Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Synthesis and characterization of self‐catalyzed imide‐containing pthalonitrile resins

Some new amino‐ and imide‐containing phthalonitrile compounds with 1:1 molar ratio of amino group to pthalonitrile unit were successfully synthesized. The molecular structures were characterized by spectroscopic techniques. They were thermally polymerized under nitrogen/air, even in the absence of curing additives. The thermal properties of the cured products were characterized by thermogravimetric analysis and differential scanning calorimetry. The 5% weight loss temperatures ranged from 525 to 528 °C and 513 to 520 °C under nitrogen and air, respectively. Char yields (900 °C) were in the range of 62–70%. Rheometric measurements showed that the rate of the cure reaction differs for all the three monomers. The glass transition temperature advances with increasing extent of cure and disappears on postcure at 375 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Dynamic mechanical properties of epoxy‐phenolic mixtures

The dynamic‐mechanical properties of different mixtures formed by an epoxy resin (DGEBA type) and a phenolic resin (resole type) cured by trietylenetetramine and/or p‐toluensulphonic acid at different concentrations have been studied by means of dynamic mechanical thermal analysis (DMTA). All samples were cured by pressing at 90 °C during 6 h. The mechanical studies were performed between ?100 to 300 °C at a heating rate of 2 °C/min. This study was also carried out for the epoxy‐TETA and phenolic‐p‐toluensulphonic acid systems. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1548–1555, 2005     

Enhanced thermal conductivity and mechanical properties of polymeric composites through formation of covalent bonds between boron nitride and rubber chains

Hexagonal boron nitride (BN) platelets, also known as white graphite, are often used to improve the thermal conductivities of polymeric matrices. Due to the poor interfacial compatibility between BN platelets and polymeric matrices, in this study, polyrhodanine (PRd) was used to modify BN platelets and prepared functionalized BN-PRd platelets, thereby enhancing the interfacial interaction between the thermal conductive filler and polymeric matrix. Then, BN-PRd platelets were dispersed into the nitrile butadiene rubber (NBR) matrix to yield high thermally conductive composites. The presence of N? C═S groups in PRd allowed the combination of PRd and NBR chains containing stable covalent bonds via vulcanization reaction. The thermal conductivity of the as-prepared 30 vol% BN-PRd/NBR composite reached 0.40 W/mK, representing an increment of 135% over pure NBR (0.17 W/mK). In addition, the largest tensile strength of NBR composite containing 30 vol% BN-PRd platelets was 880% times of pure NBR. The 30 vol% BN-PRd/NBR composite also displayed a relatively high dielectric constant (9.35 at 100 Hz) and a low dielectric loss tangent value (0.07 at 100 Hz), indicating their usefulness as dielectric flexible materials of microelectronics. In sum, the simplicity and good efficiency of formation of covalent bonds between boron nitride and rubber chains look very promising for large-scale industrial production of high thermally conductive composites.     

Dynamic mechanical and thermal characterization of high-performance polybenzoxazines

Two polybenzoxazines are cured in an autoclave from the polyfunctional benzoxazine monomers, 8,8′-bis(3,4-dihydro-3-phenyl-2H-1,3-benzoxazine) and 6,6′-bis(2,3-dihydro-3-phenyl-4H-1,3-benzoxazinyl) ketone. The density and tensile properties of these polybenzoxazines are measured at room temperature. Dynamic mechanical tests are performed to determine the T_g, crosslink density, and the activation enthalpy of the glass-transition process for these two polybenzoxazines. The effect of postcure temperature on the T_g of the polymers is investigated and discussed in terms of crosslink density. Fourier transform infrared (FTIR) spectroscopy is also applied for the molecular characterization of the curing systems. Thermal properties of these polybenzoxazines are studied in terms of isothermal aging and decomposition temperature via thermogravimetric analysis. These two polybenzoxazines show mechanical and thermal properties similar to or better than bismaleimides and some polyimides. They also show very high char yield after being carbonized in a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 3257–3268, 1999     

Synthesis and characterization of epoxy resins containing imine group and their curing processes with aromatic diamine

