Microfluidic chip fabrication using hot embossing and thermal bonding of COP

The application of silicon mold inserts by micro‐hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU‐8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU‐8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro‐hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de‐molding temperature) for the cycle‐olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De‐molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip. Copyright © 2009 John Wiley & Sons, Ltd.     

The application of elastic auxiliary air bag imprinting technology to the development of linear gradient micro‐structure replication processes

This study proposed an innovative imprinting process technology using an elastic auxiliary air bag imprinting mechanism, combined with poly(dimethylsiloxane) (PDMS) soft mold and UV–LED array photocuring equipment, to evenly imprint and reproduce a micro‐lens mold into a gradient micro‐lens structure in order to achieve linear gradient in micro‐structures. The structure defined by the proposed process technology is more continuous and smoother than that of the current semi‐conductor gray scale photomasking process technology. The process is simpler, faster, and less expensive and is a more effective option for satisfying the formation requirements of different structural heights. This study used pressure‐sensitive film to test and discuss gradient imprint force distribution. The test results suggested that different spring constants led to tilt impressions, which caused the PDMS soft mold to contact with the substrate surface at different pressures. The color depth distribution of the pressure‐sensitive film testing results indicated that the spring constant and pressure distribution were somewhat correlated. Hence, the height of structural formation can be controlled by different spring constants. Finally, SEM and surface profiler measurements suggested that different spring constants can result in different tilt degrees of the imprinting platform of air bag imprinting applications for the imprinting and reproduction of smooth, continuous micro‐lens array structures of different heights. Copyright © 2012 John Wiley & Sons, Ltd.     

A novel electromagnetism‐assisted imprinting technology to replicate microstructures onto a large‐area curved surface using a flexible magnetic mold

Replication of microstructures from a mold onto a curved surface is difficult. The conformal contact between the mold and the substrate has to be ensured. The present study proposes an innovative mechanism, which employs an electromagnetic disk to provide magnetic force and a PDMS flexible mold with a layer compounded magnetic powder. This mechanism provides not only the gradual contact from center to edge to avoid air entrapment but also conformal contact between the mold and the substrate during the imprinting operation. A system based on this electromagnetic soft imprinting technology has been implemented, and imprinting to replicate microstructures from the mold onto a curved surface has been carried out. The results reveal that the PDMS magnetic mold and the electromagnetic disk‐controlled magnetic force can successfully perform the imprinting and accurately replicate the microstructures onto the large‐area, curved surface glass. The PDMS flexible magnetic mold incorporated with the magnetic disk can be employed to achieve the conformal contact between the mold and the substrate. In addition, due to the low surface free energy of the PDMS, the de‐molding without sticking can be easily accomplished. Copyright © 2008 John Wiley & Sons, Ltd.     

Micro fabrication of microlens arrays by micro dispensing

In this study, master of the microlens arrays is fabricated using micro dispensing technology, and then electroforming technology is employed to replicate the Ni mold insert of the microlens arrays. Finally, micro hot embossing is performed to replicate the molded microlens arrays from the Ni mold insert. The resin material is used as the dispensing material, which is dropped on a glass substrate. The resin is exposed to a 380 W halogen light. It becomes convex under surface tension on the glass substrate. A master for the microlens arrays is then obtained. A 150‐nm‐thick copper layer is sputtered on the master as an electrically conducting layer. The electroforming method replicates the Ni mold insert from the master of the microlens arrays. Finally, micro hot embossing is adopted to replicate the molded microlens arrays. The micro hot embossing experiment employs optical films of polymethylmethacrylate (PMMA) and polycarbonate (PC). The processing parameters of micro hot embossing are processing temperature, embossing pressure, embossing time, and de‐molding temperature. Taguchi's method is applied to optimize the processing parameters of micro hot embossing for molded microlens arrays. An optical microscope and a surface profiler are utilized to measure the surface profile of the master, the Ni mold insert and the molded microlens arrays. AFM is employed to measure the surface roughness of the master, the Ni mold insert and the molded microlens arrays. The sag height and focal length are determined to elucidate the optical characteristics of the molded microlens arrays. Copyright © 2009 John & Sons, Ltd.     

