影响IGBT器件短路能力的一种栅极振荡现象研究

功率器件IGBT由于其优异特性而广泛应用于电机、电焊机和功率开关等领域,是功率器件的主流产品之一.本文首先介绍了IGBT的短路特性及测试方法和条件,分析了栅极异常振荡对IGBT的短路电流的影响,提出了改善IGBT器件短路能力的方法.     

影响IGBT器件短路能力的一种栅极振荡现象研究

功率器件IGBT由于其优异特性而广泛应用于电机、电焊机和功率开关等领域,是功率器件的主流产品之一。本文首先介绍了IGBT的短路特性及测试方法和条件,分析了栅极异常振荡对IGBT的短路电流的影响,提出了改善IGBT器件短路能力的方法。     

新颖的IGBT SPICE模型及非破坏参数提取和验证

提出并优化了一种和现有SPICE软件如HSPICE完全兼容的IGBT等效电路模型.该模型摒弃了双极晶体管的所谓准静态假设而用精确的双极输运理论进行分析,更符合IGBT的实际工作条件.利用电压控制可变电阻模型等效IGBT的n-外延层的电导调制效应,取得了很好的效果.基于器件的非破坏实测参数以器件物理方程为基础的模型参数提取,计算依据正确,物理意义明确.用该模型计算了IGBT的I-V特性、开关特性等,与实测符合较好,误差不超过8%,此结果比已报道的同类模型要好,且更为简单方便.     

大功率IGBT参数建模与仿真分析

介绍了绝缘栅双极性晶体管的模型分类及常见的电力电子仿真软件,并分析了各自的特点.针对2 kV/2 kA全固态调制器组件设计中使用的大功率绝缘栅双极性晶体管(3.3 kV/1.2 kA),根据具体参数,建立了基于Saber的行为模型.重点分析了该模型的静态和动态特性仿真表现.通过对比手册参数曲线和实际测量结果,验证了该大功率绝缘栅双极性晶体管模型的有效性,为大功率脉冲电路的进一步分析和优化设计提供了参考.     

新颖的IGBT SPICE模型及非破坏参数提取和验证

提出并优化了一种和现有SPICE软件如HSPICE完全兼容的IGBT等效电路模型.该模型摒弃了双极晶体管的所谓准静态假设而用精确的双极输运理论进行分析,更符合IGBT的实际工作条件.利用电压控制可变电阻模型等效IGBT的n- 外延层的电导调制效应,取得了很好的效果.基于器件的非破坏实测参数以器件物理方程为基础的模型参数提取,计算依据正确,物理意义明确.用该模型计算了IGBT的I- V特性、开关特性等,与实测符合较好,误差不超过8% ,此结果比已报道的同类模型要好,且更为简单方便.     

IGBT焊料层中的空洞对器件热可靠性的影响

根据IGBT的基本结构和工作原理,建立了一种新的IGBT三维热模型。该模型考虑了Si材料的温度特性,模拟研究了焊料层空洞对器件热稳定性的影响。研究表明焊料层空洞对IGBT器件的热稳定性有很大的影响。实测结果、超声波显微镜以及红外显微镜的扫描图片证实模拟结果。该研究结果对于改进IGBT器件的可靠性有一定意义,值得器件应用工程师、设计及工艺工程师参考。     

功率器件IGBT槽栅设计尺寸对直流参数影响的研究

IGBT由于其优异特性而广泛应用于电机、电焊机和功率开关等领域,是功率器件的主流产品之一。本文首先简要介绍IGBT及历代器件工艺的发展,提出了一种槽栅IGBT的工艺流程,并研究了其槽栅设计尺寸对器件主要直流参数的影响。     

电子辐照对槽栅IGBT器件参数影响分析

功率器件IGBT由于其优异特性而广泛应用于电机、电焊机和功率开关等领域,是功率器件的主流产品之一。本文首先介绍了电子辐照技术在改善IGBT关断时间的应用,以及该技术在槽栅IGBT应用中出现的异常现象,并提出了改善此类异常现象的器件制造方法。     

逆导IGBT实现Snapback-Free所需最小P-emitter长度的理论计算

A physically based equation for predicting required p-emitter length of a snapback-free reverse- conducting insulated gate bipolar transistor （RC-IGBT） with field-stop structure is proposed. The n-buffer resis- tances above the p-emitter region with anode geometries of linear strip, circular and annular type are calculated, and based on this, the minimum p-emitter lengths of those three geometries are given and verified by simulation. It is found that good agreement was achieved between the numerical calculation and simulation results. Moreover, the calculation results show that the annular case needs the shortest p-emitter length for RC-IGBT to be snapback-free.     

