Anti-plane shear of an arbitrary oriented crack in a functionally graded strip bonded with two dissimilar half-planes

An internal crack located within a functionally graded material (FGM) strip bonded with two dissimilar half-planes and under an anti-plane load is considered. The crack is oriented in an arbitrary direction. The material properties of strip are assumed to vary exponentially in the thickness direction and two half-planes are assumed to be isotropic. Governing differential equations are derived and to reduce the difficulty of the problem dealing with solution of a system of singular integral equations Fourier integral transform is employed. Semi closed form solution for the stress distribution in the medium is obtained and mode III stress intensity factor (SIF), at the crack tip is calculated and its validity was verified. Finally, the effects of nonhomogeneous material parameter and crack orientation on the stress intensity factor are studied.     

Mode III fracture of an arbitrary oriented crack in two dimensional functionally graded material

In this paper, a two dimensional functionally graded material (2D-FGM) under an anti-plane load with an internal crack is considered. The crack is oriented in an arbitrary direction. The material properties are assumed to vary exponentially in two planar directions. The problem is analyzed and solved by two different methods namely Fourier integral transforms with singular integral equation technique, and then by the finite element method. The effects of crack orientation, material non-homogeneity, and other parameters on the value of stress intensity factor (SIF) are studied. Finally, the obtained results for Mode III stress intensity factor of different methods are compared.     

Anti-plane problem of periodic cracks in a functionally graded coating–substrate structure

The static and dynamic anti-plane problem for a functionally graded coating–substrate structure containing a periodic array of parallel cracks, which are perpendicular to the boundary, is considered. Integral-transform techniques are employed to reduce the problem to the solution of an integral equation with hypersingular kernels. Numerical results are presented to show the influence of geometry, material properties and material gradient parameter on the fracture behavior.     

Propagation of an anti-plane moving crack in a functionally graded piezoelectric strip

Summary The propagation of an anti-plane moving crack in a functionally graded piezoelectric strip (FGPS) is studied in this paper. The governing equations for the proposed analysis are solved using Fourier cosine transform. The mixed boundary value problems of the anti-plane moving crack, which is assumed to be either impermeable or permeable, are formulated as dual integral equations. By appropriate transformations, the dual integral equations are reduced to Fredholm integral equations of the second kind. For the impermeable crack, the stress intensity factor (SIF) of the crack in the FGPS depends on both the mechanical and electric loading, whereas, the SIF for the permeable crack depends only on the mechanical loading. The results obtained show that the gradient parameter of the FGPS and the velocity of the crack have significant influence on the dynamic SIF.Support from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project No. HKU 7081/00E) is acknowledged. Support from the National Natural Science Foundation of China (Project No. 10072041) is also acknowledged.     

Dynamic response of a crack in a functionally graded interface of two dissimilar piezoelectric half-planes

Summary  In this paper, the dynamic anti-plane crack problem of two dissimilar homogeneous piezoelectric materials bonded through a functionally graded interfacial region is considered. Integral transforms are employed to reduce the problem to Cauchy singular integral equations. Numerical results illustrate the effect of the loading combination parameter λ, material property distribution and crack configuration on the dynamic stress and electric displacement intensity factors. It is found that the presence of the dynamic electric field could impede of enhance the crack propagation depending on the time elapsed and the direction of applied electric impact. Received 4 December 2001; accepted for publication 9 July 2002 This work is supported by the National Natural Science Foundation of China through Grant No. 10132010.     

Antiplane internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half plane

This paper deals with the antiplane magnetoelectroelastic problem of an internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half plane. The properties of the material such as elastic modulus, piezoelectric constant, dielectric constant, piezomagnetic coefficient, magnetoelectric coefficient and magnetic permeability are assumed in exponential forms and vary along the crack direction. Fourier transforms are used to reduce the impermeable and permeable crack problems to a system of singular integral equations, which is solved numerically by using the Gauss-Chebyshev integration technique. The stress, electric displacement and magnetic induction intensity factors at the crack tips are determined numerically. The energy density theory is applied to study the effects of nonhomogeneous material parameter β, edge conditions, location of the crack and load ratios on the fracture behavior of the internal crack.     

An anti-plane propagating crack in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric strip

Summary A finite crack propagating at constant speed in a functionally graded piezoelectric strip (FGPS) bonded to a homogeneous piezoelectric strip is considered. It is assumed that the electroelastic material properties of the FGPS vary exponentially across the thickness of the strip, and that the bimaterial strip is under combined anti-plane mechanical shear and in-plane electrical loads. The analysis is conducted for the electrically unified crack boundary condition, which includes both the traditional permeable and the impermeable ones. By using the Fourier transform, the problem is reduced to the solution of Fredholm integral equations of the second kind. Numerical results for the stress intensity factor and the crack sliding displacement are presented to show the influences of the crack propagation speed, electric loads, FGPS gradation, crack length, electromechanical coupling coefficient, properties of the bonded homogeneous piezoelectric strip and crack location.     

