Angle cracks in two bonded functionally graded piezoelectric material under anti-plane shear

Consider two bonded functionally graded piezoelectric material (FGPM) with finite height. Each material contains an arbitrary oriented crack. The material properties are assumed in exponential forms in the direction normal to the interface. The crack surface condition is assumed to be electrically impermeable or permeable. Using the Fourier transform technique, the problem can be reduced to a system of singular integral equations, which are then solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. Numerical calculations are carried out to obtain the energy density factor S and the energy release rate G. In impermeable case, the energy release rate has been shown to be negative as the electric loads are applied. The positive definite characteristic of the energy density factor makes it possible for predicting the fracture behavior of the cracked structure. The influences of the non-homogeneous parameters and crack orientation on the energy density factors at the crack tips are discussed in detail. The results show that the energy density factor at the crack tip will be increased when the crack tip is located within the softer material.     

Basic solution of two parallel mode-I permeable cracks in functionally graded piezoelectric materials

The basic solution of two parallel mode-I permeable cracks in functionally graded piezoelectric materials was studied in this paper using the generalized Almansi’s theorem. To make the analysis tractable, it was assumed that the shear modulus varies exponentially along the horizontal axis parallel to the crack. The problem was formulated through a Fourier transform into two pairs of dual integral equations, in which unknown variables are jumps of displacements across the crack surface. To solve the dual integral equations, the jumps of displacements across the crack surfaces were directly expanded as a series of Jacobi polynomials. The solution of the present paper shows that the singular stresses and the singular electric displacements at the crack tips in functionally graded piezoelectric materials carry the same forms as those in homogeneous piezoelectric materials; however, the magnitudes of intensity factors depend on the gradient of functionally graded piezoelectric material properties. It was also revealed that the crack shielding effect is also present in functionally graded piezoelectric materials.     

Dynamic stress intensity factors of multiple cracks in a functionally graded orthotropic half-plane

In the present paper dynamic stress intensity factor and strain energy density factor of multiple cracks in the functionally graded orthotropic half-plane under time-harmonic loading are investigated. By utilizing the Fourier transformation technique the stress fields are obtained for a functionally graded orthotropic half-plane containing a Volterra screw dislocation. The variations of the material properties are assumed to be exponential forms which the equilibrium has an analytical solution. The dislocation solution is utilized to formulate integral equation for the half-plane weakened by multiple smooth cracks under anti-plane deformation. The integral equations are of Cauchy singular type at the location of dislocation which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to determined stress intensity factor and strain energy density factors (SEDFs) for multiple smooth cracks under anti-plane deformation. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded orthotropic half-plane with multiple curved cracks.     

An anti-plane propagating crack in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric strip

Summary A finite crack propagating at constant speed in a functionally graded piezoelectric strip (FGPS) bonded to a homogeneous piezoelectric strip is considered. It is assumed that the electroelastic material properties of the FGPS vary exponentially across the thickness of the strip, and that the bimaterial strip is under combined anti-plane mechanical shear and in-plane electrical loads. The analysis is conducted for the electrically unified crack boundary condition, which includes both the traditional permeable and the impermeable ones. By using the Fourier transform, the problem is reduced to the solution of Fredholm integral equations of the second kind. Numerical results for the stress intensity factor and the crack sliding displacement are presented to show the influences of the crack propagation speed, electric loads, FGPS gradation, crack length, electromechanical coupling coefficient, properties of the bonded homogeneous piezoelectric strip and crack location.     

On the screw dislocation in a functionally graded piezoelectric plane and half-plane

In this paper closed-form expressions of the electroelastic field induced by a piezoelectric screw dislocation in a functionally graded piezoelectric plane and half-plane are derived. The material properties are assumed to vary exponentially along the x and y-directions. The solution for a screw dislocation in a functionally graded piezoelectric plane is obtained through introduction of two generalized stress functions. The solution for a screw dislocation in a functionally graded piezoelectric half-plane is derived by using the method of image. It is also found that the interaction between a piezoelectric screw dislocation and a circular insulating hole in the functionally graded piezoelectric material can be solved by using series expansion method.     

The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials

The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials subjected to harmonic antiplane shear waves is investigated using the Schmidt method. The present problem can be solved using the Fourier transform and the technique of dual integral equations, in which the unknown variables are jumps of displacements across the crack surfaces, not dislocation density functions. To solve the dual integral equations, the jumps of displacements across the crack surfaces are directly expanded as a series of Jacobi polynomials. Finally, the relations among the electric, magnetic flux, and dynamic stress fields near crack tips can be obtained. Numerical examples are provided to show the effect of the functionally graded parameter, the distance between the two parallel cracks, and the circular frequency of the incident waves upon the stress, electric displacement, and magnetic flux intensity factors at crack tips.     