Impact of Gamma Irradiation Effects on IGBT and Design Parameter Considerations

The primary dose effects on an insulated gate bipolar transistor (IGBT) irradiated with a ⁶⁰Co gamma‐ray source are found in both of the components of the threshold shifting due to oxide charge trapping in the MOS and the reduction of current gain in the bipolar transistor. In this letter, the IGBT macro‐model incorporating irradiation is implemented, and the electrical characteristics are analyzed by SPICE simulation and experiments. In addition, the collector current characteristics as a function of gate emitter voltage, V_GE, are compared with the model considering the radiation damage of different doses under positive biases.     

3300V沟槽栅IGBT的衬底材料的优化设计

使用TCAD仿真软件对3 300 V沟槽栅IGBT的静态特性进行了仿真设计.重点研究了衬底材料参数、沟槽结构对器件击穿电压、电场峰值等参数的影响.仿真结果表明,随衬底电阻率增加,击穿电压增加,饱和电压和拐角位置电场峰值无明显变化;随衬底厚度增加,击穿电压增加,饱和电压增加,拐角位置电场峰值降低;随沟槽宽度增加,饱和电压降低,击穿电压和拐角位置电场峰值无明显变化;随沟槽深度增加,饱和电压降低,击穿电压无明显变化,拐角位置电场峰值增加;随沟槽拐角位置半径增加,击穿电压和饱和电压无明显变化,但拐角位置电场峰值减小.选择合适的衬底材料对仿真结果进行实验验证,实验结果与仿真结果相符,制备的IGBT芯片击穿电压为4 128 V,饱和电压约为2.18 V.     

Si/SiGe异质结晶体管的参数提取与特性模拟

用实验测量和理论计算相结合的方法提取了Si/SiGe异质结晶体管的直流和高频参数,分别在PSPICE和MATLAB软件平台上模拟并分析了器件的直流和高频特性,模拟结果与实际测量的结果相吻合,表明本文的提取方法可行、参数提取结果有效.     

1200V场终止型绝缘栅双极晶体管的ADE物理建模及参数提取

绝缘栅双极晶体管（IGBT）是微电子学研究的热点之一,而相关电路仿真迫切需要该器件的等效模型.本文提出基于傅里叶解双极扩散方程（ADE）的1200V场终止型IGBT物理模型,通过RC电路等效漂移区载流子分布,精确求解双极扩散方程.该模型针对大功率IGBT的工作原理,采用大注入假设条件,在综合分析场终止层的同时,根据1200V场终止型IGBT的特点考虑漂移区载流子的复合效应.在提取器件模型所需的关键参数后,用实际IGBT的测量结果对该模型的仿真结果进行了验证,通过分析静态以及关断瞬态特性曲线,仿真与实验数据误差均值小于8%,证明所建模型及参数提取方法的精确度.     

Extraction of small-signal equivalent circuit model parameters for Si/SiGe HBT using S-parameters measurements and one geometrical information

A physical and simple method is proposed to extract the hybrid-π small-signal equivalent circuit model of Si/SiGe heterojunction bipolar transistor (HBT). In this method, we use test (dummy) structures to extract by means of fitting techniques the extrinsic bias-independent parameters representing the contact pads plus the transmission line connections to the core of the active device. All intrinsic bias-dependent parameters are calculated analytically from S-parameters only. The ratio of the area of the emitter contact to base area is used to solve the base–collector feedback problem due to the distributed nature of the base. Using this physical (geometry) constraint instead of the measured direct current (DC) information helps to get more reliable parameters and easier calculations. When we applied this methodology, a good agreement is obtained between the modelled S-parameters with the corresponding measured ones over the broad band from 40 MHz to 20.02 GHz. The error for three different bias points was less than 1.2%.     

Modeling and Parameter Extraction for the Series Resistance in Thin-Film Transistors

A new parameter extraction method is proposed for the series resistance of thin-film transistors (TFTs). By analyzing the gate–source overlap region of staggered structure TFTs, the model for the series resistance is derived and utilized for the parameter extraction. To verify the extraction method, the characteristics of amorphous silicon TFTs obtained from TCAD simulation are used. For the devices with different overlap lengths, the extracted parameters are identical to each other, although the series resistances are different due to the narrow overlap length. When the actual channel length is different from the mask-specified length, the offset length can be effectively corrected by the new method, so that accurate parameters can be obtained. Because the new method has several advantages such as the accuracy and generality over the conventional method, it can be used for further analysis of TFT characteristics.      

低温、小电流、高增益硅双极晶体管的研究与设计

介绍了一种用于低温、小注入电流条件下工作的新型多晶硅发射区双极晶体管,并给出了晶体管电流增益的低温模型。该模型考虑了低温下多子和少子的冻析效应、禁带变窄效应、Auger复合、多晶硅发射效率增强效应等。在此基础上,通过用SUPREM-Ⅲ和PISCES-Ⅱ进行了工艺模拟和器件模拟,最后完成了实际版图制作和工艺流水。对管子的测试表明,该晶体管具有极好的小电流特性,在0.5μA的注入电流下其共射电流放大倍数可高达1000,在低温(77K)下其β仍可达70左右,能够正常工作。