The dynamic response of an edge crack in a functionally graded orthotropic strip

The dynamic response of a functionally graded orthotropic strip with an edge crack perpendicular to the boundaries is studied. The material properties are assumed to vary continuously along the thickness direction. Laplace and Fourier transforms are applied to reduce the problem to a singular integral equation. Numerical results are presented to illustrate the influences of parameters such as the nonhomogeneity constant and geometry parameters on the dynamic stress intensity factors (SIFs).     

Dynamic stress intensity factors of multiple cracks in a functionally graded orthotropic half-plane

In the present paper dynamic stress intensity factor and strain energy density factor of multiple cracks in the functionally graded orthotropic half-plane under time-harmonic loading are investigated. By utilizing the Fourier transformation technique the stress fields are obtained for a functionally graded orthotropic half-plane containing a Volterra screw dislocation. The variations of the material properties are assumed to be exponential forms which the equilibrium has an analytical solution. The dislocation solution is utilized to formulate integral equation for the half-plane weakened by multiple smooth cracks under anti-plane deformation. The integral equations are of Cauchy singular type at the location of dislocation which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to determined stress intensity factor and strain energy density factors (SEDFs) for multiple smooth cracks under anti-plane deformation. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded orthotropic half-plane with multiple curved cracks.     

Interfacial fracture analysis of bonded dissimilar strips with a functionally graded interlayer under antiplane deformation

This paper provides the solution to the problem of dissimilar, homogeneous semi-infinite strips bonded through a functionally graded interlayer and weakened by an embedded or edge interfacial crack. The bonded system is assumed to be under antiplane deformation, subjected to either traction-free or clamped boundary conditions along its bounding planes. Based on the Fourier integral transform, the problem is formulated in terms of a singular integral equation which has a simple Cauchy kernel for the embedded crack and a generalized Cauchy kernel for the edge crack. In the numerical results, the effects of geometric and material parameters of the bonded system on the crack-tip stress intensity factors are presented in order to quantify the interfacial fracture behavior in the presence of the graded interlayer.     

Torsional impact of transversely isotropic solid with functionally graded shear moduli and a penny-shaped crack

The torsional impact response of a penny-shaped crack in an unbounded transversely isotropic solid is considered. The shear moduli are assumed to be functionally graded such that the mathematics is tractable. Laplace transform and Hankel transform are used to reduce the problem to solving a Fredholm integral equation. The crack tip stress fields are obtained. Investigated are the influence of material nonhomogeneity and orthotropy on the dynamic stress intensity factor. The peak value of the dynamic stress intensity factor can be suppressed by increasing the shear moduli's gradient and/or increasing the shear modulus in a direction perpendicular to the crack surface.     

The behavior of a crack in functionally graded piezoelectric/piezomagnetic materials under anti-plane shear loading

Summary In this paper, the behavior of a crack in functionally graded piezoelectric/piezomagnetic materials subjected to an anti-plane shear loading is investigated. To make the analysis tractable, it is assumed that the material properties vary exponentially with the coordinate parallel to the crack. By using a Fourier transform, the problem can be solved with the help of a pair of dual integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. These equations are solved using the Schmidt method. The relations among the electric displacement, the magnetic flux and the stress field near the crack tips are obtained. Numerical examples are provided to show the effect of the functionally graded parameter on the stress intensity factors of the crack.The authors are grateful for financial support from the Natural Science Foundation of Hei Long Jiang Province (A0301), the National Natural Science Foundation of China (50232030, 10172030), the Natural Science Foundation with Excellent Young Investigators of Hei Long Jiang Province(JC04-08) and the National Science Foundation with Excellent Young Investigators (10325208).     

Effects of the weak/micro-discontinuity of interface on the fracture behavior of a functionally graded coating with an inclined crack

The mechanical model was established for the anti-plane fracture problem of a functionally graded coating–substrate system with a coating crack inclined to the weak/micro-discontinuous interface. The Cauchy singular integral equation for the crack was derived using Fourier integral transform, and the Lobatto–Chebyshev collocation method put up by Erdogan and Gupta was used to get its numerical solution. Finally, the effects of the weak/micro-discontinuity of the interface on SIFs were analyzed, the “affected regions” corresponding to the two crack tips have been obtained and their engineering significance was discussed. It was indicated that, for the crack tip in the corresponding “affected region”, to reduce the weak-discontinuity of the interface and to make the interface micro-discontinuous are the two effective ways to reduce the SIF, and the latter way always has more remarkable SIF-reduction effect. For the crack tip outside the “affected region”, its SIF is mainly influenced by material stiffness, and to prevent such a tip from growing toward the interface “softer coating and stiffer substrate” is a more advantageous combination than “stiffer coating and softer substrate”.     