Applying magnetic soft mold imprint technology with ultraviolet light‐emitting‐diode array on the fabrication of microlens arrays

This study proposed a novel technology, which uses exposed technology with ultraviolet light‐emitting‐diode (UV‐LED) arrays and the polydimethylsiloxane (PDMS) magnetic flexible soft mold imprint technology, to develop exposed equipments with UV‐LED arrays. This study used magnetic soft mold imprint technology to replicate the structure of microlens, providing a more effective alternative for imprint technology and application. The measurement results showed that PDMS with magnetic iron powder can precisely cast mold to replicate the structures of microlens. Electromagnetic plates were used to control even imprinting with magnetic force, in order to fill the mold of micro‐structure of the photo‐resist. Magnetic iron powder was added to PDMS to produce composite material, which can effectively avoid the transformation of pure PDMS during soft mold imprinting, and increase mechanical strength. Magnetic PDMS soft mold is easy to make, and the casting time is short, so that costs can be effectively reduced. Also with advantages of less free energy on its surface, and unlikely to adhere to the photo‐resist during imprinting, it can be combined with electromagnetic plates evenly to control the magnetic soft mold. This imprinting technology is a big advantage to the production process of micro‐structures during imprinting. Copyright © 2009 John Wiley & Sons, Ltd.     

Evolution of surface topography and optical band gap of ZnO film deposited on NiO/Si(100)

Evolution of surface features and optical band gap of ZnO thin films deposited on different NiO/Si(100) are reported. In order to create different initial microstructure, we first deposited NiO film on Si(100) at 3 different temperatures (400°C, 650°C, and 700°C) by pulsed laser deposition. These NiO/Si(100) films are used as substrate for the deposition of ZnO films. Combining the results obtained from grazing incidence X‐ray diffraction, atomic force microscope, and UV‐Visible characterization, our study indicated that the microstructure of the substrate takes the important role in dictating properties of the film. Our study also indicated that one needs to choose appropriate synthesis condition to achieve good quality ZnO films.     

Novel thermosets obtained by UV‐induced cationic copolymerization of DGEBA with an spirobislactone

The photocuring process of the diglycidyl ether of bisphenol A (DGEBA) with the bislactone 1,6‐dioxaspiro[4,4]nonane‐2,7‐dione (s(γ‐BL)) was studied. Triarylsulfonium hexafluoroantimonate was employed as photoinitiator. FTIR/ATR was used to study the evolution of epoxy, lactone, and intermediate spiroorthoester groups to identify the different reactions that take place during the photocuring process. Photo‐DSC and DSC were used to study the thermal evolution of the photocuring process and to assess the T_g of the fully cured material. Thermogravimetric analysis (TGA) was used to determine the thermal stability of the fully cured material. The thermomechanical properties of the materials were investigated using dynamic mechanical‐thermal analysis. Shrinkage undergone during photocuring and gelation was studied with TMA. A strong influence of the photocuring temperature on the photocuring process of the DGEBA‐ s(γ‐BL) system was observed. Differences in the reactivity of the different species were observed with respect to the thermally cured system using ytterbium triflate as cationic thermal initiator. As a consequence, photocured materials exhibited a superior thermal stability and lower flexibility. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 5446–5458, 2007     

Fabrication of buried waveguide microstructure using gas‐assisted micro/nanoimprinting with soft mold

Due to the limitations on the choice of wavelengths available for light source, nanograde structures are facing technological bottlenecks and their method of preparation using current lithography and imaging technology is extremely costly. The idea is thus born to develop a nanopressuring and manufacturing technology, in order to further develop a low‐cost and more reliable technology to manufacture nanodevices in full scale. This study combines the characteristics of soft lithography, photo‐resist, and gas‐assisted pressuring, as well as studies the use of gas‐assisted pressuring and soft mold to emboss photo‐resist to manufacture optical waveguide devices, such that the nanopressuring technology may be more mature. Study results show that polydimethylsiloxane (PDMS) is able to accurately emboss and replicate nanograde buried waveguide structures, by using even pressure gas to achieve full contact with the surface of the substrate thus greatly increasing the effective pressuring area. Also, PDMS soft molds are easier to make with short embossing time to effectively reduce cost. Another advantage of combining gas‐assisted pressuring with PDMS soft molds in the manufacturing process is that PDMS soft molds possess low free energy on the surface and are difficult for resist to adhere. Copyright © 2007 John Wiley & Sons, Ltd.     