The epoxy resins containing imine bonding were prepared from hydroxyl substituted Schiff base monomers in two steps. At the first step, hydroxyl substituted Schiff base monomers were synthesized via condensation reaction. At the second step, epoxy resins were synthesized from the reaction between Schiff base monomers and epichlorohydrine (EPC). Then curing processes of epoxy resins were achieved by p-phenylenediamine compound. The structures of resulting compounds were confirmed by FT-IR, UV-Vis and ¹H-NMR. TG-DTA and DSC measurements were performed for thermal characterizations of the compounds. Chemical resistances of the cured epoxy-amine systems were determined for coating applications in acidic, alkaline and organic solvents. HCl (10%, aqueous solution), NaOH (10%, aqueous solution), DMSO, DMF, N-methylpyrrolidone, ethanol, THF and acetone were used for corrosion tests. Chemical resistance data of the synthesized epoxy resins demonstrated that they have good chemical resistance against various acid, alkaline and common organic solvents. Surface morphologies of epoxy resin and the cured epoxy resin were determined with scanning electron microscopy (SEM) measurements. Also, optical band gap (E_g) values of Schiff base monomers and epoxy resins were calculated from UV-Vis measurements.     

Development of novel flame‐retardant thermosets based on benzoxazine–phenolic resins and a glycidyl phosphinate

Modified novolac resins with benzoxazine rings were prepared and copolymerized with a glycidyl phosphinate. Their curing behavior and the thermal properties of the curing resins were studied. Copolymerization was studied with model compounds considering the functionality of the benzoxazine‐based phenolic resins and the easy isomerization of the glycidyl phosphinate. Phenolic novolac resin acts as an initiator but p‐toluensulfonic acid had to be used to decrease the curing temperature and to prevent glycidyl phosphinate from isomerizing. The materials obtained exhibited high glass‐transition temperatures and retardation on thermal degradation rates. V‐0 materials were obtained when the materials were tested for ignition resistance with the UL‐94 test. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 279–289, 2004     

Preparation,characterization and properties of fiber reinforced composites using silicon‐containing hybrid polymers

A novel glass fiber reinforced composite was prepared by using silicon‐containing hybrid polymers, poly(methylhydrogen‐diethynylsilyene) (PMES) and poly(phenylethynyl‐silyloxide‐phenylborane) (APABS), as matrix resins. The curing behavior and rheological properties of the matrix resins were investigated by differential scanning calorimetry (DSC) and rotational rheometer. The dynamic viscoelastic properties, mechanical properties, and microstructures of the composites were studied by dynamic mechanical analysis (DMA), universal testing machine (UTM), and scanning electron microscopy (SEM), respectively. The results show that the composite can be well cured between 200 and 300 °C through reactive groups like Si‐H, N‐H, and C≡C units, the possible thermosetting mechanism is also proposed. The composites exhibit excellent mechanical properties with bending strength reach up to 261 and 178 MPa before and after heat‐treating, respectively. SEM analysis clearly indicates that crack in the matrix, matrix/fiber interface debonding, and fiber pull out are predominate failure mechanism for the composites which are heat‐treated in different temperatures. All these obtained results can give theoretical guiding reference for their further applications. Copyright © 2016 John Wiley & Sons, Ltd.     

Thermal,mechanical, and morphological properties of novolac‐type phenolic resin blended with fullerenol polyurethane and linear polyurethane

Fullerenol polyurethane (C₆₀‐PU) and linear polyurethane (linear‐PU) modified phenolic resins were prepared in this study. Phenolic resin/C₆₀‐PU and phenolic resin/linear‐PU blends show good miscibility as a result of the intermolecular hydrogen bonding existing between phenolic resin and PU modifiers. DSC and thermogravimetric analysis methods were used to study the thermal properties of phenolic resin blended with different types of PUs. The intermolecular hydrogen bonding that existed between phenolic resin and C₆₀‐PU was investigated by Fourier transform infrared spectroscopy. The morphology and mechanical properties of phenolic resin/C₆₀‐PU and phenolic resin/linear‐PU blends were also investigated. The char yield of the modified phenolic resins decreased with increasing PU modifier content. Significant improvement in the toughness of the modified phenolic resins was observed. The improvements of impact strength were 27.4% for the phenolic resin/linear‐PU system and 54.3% for the phenolic resin/C₆₀‐PU system, respectively, both with 3 phr linear‐PU and C₆₀‐PU content. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 2436–2443, 2001     