Near-tip out of plane displacement fields for dynamic crack propagation in functionally graded materials

Asymptotic expansion for the out of plane displacement field around a crack propagating along the gradient in a functionally graded material is developed. The irregular behavior of one of the terms in the expansion at low crack speeds is further examined and a remedial solution, which is well behaved at low crack speeds, is proposed. The developed out of plane displacement field is used to estimate stress intensity factor from quasi-static finite element solution. The results indicate that inclusion of the proposed nonhomogeneity specific terms gives estimates of stress intensity factor, which are consistent with existing analytical predictions.     

A moving mode-III crack in functionally graded piezoelectric material: permeable problem

In this paper a moving mode-III crack in functionally graded piezoelectric materials (FGPM) is studied. The crack surfaces are assumed to be permeable. The governing equations for FGPM are solved by means of Fourier cosine transform. The mathematical formulation for the permeable crack condition is derived as a set of dual integral equations, which, in turn, are reduced to a Fredholm integral equation of the second kind. The results obtained indicate that the stress intensity factor of moving crack in FGPM depends only on the mechanical loading. The gradient parameter of the FGPM and the moving velocity of the crack do have significant influence on the dynamic stress intensity factor.     

Stress intensity factors for three-dimensional cracks in functionally graded materials using enriched finite elements

A three-dimensional enriched finite-element methodology is presented to compute stress intensity factors for three-dimensional cracks contained in functionally graded materials (FGMs). A general-purpose 3D finite-element based fracture analysis program, FRAC3D, is enhanced to include this capability. First, using available solutions from the literature, comparisons have been made in terms of stresses under different loading conditions, such as uniform tensile, bending and thermal loads. Mesh refinement studies are also performed. The fracture solutions are obtained for edge cracks in an FGM strip and surface cracks in a finite-thickness FGM plate and compared with existing solutions in the literature. Further analyses are performed to study the behavior of stress intensity factor near the free surface where crack front terminates. It is shown that three-dimensional enriched finite elements provide accurate and efficient fracture solutions for three-dimensional cracks contained in functionally graded materials.     

Impact failure prediction of Mode III crack in orthotropic functionally graded strip

Mode III impact of a crack in an orthotropic functionally graded strip is investigated. The shear moduli in two directions of the material are assumed to vary proportionately with gradient. Laplace transform and Fourier cosine transform are used to reduce the problem to solving a Fredholm integral equation. The crack tip stress field is obtained by considering the asymptotic behavior of Bessel function. Energy density factor criterion is applied to obtain the maximum of minimum energy density and direction of crack initiation. Numerical results are given graphically. The effects of orthotropy, nonhomogeneity and height of the strip on the energy density factor are discussed.     

Evaluation of strongly singular domain integrals for internal stresses in functionally graded materials analyses using RIBEM

An accurate evaluation of strongly singular domain integral appearing in the stress representation formula is a crucial problem in the stress analysis of functionally graded materials using boundary element method.To solve this problem,a singularity separation technique is presented in the paper to split the singular integral into regular and singular parts by subtracting and adding a singular term.The singular domain integral is transformed into a boundary integral using the radial integration method.Analytical expressions of the radial integrals are obtained for two commonly used shear moduli varying with spatial coordinates.The regular domain integral,after expressing the displacements in terms of the radial basis functions,is also transformed to the boundary using the radial integration method.Finally,a boundary element method without internal cells is established for computing the stresses at internal nodes of the functionally graded materials with varying shear modulus.     

A penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer

The problem of a penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer is investigated. The surfaces of the composite structure are subjected to both mechanical and electrical loads. The crack surfaces are assumed to be electrically impermeable. Integral transform method is employed to reduce the problem to a Fredholm integral equation of the second kind. The stress intensity factor, electric displacement intensity factor and energy release rate are derived, some typical numerical results are plotted graphically. The effects of electrical loads, material nonhomogeneity and crack configuration on the fracture behaviors of the cracked composite structure are analyzed in detail.     

Thermal fracture of a functionally graded/homogeneous bimaterial with system of cracks

The thermal fracture of a bimaterial consisting of a homogeneous material and a functionally graded material (FGM) with a system of internal cracks and an interface crack is investigated. The bimaterial is subjected to a heat flux. The thermal properties of FGM are assumed to be continues functions of the thickness coordinate, while the elastic properties are constants. The method of the solution is based on the singular integral equations. For a special case where the interface crack is much larger than the internal cracks in the FGM the asymptotic analytical solution of the problem is obtained as series in a small parameter (the ratio between sizes of the internal and interface crack) and the thermal stress intensity factors (TSIFs) are derived as functions of geometry of the problem and material characteristics. A parametric analysis of the effects of the location and orientation of the cracks and of the inhomogeneity parameter of FGM’s thermal conductivity on the TSIFs is performed. The results are applicable to such kinds FGMs as ceramic/ceramic FGMs, e.g., TiC/SiC, MoSi₂/Al₂O₃ and MoSi₂/SiC, and also some ceramic/metal FGMs.