Study on growth rate of TiO2 nanostructured thin films: simulation by molecular dynamics approach and modeling by artificial neural network

Effects of the deposition process parameters on the thickness of TiO₂ nanostructured film were simulated using the molecular dynamics (MD) approach and modeled by the artificial neural network (ANN) and regression method. Accordingly, TiO₂ nanostructured film was prepared experimentally with the sol–gel dip‐coating method. Structural instabilities can be expected, due to short‐ and/or long‐range intermolecular forces, leading to the surface inhomogeneities. In the MD simulation, the Morse potential function was used for the inter‐atomic interactions, and equations of motion for atoms were solved by Verlet algorithm. The effect of the withdrawal velocity, drying temperature and number of deposited layers were studied in order to characterize the film thickness. The results of MD simulations are reasonably consistent with atomic force microscopy, scanning electron microscopy and Dektak surface profiler. Finally, the outputs from experimental data were analyzed by using the ANN in order to investigate the effects of deposition process parameters on the film thickness. In this case, various architectures have been checked using 75% of experimental data for training of the ANN. Among the various architectures, feed‐forward back‐propagation network with trainer training algorithm was found as the best architecture. Based on the R‐squared value, the ANN is better than the regression model in predicting the film thickness. The statistical analysis for those results was then used to verify the fitness of the complex process model. Based on the results, this modeling methodology can explain the characteristics of the TiO₂ nanostructured thin film and growth mechanism varying with process conditions. © 2013 The Authors. Surface and Interface Analysis published by John Wiley & Sons Ltd.     

Superhydrophilic/superhydrophobic surfaces fabricated by spark‐coating

In this study, the authors researched the preparations of superhydrophilic/superhydrophobic surfaces on commercial cup stock polyethylene coated papers by using sparked aluminum nanoparticles deposited on substrates through a sparking process. In this stage, the surface was porous and showed superhydrophilic properties. The samples were then annealed in air at various temperatures and some transformed to superhydrophobicity. It is well known that a suitable roughness in combination with low surface energy has been required to obtain superhydrophobic surfaces. Therefore, it is believed that during annealing process, when polyethylene is diffused from the substrate through the nanoparticle films and the superhydrophobic characteristics were created. The scanning electron microscope images showed that the film surfaces had a fluffy structure for both the as‐deposited and the annealed samples. However, the atomic force microscopy phase images showed completely different surface properties. Moreover, the X‐ray photoelectron spectroscopy spectra showed different surface chemical compositions. The experimental results revealed that the working temperature to produce superhydrophobic surfaces depended on the sparked film thickness. Furthermore, in order to prove the assumption explained above, glass and poly (methyl methacrylate) were also used as substrates.     

Molecular orientation of a ZnS‐nanocrystal‐modified M13 virus on a silicon substrate

The surface structure and cast film formation process of a ZnS‐nanocrystal‐modified M13 bacteriophage (ZnS–M13) were investigated. A ZnS–M13 film oriented under the influence of a capillary force was obtained on both single‐crystal and polycrystalline substrates. The film formation process was investigated with atomic force microscopy and scanning electron microscopy. The surface images showed that the degree of orientation of the molecular long axes greatly depended on the direction of force and the concentration of aqueous solutions. Controlling the aqueous solution concentration yielded a highly oriented ZnS–M13 film on an indium tin oxide plate. The ability to control the orientation of virus‐based films may lead to new types of hybrid materials in which the components are organized on several length scales. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 629–635, 2004     

Electrodeposition Under High Magnetic Field

The film growth under high magnetic field using a super-conducting magnet is discussed from the view point of a magnetization energy. The film configuration in nickel eletrodeposits with and without the high magnetic field was examined by means of the AFM (Atomic Force Microscopy), In the absence of magnetic field, the film surface appeared irregular structure. However, when the magnetic field was imposed in parallel to the cathode plate, nickel deposited shown clearly ordered stationary structure. The experimental results could be explained by nickel magnetic anisotropy. On the other hand, when the field was imposed in perpendicular to a cathode plate, deposition structure is controlled by the fluid motion induced by Lorentz force.     