Curing kinetics,thermal, mechanical,and dielectric properties based on o‐cresol formaldehyde epoxy resin with polyhedral oligomeric (N‐aminoethyl‐γ‐amino propyl)silsesquioxane

The curing reaction and kinetics of o‐cresol formaldehyde epoxy resin (o‐CFER) with polyhedral oligomeric silsesquioxane of N‐aminoethyl‐γ‐amino propyl group (AEAP‐POSS) were investigated by differential scanning calorimetry (DSC). The thermal, mechanical, and dielectric properties of o‐CFER/AEAP‐POSS nanocomposites were investigated with thermogravimetric analysis (TGA), torsional braid analysis (TBA), tensile tester, impact tester, and electric analyzer, respectively. The results show that the activation energy (E) of curing reaction is 58.08 kJ/mol, and the curing reaction well followed the ?esták‐Berggren (S‐B) autocatalytic model. The glass transition temperature (T_g) increases with the increase in AEAP‐POSS content, and reaches the maximum, 107°C, when the molar ratio (N_s) of amino group to epoxy group is 0.5. The nanocomposites containing a higher percentage of AEAP‐POSS exhibited a higher thermostability. The AEAP‐POSS can effectively increase the mechanical properties of epoxy resin, and the tensile and impact strengths are 2.84 MPa and 143.25 kJ m^?2, respectively, when N_s is 0.5. The dielectric constant (ε), dielectric loss factor (tan δ), volume resistivity (ρ_v), and surface resistivity (ρ_s) are 4.98, 3.11 × 10^?4, 3.17 × 10¹² Ω cm³, and 1.41 × 10¹² Ω cm², respectively, similarly at N_s 0.5. Copyright © 2009 John Wiley & Sons, Ltd.     

The improvement of thermal stability and adhesion of silicone rubber composites modified by phenolic epoxy resin

The phenolic epoxy resin (F51) was siliconized by KH550 and the product was named as FKS. A hydroxyl-terminated polydimethylsiloxane (HTPDMS) which was modified with FKS was prepared. The siliconization reaction ensured a segment of siloxane on the side chain of F51. FT-IR and ¹H-NMR were employed to confirm the chemical structure of FKS. Morphology observations revealed that the enhancement of mechanical properties of the silicone rubber systems can be attributed to good compatibility between FKS and silicone rubber matrix. Thermogravimetric analysis showed that the residual yield at 800?°C of silicone rubber composites increased significantly when compared with that of neat HTPDMS. The mechanical properties demonstrated that tensile strength and elongation at break of silicone rubber system increased distinctly after modification, especially when 30 phr siliconized F51 were added to the silicone rubber. Shear strength was improved gradually with the addition of FKS. These above observations emphasize the vital effect of FKS on the behavior of modified HTPDMS.     

Synthesis and characterization of novel h‐HTBN/PEG PU copolymers for tissue engineering: degradation,phase behavior,and mechanical properties