The interaction of two parallel Mode-I limited-permeable cracks in a functionally graded piezoelectric material

In this paper, the interaction of two parallel Mode-I limited-permeable cracks in a functionally graded piezoelectric material was investigated by using the generalized Almansi's theorem. In the analysis, the electric permittivity of the air inside the crack was considered. The problem was formulated through Fourier transform into two pairs of dual integral equations, in which unknown variables are jumps of displacements across the crack surface. To solve the dual integral equations, the jumps of displacements across the crack surfaces were directly expanded as a series of Jacobi polynomials. The solution of the present paper shows that the singular stresses and the singular electric displacements at the crack tips in functionally graded piezoelectric materials carry the same forms as those in homogeneous piezoelectric materials; however, the magnitudes of intensity factors depend on the electric permittivity of the air inside the crack and the gradient parameter of functionally graded piezoelectric material properties. It was also revealed that the crack shielding effect is also present in functionally graded piezoelectric materials.     

A penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer

The problem of a penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer is investigated. The surfaces of the composite structure are subjected to both mechanical and electrical loads. The crack surfaces are assumed to be electrically impermeable. Integral transform method is employed to reduce the problem to a Fredholm integral equation of the second kind. The stress intensity factor, electric displacement intensity factor and energy release rate are derived, some typical numerical results are plotted graphically. The effects of electrical loads, material nonhomogeneity and crack configuration on the fracture behaviors of the cracked composite structure are analyzed in detail.     

Crack in functionally graded piezoelectric strip bonded to elastic surface layers under electromechanical loading

Solved is the problem of a crack in a functionally graded piezoelectric material (FGPM) bonded to two elastic surface layers. It is assumed that the elastic stiffness, piezoelectric constant, and dielectric permittivity of the FGPM vary continuously along the thickness of the strip. The outside layers are under antiplane mechanical loading and in-plane electric loading. The solution involves solving singular integral equations by application of the Gauss–Jacobi integration formula. Numerical calculations are carried out to obtain the energy density factors. Their variations with the geometric, loading and material parameters are shown graphically.     

A moving mode-III crack in functionally graded piezoelectric material: permeable problem

In this paper a moving mode-III crack in functionally graded piezoelectric materials (FGPM) is studied. The crack surfaces are assumed to be permeable. The governing equations for FGPM are solved by means of Fourier cosine transform. The mathematical formulation for the permeable crack condition is derived as a set of dual integral equations, which, in turn, are reduced to a Fredholm integral equation of the second kind. The results obtained indicate that the stress intensity factor of moving crack in FGPM depends only on the mechanical loading. The gradient parameter of the FGPM and the moving velocity of the crack do have significant influence on the dynamic stress intensity factor.     

Analysis of cracked functionally graded piezoelectric strip

The fracture behavior of a cracked strip under antiplane mechanical and inplane electrical loading is studied. A functionally graded piezoelectric strip with exponential material gradation is under consideration. The mechanical and electrical loading is combined via loading coupling factor. The problem of a graded piezoelectric strip containing a screw dislocation is solved. This solution results in stress and electric displacement components with Cauchy singularity. Based on the solution achieved for the dislocation, the distributed dislocation technique (DDT) is utilized to form any geometry of multiple cracks and analyze the behavior of a cracked strip under antiplane mechanical and inplane electrical loading. This technique is capable of the analysis of a strip with a system of interacting cracks. Several examples including strips with single crack, two straight cracks and two curved cracks are presented.     

Two mode III internal cracks located within two bonded functionally graded piezoelectric half planes respectively

This paper studies the mode III crack problem of two bonded functionally graded piezoelectric half planes which contain a crack respectively. These two cracks are located normal to the interface. All the material properties are assumed to vary along the direction of the crack line. A system of singular integral equations for electrically impermeable and permeable cracks is derived and solved numerically by using the Gauss–Chebyshev integration formula. The influence of the nonhomogeneous parameters and the dependence of the crack interactions on the stress and electric displacement intensity factors are investigated.     

Love waves in functionally graded piezoelectric materials

To investigate the features of Love waves in a layered functionally graded piezoelectric structure, the mathematical model is established on the basis of the elastic wave theory, and the WKB method is applied to solve the coupled electromechanical field differential equation. The solutions of the mechanical displacement and electrical potential function are obtained for the piezoelectric layer and elastic substrate. The dispersion relations of Love waves are deduced for electric open and short cases on the free surface respectively. The actual piezoelectric layer–elastic substrate systems are taken into account, and some corresponding numerical examples are proposed comparatively. Thus, the effects of the gradient variation about material constants on the phase velocity, the group velocity, the coupled electromechanical factor and the cutoff frequency are discussed in detail. So the propagation behaviors of Love waves in inhomogeneous medium is revealed, and the dispersion and the anti-dispersion are analyzed. The conclusions are significant both theoretically and practically for the surface acoustic wave devices.     