Acrylic polymer/silica hybrid for electron‐beam resists

An acrylic polymer/silica hybrid resist film was investigated for fabricating a microstructure by electron‐beam (EB) lithography. EB lithography on the hybrid thin film afforded a positive pattern whose depth corresponded to the EB exposure dose; this indicated that the hybrid was an analog resist and could fabricate a three‐dimensional microstructure. The resist film had high heat resistance and compatibility with the underlying quartz plate, probably because of the silica component. The acrylic polymer/(RSiO_1.5)_n hybrid film showed higher EB sensitivity than a film of the crosslinked acrylic polymer and an acrylic polymer/(SiO₂)_n hybrid. Atomic force microscopy observation of the hybrid film surface showed the homogeneous dispersion of the acrylic polymer and the silica components in the hybrid film. The acrylic polymer component was EB‐sensitive, whereas dispersing the acrylic polymer and silica components homogeneously also played an important role in increasing the EB sensitivity. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2107–2116, 2006     

Origins for epitaxial order of sexiphenyl crystals on muscovite(001)

The epitaxial order of sexiphenyl crystals on muscovite(001) is investigated by x‐ray diffraction, lattice misfit calculations and atomic force microscopy. Depending on the substrate temperature during the thin film growth process, different epitaxial orientations are formed. Sexiphenyl thin films prepared at 370 K preferentially form crystals with the crystallographic (11‐1) planes parallel to the substrate surface while at 434 K a strong fraction of crystals with (11‐2) orientations is grown. The epitaxial orders of sexiphenyl crystals are compared with lattice misfit calculations. The in‐plane order of the {11‐1} crystals can be explained by a point‐on‐line coincidence I, which reveals that the interface is formed by undisturbed crystal surfaces. The epitaxial order of the {11‐2} oriented crystals is characterised by the experimental observation that low indexed crystal directions in the sexiphenyl(11‐2) plane and the muscovite(001) surface coincide with each other, forming a near‐coincidence case. Corrugations of the substrate surface are responsible for this second type of epitaxial order. Characteristic features in the thin film morphology could be correlated to the two observed epitaxial orientations of the sexiphenyl crystals. Copyright © 2009 John Wiley & Sons, Ltd.     

Fabrication of plastic microchips by hot embossing

Plastic microchips with microchannels (100 microm wide, 40 microm deep) of varying designs have been fabricated in polymethylmethacrylate by a hot embossing process using an electroform tool produced starting with silicon chip masters. Hot-embossed chips were capped with a polymethylmethacrylate top using a proprietary solvent bonding process. Holes were drilled through the top of the chip to allow access to the channels. The chips were tested with fluid and shown to fill easily. The seal between the top of the chip and the hot embossed base was effective, and there was no leakage from the channels when fluid was pumped through the microchannels. The chips were also tested with a semen sample and the plastic chip performed identically to the previous silicon-glass and glass versions of the chip. This microfabrication technique offers a viable and potentially high-volume low cost production method for fabricating transparent microchips for analytical applications.     

Fabrication of microfluidic chip using micro‐hot embossing with micro electrical discharge machining mold

This study develops an improved method for generating aluminum mold inserts used in the replication of polymer‐based microfluidic chip. Since molding masters that are suitable for microfluidic chip replication must have features whose dimensions are of the order of tens to hundreds of microns, micro electrical discharge machining is employed herein to fabricate an aluminum mold insert of a microfluidic chip. The width and depth of the aluminum mold insert for the microfluidic chip are 61.50 and 49.61 µm, respectively. The surface roughness values of the microchannel and the sample reservoir in aluminum mold insert for the microfluidic chip are 53.9 and 34.3 nm, respectively. PMMA material is adopted as the molded microfluidic chip that is produced by micro‐hot embossing molding. The PMMA material can replicate the microchannel and sample reservoir very well when the aluminum mold insert is used in micro‐hot embossing molding. The results indicate that the most important parameter in the replication of molded microfluidic chip is the embossing pressure, which is also the most important parameter in determining the surface roughness of the molded microfluidic chip. Copyright © 2010 John Wiley & Sons, Ltd.     