The phase behavior of the as‐prepared polyether polyurethane (PU) elastomers was investigated by dynamic mechanical analysis (DMA), polarized optical microscope (POM), and atomic force microscopy (AFM). This PU copolymers were composed of different compositions of two soft segments, poly(ethylene glycol) (PEG) and hydrolytically modified hydroxyl‐terminated poly(butadiene‐co‐acrylonitrile) (h‐HTBN) oligomers. The microphase separation behavior is confirmed to occur between soft and hard segments as well as soft and soft segments as the h‐HTBN is incorporated into the PU system, depending on soft‐soft and/or soft‐hard microdomain composition, molecular weight (MW) of PEG, and hydrolysis time of HTBN. The driving force for this phase separation is mainly due to the formation of inter‐ and intramolecular hydrogen bonding interaction. The PU‐70, PU‐50 samples with non‐reciprocal composition seem to exhibit larger microphase separation than any other PU ones. The hydrolysis degradation, thermal stability, and mechanical properties of the copolymers were assessed by gravimetry, scanning electron microscope (SEM), thermal gravity analysis (TGA), and tensile test, respectively. The experimental results indicated that the incorporation of h‐HTBN soft segment into PEG as well as low MW of PEG leads to increased thermal and degradable stability based on the intermolecular hydrogen bond interaction. The PU‐70 and PU‐50 copolymers exhibit better mechanical properties such as high flexibility and high ductility because of their larger microphase separation architecture with the hard domains acting as reinforcing fillers and/or physical crosslinking agents dispersed in the soft segment matrix. Copyright © 2009 John Wiley & Sons, Ltd.     

Enhancement of the thermal and mechanical properties of a surface‐modified boron nitride–polyurethane composite

Thermoplastic polyurethane (PU) elastomer, prepared from poly(tetramethylene glycol) and methyl diphenyl diisocyanate, was blended with boron nitride (BN) to fabricate a thermally conductive interface material. BN treated by a silane coupling agent (BN―NH₂) and PU‐grafted BN were prepared to fabricate a composite that has better thermal conductivity and mechanical strength. The surface‐modified filler showed enhanced dispersibility and affinity because of the surface treatment with functional groups that affected the surface free energy, along with the structural similarity of the doped crystallized diisocyanate molecule with the matrix. The thermal conductivity increased from 0.349 to 0.467 W mk^?1 on 20 wt% PU‐grafted BN loading that is a 1.34‐fold higher value than in the case of pristine BN loading at the same weight fraction. Moreover, the number of BN particles acting as defects, thereby reducing the mechanical strength, is decreased because of strong adhesion. We can conclude that these composite materials may be promising materials for a significant performance improvement in terms of both the thermal and mechanical properties of PU‐based polymers. Copyright © 2014 John Wiley & Sons, Ltd.     

带环氧基团纳米二氧化硅改性酚醛树脂的合成及热性能

以苯酚、甲醛、带环氧基团纳米二氧化硅(RNS-E)为原料,采用原位聚合法合成了RNS-E改性酚醛树脂.利用红外光谱(FT-IR)对其结构进行了分析,并利用热重分析(TGA)对其热性能进行了研究.结果表明,改性后的酚醛树脂热稳定性得到提高,当RNS-E的加入量为4%时(质量分数),失重10%时的热分解温度(t10%)较酚醛树脂的提高了15℃,1 000℃下残炭率较酚醛树脂提高了7%.     

Flame‐retardant and mechanical properties of phenolic foams toughened with polyethylene glycol phosphates

Three kinds of polyethylene glycol phosphates (PEGPs) toughening agents were synthesized by esterification of phosphorus pentoxide (P₂O₅) with polyethylene glycol and characterized by Fourier transform infrared spectra and ³¹P nuclear magnetic resonance. A series of lightweight phenolic foams toughened with different loadings of PEGPs were prepared. Optical microscopy results show that the addition of PEGPs with small molecular weight PEG improves the structural homogeneity of phenolic foams obviously. The flame retardancy of toughened phenolic foams was evaluated by using UL 94, limiting oxygen index, and cone calorimeter. The results indicate that the incorporation of PEGPs not only increases the toughness of phenolic foams but also improves their flame retardancy. Moreover, the thermal stability of PEGPs and the toughened foams was investigated by thermogravimetric analysis. Copyright © 2013 John Wiley & Sons, Ltd.     