Dynamic behavior of two collinear anti-plane shear cracks in a functionally graded layer bonded to dissimilar half planes

In recent years, the functionally graded materials (FGMs) have been widely applied in extremely high temperate environment. In this paper, the dynamic behavior of two collinear cracks in FGM layer bonded to dissimilar half planes under anti-plane shear waves is studied by the Schmidt method. By using the Fourier transform technique, the present problem can be solved with a dual integral equation. These equations are solved using the Schmidt method. The present method is used to illustrate the fundamental behavior of the interacting cracks in FGMs under dynamic loading. Furthermore, the effects of the geometry of the interacting cracks, the shear stress wave velocity of the materials and the frequency of the incident wave on the Dynamic Stress Intensity Factor are investigated.     

Thermoelastic contact instability of a functionally graded layer and a homogeneous half-plane

The conductive heat transfer between two elastic bodies in the static contact can cause the system to be unstable due to the interaction between the thermoelastic distortion and pressure-dependent thermal contact resistance. This paper investigates the thermoelastic contact instability of a functionally graded material (FGM) layer and a homogeneous half-plane using the perturbation method. The FGM layer and half-plane are exposed to a uniform heat flux and are pressed together by a uniform pressure. The material properties of the FGM layer vary exponentially along the thickness direction. The characteristic equation governing the thermoelastic stability behavior is obtained to determine the stability boundary. The effects of the gradient index, layer thickness and material combination on the critical heat flux are discussed in detail through a parametric study. Results indicate that the thermoelastic stability behavior can be modified by adjusting the gradient index of the FGM layer.     

Wave characteristics in functionally graded piezoelectric hollow cylinders

Based on linear three-dimensional piezoelasticity, the Legendre orthogonal polynomial series expansion approach is used for determining the wave characteristics in hollow cylinders composed of the functionally graded piezoelectric materials (FGPM) with open circuit. The displacement and electric potential components, expanded in a series of Legendre polynomials, are introduced into the governing equations along with position-dependent material constants so that the solution of the wave equation is reduced to an eigenvalue problem. Dispersion curves for FGPM and the corresponding non-piezoelectric hollow cylinders are calculated to show the piezoelectric effect. The influence of the ratio of radius to thickness is discussed. Electric potential and displacement distributions are used to show the piezoelectric effect on the flexural torsional mode. The influence of the polarizing direction on the piezoelectric effect is illustrated. For the radial and axial polarization, the piezoelectric effect reacts mostly on the longitudinal mode. For circumferential polarization, the piezoelectric effect reacts mostly on the torsional mode. In the FGPM hollow cylinder, piezoelectricity can weaken the guided wave dispersion.     

Bending of functionally graded piezoelectric rectangular plates

By introducing two displacement functions as well as two stress functions, two independent state equations with variable coefficients are derived from the three-dimensional theory equations of piezoelasticity for transverse isotropy. A laminated approximation is used to transform the state equations to those with constant coefficients in each sub-layer. The bending problem of a functionally graded rectangular plate is then analyzed based on the state equations. Numerical results are presented and the effect of material gradient index is discussed. Supported by the National Natural Sciences Foundation of China (No. 10002016).     

Electromagnetoelastic behaviors of functionally graded piezoelectric solid cylinder and sphere

Analytical studies on electromagnetoelastic behaviors are presented for the functionally graded piezoelectric material (FGPM) solid cylinder and sphere placed in a uniform magnetic field and subjected to the external pressure and electric loading. When the mechanical, electric and magnetic properties of the material obey an identical power law in the radial direction, the exact displacements, stresses, electric potentials and perturbations of magnetic field vector in the FGPM solid cylinder and sphere are obtained by using the infinitesimal theory of electromagnetoelasticity. Numerical examples also show the significant influence of material inhomogeneity. It is interesting to note that selecting a specific value of inhomogeneity parameter β can optimize the electromagnetoelastic responses, which will be of particular importance in modern engineering designs. The project supported by China postdoctoral science foundation (20060390260) and Hunan Postdoctoral Scientific Program. The English text was polished by Yunming Chen.     

Antiplane internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half plane

This paper deals with the antiplane magnetoelectroelastic problem of an internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half plane. The properties of the material such as elastic modulus, piezoelectric constant, dielectric constant, piezomagnetic coefficient, magnetoelectric coefficient and magnetic permeability are assumed in exponential forms and vary along the crack direction. Fourier transforms are used to reduce the impermeable and permeable crack problems to a system of singular integral equations, which is solved numerically by using the Gauss-Chebyshev integration technique. The stress, electric displacement and magnetic induction intensity factors at the crack tips are determined numerically. The energy density theory is applied to study the effects of nonhomogeneous material parameter β, edge conditions, location of the crack and load ratios on the fracture behavior of the internal crack.     

Analytical solution of multiple moving cracks in functionally graded piezoelectric strip

The dynamic behaviors of several moving cracks in a functionally graded piezoelectric (FGP) strip subjected to anti-plane mechanical loading and in-plane electrical loading are investigated. For the first time, the distributed dislocation technique is used to construct the integral equations for FGP materials, in which the unknown variables are the dislocation densities. With the dislocation densities, the field intensity factors are determined. Moreover, the effects of the speed of the crack propagation on the field intensity factors are studied. Several examples are solved, and the numerical results for the stress intensity factor and the electric displacement intensity factor are presented graphically finally.