单宁酸改性制备光敏碳纳米管及UV光固化AESO复合膜的制备

本文以单宁酸（TA）和甲基丙烯酸缩水甘油酯（GMA）为原料，通过开环反应制备出含有双键的光敏单宁酸（pTA），并通过π-π非共价键作用使其吸附到碳纳米管上，得到pTA修饰后的具有良好分散性的光敏碳纳米管（pTA/MWCNTs）。再将该pTA/MWCNTs作为填料添加到环氧大豆油丙烯酸酯（AESO）中，通过UV光固化得到AESO-pTA/MWCNTs复合膜。利用pTA对MWCNTs进行改性，提高了MWCNTs的分散性，同时引入双键，使得pTA/MWCNTs能够参与到光固化过程中，提高了碳纳米管与AESO基质间的界面粘结力，对AESO起到了比较好的增强作用。本文还研究了pTA/MWCNTs的加入对AESO复合涂料光固化动力学及涂膜性能的影响，结果表明该pTA/MWCNTs的掺入提高了光固化AESO复合膜的力学性能，当掺入量为0.8%时，对膜的增强效果最好，与纯AESO比较，其拉伸模量提高了390%，拉伸强度提高了110%。     

Surface modification of plasma‐pretreated expanded poly (tetrafluroethylene) films by graft copolymerization

A two‐step process based on a low‐pressure helium plasma treatment followed by acrylic acid‐grafting copolymerization was used for the surface modification of expanded polytetrafluoroethylene (ePTFE) films. The effects of plasma treatment power and treatment time on the hydrophilicity of the film surface were investigated. The wettability of the ePTFE film surface was characterized by water contact angle, and the surface compositions of the untreated and treated ePTFE samples were evaluated by atomic force microscopy and XPS. Contact angle measurements revealed that the hydrophilicity of the ePTFE film surface was greatly enhanced by the combined actions of the plasma treatment and acrylic acid grafting, and the contact angle decreased from 145° to 66°. Atomic force microscopy analyses showed that the surface roughness increased after the plasma treatment. XPS analyses showed substantial increase in the concentration of carbon and oxygen atoms and a decrease in the concentration of fluorine atoms at the film surface. T‐peel strength showed an improved bonding strength between the film and an adhesive tape after the treatment. Copyright © 2012 John Wiley & Sons, Ltd.     

Studies of photosensitive alignment layer based on ladder‐like polysilsequioxane liquid‐crystal devices using atomic force microscopy/force curve

Atomic force microscopy (AFM)/force curve measurements were used to study the photochemical process of UV‐treated (0, 10, 20, 30 and 60 min) organic thin films that were prepared from azobenzene and cinnamate side‐chain co‐grafted ladder‐like polysilsequioxanes (LPS). The morphological data of the thin films describe the changing process on the surface of the thin film. The statistical results of the adhesion force of the thin films further demonstrate the intermolecular characteristics of the thin films. A photosensitive thin film after UV exposure for 20 min would be a better material with a preferred orientation that can be used to make liquid‐crystal devices. Copyright © 2003 John Wiley & Sons, Ltd.     

Microstructure and surface roughness of graphite‐like carbon films deposited on silicon substrate by molecular dynamic simulation

Molecular dynamics simulations are performed on the atomic origin of the growth process of graphite‐like carbon film on silicon substrate. The microstructure, mass density, and internal stress of as‐deposited films are investigated systematically. A strong energy dependence of microstructure and stress is revealed by varying the impact energy of the incident atoms (in the range 1–120 eV). As the impact energy is increased, the film internal stress converts from tensile stress to compressive stress, which is in agreement with the experimental results, and the bonding of C‐Si in the film is also increased for more substrate atoms are sputtered into the grown film. At the incident energy 40 eV, a densification of the deposited material is observed and the properties such as density, sp³ fraction, and compressive stress all reach their maximums. In addition, the effect of impact energy on the surface roughness is also studied. The surface morphology of the film exhibits different characteristics with different incident energy. When the energy is low (<40 eV), the surface roughness is reduced with the increasing of incident energy, and it reaches the minimum at 50 eV. Copyright © 2012 John Wiley & Sons, Ltd.