Alkyne‐containing phthalonitrile resins: Controlling mechanical properties by selective curing

An alkyne‐containing multiple aromatic ether‐linked phthalonitrile has been synthesized and characterized. The oligomeric phthalonitrile monomer was prepared from the reaction of an excess amount of bisphenol A with 4,4′‐dibromotolane in the presence of K₂CO₃ in a N,N‐dimethylformamide/toluene solvent mixture, followed by end‐capping with 4‐nitrophthalonitrile in a two‐step, one‐pot reaction. After being cured in the presence of bis(4‐[4‐aminophenoxy]phenyl)sulfone, the polymeric properties of the alkyne‐ and non‐alkyne‐containing oligomeric phthalonitrile resins were compared. Rheometric measurements and thermogravimetric analysis showed that the alkyne‐containing oligomeric phthalonitrile resin had better mechanical properties than an analogous non‐alkyne‐containing resin cured under identical conditions and exhibited excellent thermal and oxidative properties. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4774–4778     

Synthesis and characterization of carborane bisphenol resol phenolic resins with ultrahigh char yield

Two carborane-containing resol phenolic resins(P1 and P2) with high boron content were synthesized via the reaction of carborane bisphenols(1 and 2) with formaldehyde in the presence of alkaline. HRMS results indicate that P1 is mainly composed of hydroxymethylated o-carborane bisphenols, the Mw of which was restrained around 500 due to the strong steric hindrance of o-carborane bisphenol. In contrast, the molecular weight of P2 was well regulated under various reaction conditions. The obtained resins were characterized with spectroscopic techniques including FTIR, 1H-NMR, 13C-NMR, and 11B-NMR, which gave satisfactory results. TGA studies show that P2 shows char yield of 88.9% and 92.9% at 900 ?C under nitrogen and air respectively. The imported carborane cage endows phenolic resin with ultrahigh char yield. Particularly, the char yield of the obtained carborane-containing phenolic resin under air is higher than that under nitrogen. FTIR and XRD confirm that the carborane cage could react with oxygen to form B2O3 at elevated temperatures, which postpones the thermal decomposition of phenolic resin and accounts for the high char yield.     

Development of novel cardo‐containing phenylethynyl‐terminated polyimide with high thermal properties

A phenylethynyl‐terminated reactive diluent [Card‐4‐phenylethynylphthalic anhydride (PEPA)], which contained fluorenyl cardo structures, was successfully synthesized and used as a modifier for flexible phenylethynyl‐terminated imide oligomer (PEI‐PEPA). The chemical structure, crosslink characterization, molecular weights, and thermal properties of the products were characterized. The imide systems with addition of 10, 20, 30, and 40 wt% Card‐PEPA to PEI‐PEPA (PEI‐PEPA‐Card) and their cured resin systems were prepared. The thermal curing behaviors of imide systems at different heating rates were analyzed by using differential scanning calorimetry. Thermal properties such as glass transition temperature (T_g) and char yield at 800°C of the resultant resin systems were studied by differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. The rheological properties were also investigated using a dynamic rheometry. These properties were found to be outstanding compared with pure PEI‐PEPA. The uncured imide systems exhibited lower T_g and lower isothermal viscosity with addition of Card‐PEPA. Furthermore, the T_g and char yield of the cured resin systems increased with addition of Card‐PEPA. The cured resin systems containing 40 wt% Card‐PEPA exhibited the highest T_g of 359°C and char yield at 800°C of 66.5%. Copyright © 2016 John Wiley & Sons, Ltd.     

Improved mechanical properties of epoxy composites reinforced with surface‐treated UHMWPE fibers

The surface treatment of ultra‐high molecular weight polyethylene fiber using potassium permanganate and the mechanical properties of its epoxy composites were studied. After treatment, many changes were happened in the fiber surface: more O‐containing groups (―OH, ―C═O, and ―C―O groups), drastically decreased contact angles with water and ethylene glycol, slightly increased melting point and crystallinity, and formed cracks. Different contents (0.1–0.5 wt%) ultra‐high molecular weight polyethylene fibers/epoxy composites were prepared. The results indicated that the surface treatment decreased the tensile strength of epoxy composites, but increased the bending strength. When the fiber content was 0.3 wt%, the above properties reached the maximum. At the same fiber content, the interlaminar shear strength of the composites was increased by 26.6% up to the as‐received fiber composites. Dynamic mechanical analysis of the composites suggested the storage modulus and tanδ were decreased due to the surface treatment. Fractured surface analysis confirmed that the potassium permanganate treatment was effective in improving the interface interaction.