E : O ratio, suggesting that an incomplete O shell around Er is particularly suitable for optical excitation.     

Effect of thermal annealing on pore density,pore size and pore homogeneity of polycarbonate NTFs

When an energetic and electrically charged beam of particles penetrates a nonconducting material, like crystal, polymer, etc., a permanent change in the nature of the chemical matrix along its path occurs giving rise to damaged sites known as latent tracks having diameter of the order of 10 nm. These tracks show an enhanced chemical reactivity as compared to the surrounding material; and, on etching, the damaged sites are enlarged forming nuclear track filters (NTFs). The NTFs so formed find applications in the fields as nuclear physics, geology, radiation dosimetry, material research, medicine and environmental studies. The pore density and pore size homogeneity are important traits of NTFs. These NTFs are also employed for the production of micro/nanostructures through template synthesis which finds various applications for the fabrication of sensors, devices and in the field of opto-electronics. The pore size of the NTF is generally not uniform due to various reasons like material defects in solid state nuclear track detectors (SSNTDs), nonuniform flux density of irradiating beam, variation in the angle of exposure during irradiation, temperature gradient in the etching solution, etc. The present work reports the development of NTFs and study of the effect of pre-etch thermal annealing of irradiated polycarbonate thin films (SSNTDs) on the density and homogeneity of etched pores in developed NTFs. NTFs were developed by irradiating Makrofol (KG) with heavy-ion beam at the UNILAC, Gesellschaft fur Schwerionenforschung (GSI), Darmstadt, Germany and then chemically etching of annealed and unannealed irradiated samples. The pore size, pore density and pore size homogeneity of the NTFs were compared for annealed and unannealed samples. The study indicates decrease in pore size, pore density and increase in homogeneity of pores with post-irradiation and pre-etch thermal annealing. The uniformity of the pores of NTF will lead to uniformity of micro/nanostructures fabricated by using the pores as templates. These uniform micro/nanostructures can act as excellent charge sprayers in the cold cathode emitters.     

多孔硅的微结构与发光特性研究

利用原子力显微镜（AFM）和光致荧光（PL）光谱对一系列直流腐蚀和脉冲腐蚀的多孔硅的微结构及发光特性进行了对比研究．表面和侧面的AFM结果表明，多孔硅表面呈“小山”状，有许多小的、突出的硅颗粒．在相同的腐蚀条件（等效）下，脉冲腐蚀的样品表面Si颗粒更加尖锐、突出，侧面的线状结构更明显，多孔硅层更厚．对应的PL谱，脉冲腐蚀的样品发光更强．量子限制效应的理论可以比较成功地解释这个结果 关键词：     

Atom probe tomography of 15Kh2MFA Cr–Mo–V steel surveillance specimens

An atom probe study has been performed on 15Kh2MFA base and 10KhMFT weld metal surveillance specimens from a VVER-440/213C reactor to investigate the mechanisms that produce embrittlement in low copper materials during service. The composition of the base metal was Fe-0.06 at.% Cu, 3.1% Cr, 0.34% V, 0.46% Mn, 0.35% Mo, 0.07% Ni, 0.34% Si, 0.74% C, 0.025% P, and 0.028% S. The base material was characterized after thermal aging for 10 years at 295°C and after neutron irradiation at 270°C for 10 years to a fluence of 1.0×10²⁵ m⁻² (E>0.5 MeV). The ductile-to-brittle transition temperatures (DBTT) of the base metal were −49, −70 and 141°C, for the unirradiated, thermally aged and neutron irradiated conditions, respectively. The composition of the weld metal was Fe-0.05 at.% Cu, 1.46% Cr, 0.22% V, 1.11% Mn, 0.29% Mo, 1.17% Si, 0.17% C, 0.02% P, and 0.029% S. The weld material was characterized after tempering for 18 h at 690°C plus a simulated stress relief treatment of 43.5 h at 680°C, after thermal aging for 5 years at 295°C, and after neutron irradiation at 275°C for 5 years to a fluence of 5.2×10²⁴ m² (E>0.5 MeV). The DBTTs were 7, 11 and 123°C, respectively, for these three conditions. A high number density of ultrafine manganese- and silicon-enriched regions was observed in both neutron-irradiated materials. Phosphorus segregation was observed at the VC-matrix interface and at grain boundaries.     

The effect of bio-conjugation on aging of the photoluminescence in CdSeTe–ZnS core–shell quantum dots

The aging of the photoluminescence (PL) in bio-conjugated and non-conjugated CdSeTe–ZnS core–shell quantum dots (QDs) is studied by the micro-PL, micro-Raman and X-ray diffraction (XRD) in the samples of buffered QD solution dried on a crystalline Si wafer and stored in the atmospheric ambience for about 2 years. The aging of the PL consists in a “blue” spectral shift of the PL band, an increase in PL band half-width and the decrease in the PL intensity. These changes are more pronounced in the conjugated QD samples. The XRD analysis of the aged samples revealed that the QD core diameter is reduced by ∼1.5 nm in the conjugated QDs as compared to the non-conjugated ones. The possible mechanism of PL spectrum aging is the oxidation that decreases the QD core dimension. It is concluded that the bio-conjugation promotes QD oxidation and the mechanism of the effect is proposed.     

Time evolution of interface roughness during thermal oxidation on Si(0 0 1)

The surface morphological change at an initial stage of thermal oxidation on Si(0 0 1) surface with O₂ was investigated as a function of oxide coverage by a real-time monitoring method of Auger electron spectroscopy (AES) combined with reflection high energy electron diffraction (RHEED). At 653 °C where oxide islands grow laterally, protrusions were observed to develop under the oxide islands as a consequence of concurrent etching of the surface. The rate of etching was measured from a periodic oscillation of RHEED half-order spot intensity I_(1/2,0) and I_(0,1/2). At 549 °C where Langmuir-type adsorption proceeds, it was observed that both I_(1/2,0) and I_(0,1/2) decrease more rapidly in comparison with an increase of oxide coverage and the intensity ratio between them decreases gradually with O₂ exposure time. These suggest that Langmuir-type adsorption occurs at sites where O₂ adsorbs randomly, leading to subdivision of the 2×1 and 1×2 domains by oxidized regions, and that Si atoms are ejected due to volume expansion in oxidation to change the ratio between 2×1 and 1×2 domains.     

Photoluminescence and electroluminescence investigations at Ge-rich SiO2 layers

Strong blue and violet photo (PL) and electroluminescence (EL) at room temperature was obtained from SiO₂-films grown on crystalline Si, which were either single (SI) or double implanted (DI) with Ge ions and annealed at different temperatures. The PL spectra of Ge-rich layers reach a maximum after annealing at 500–700°C for DI layers or 900–1000°C for SI layers, respectively. Both, PL and EL of 500 nm thick Ge-rich layers are easily visible by the naked eye at ambient light due to their high intensity. Based on excitation spectra we tentatively interpret the blue PL as due to the oxygen vacancy in silicon dioxide.

The EL spectrum of the Ge-implanted oxide correlates very well with the PL one and shows a linear dependence on the injected current over three orders of magnitude. For DI layers much higher injection currents than for SI layers can be achieved. An EL efficiency in the order of 10⁻⁴ for Ge⁺-implanted silicon dioxide was determined.