New wet etching solution molar ratio for processing T2SLs InAs/GaSb nBn MWIR infrared detectors grown on GaSb substrates

Mid-wave infrared (MWIR) technology is dominated by HgCdTe. However, in terms of performance, InAs/GaSb type-II superlattice (T2SL) has shown the theoretical potential to compete with HgCdTe. T2SLs InAs/GaSb technology is under development, where proper detector’s architecture formation must be considered as one of the most important steps of the fabrication process. The paper presents experimental results related to chemical etching of the T2SLs InAs/GaSb with bulk AlGaSb barriers, mesa type nBn MWIR detectors. Although, we attempted to transfer HgCdTe etching solutions: Br₂+C₂H₆O₂ into T2SLs InAs/GaSb technology, H₃PO₄+C₂H₈O₇+H₂O₂+H₂O (molar ratio: 1:1:4:16) at temperature ~21 °C was estimated to have optimal parameters in terms of the mesa profile and current–voltage characteristics. Repeatability of the mesa profiles and surface uniformity was reached. Overetching close to the mesa sidewalls was not observed.     

InAs/GaSb Ⅱ类超晶格长波红外探测器的表面处理研究

开展了In As/Ga Sb Ⅱ类超晶格长波红外探测器的表面处理研究。通过对不同处理工艺形成台面器件的暗电流分析,发现N₂O等离子处理结合快速热退火(RTA)的优化工艺能够显著改善长波器件电学性能。对于50%截止波长12.3μm的长波器件,在液氮温度,-0.05 V偏置下,表面处理后暗电流密度从5.88×10^-1 A/cm²降低至4.09×10^-2 A/cm²,零偏下表面电阻率从17.7Ωcm提高至284.4Ωcm,有效降低侧壁漏电流。但是该表面处理后的器件在大反偏压下仍有较大的侧壁漏电,这可能是由于高浓度的表面电荷使得大反偏下侧壁存在较高的隧穿电流。通过栅控结构器件的变栅压实验,验证了长波器件存在纯并联电阻及表面隧穿两种主要漏电机制。最后,对表面处理前后的暗电流进行拟合,处理后器件表面电荷浓度为3.72×10¹¹ cm^-2。     

CH3CSNH2/NH4OH钝化GaInAsSb/GaSb PIN红外探测器

引入一种新的低毒化合物CH3CSNH2/NH4OH对 GaInAsSb化合物探测器的表面进行了钝化处理，可使其暗电流降低一个数量级，动态电阻增大25倍多，且钝化83天后保持良好的钝化效果，取得了与（NH4)2S溶液一样理想的钝化效果. 并采用AES和XPS对钝化前后的GaInAsSb材料进行了分析.     

InAs/GaSb超晶格/GaSb体材料中短波双色红外探测器

采用GaSb体材料和InAs/GaSb超晶格分别作为短波与中波吸收材料,外延生长制备了NIPPIN型短中双色红外探测器。HRXRD及AFM测试表明,InAs/GaSb超晶格零级峰和GaSb峰半峰宽FWHM分别为17.57 arcsec和19.15 arcsec,10μm×10μm范围表面均方根粗糙度为1.82?。77 K下,SiO_2钝化器件最大阻抗与面积乘积值RA为5.58×10~5Ω?cm~2,暗电流密度为5.27×10~(-7)A?cm~(-2),侧壁电阻率为6.83×10~6Ω?cm。经阳极硫化后,器件最大RA值为1.86×10~6Ω?cm~2,暗电流密度为4.12×10~(-7)A?cm~(-2),侧壁电阻率为4.49×10~7Ω?cm。相同偏压下,硫化工艺使器件暗电流降低1-2个数量级,侧壁电阻率提高了1个数量级。对硫化器件进行了光谱响应测试,器件具有依赖偏压极性的低串扰双色探测性能,其短波通道与中波通道的50%截止波长分别为1.55μm和4.62μm,在1.44μm、2.7μm和4μm处,响应度分别为0.415 A/W、0.435 A/W和0.337 A/W。     

长波InAs/GaSb II类超晶格红外探测器

报道了50％截止波长为12.5μm的InAs/GaSb Ⅱ类超晶格长波红外探测器材料及单元器件.实验采用分子束外延技术在GaSb衬底上生长超晶格材料.吸收区结构为15ML(InAs)/7ML(GaSb),器件采用PBIN的多层异质结构以抑制长波器件暗电流.在77K温度下测试了单元器件的电流-电压(I-v)特性,响应光谱和黑体响应.在该温度下,光敏元大小为100μm×100μm的单元探测器RmaxA为2.5Ωcm2,器件的电流响应率为1.29A/W,黑体响应率为2.1×109cmHz12/W,11μm处量子效率为14.3％.采用四种暗电流机制对器件反向偏压下的暗电流密度曲线进行了拟合分析,结果表明起主导作用的暗电流机制为产生复合电流.     

Theoretical analysis of the detectivity in N-p and P-nGaSb/GaInAsSb infrared photodetectors

In this paper, the detectivity as well as the quantum efficiency and the zero-bias resistance-area product in N-p and P-n GaSb/Ga_0.8 In_0.2As_0.19Sb_0.81 infrared detectors is analyzed, based on the incident wavelength and the parameters of GaSb and Ga_0.8In_0.2As_0.19Sb_0.81. The results show that the detectivity for the N-p structure is much higher than that for the P-n structure. In addition, the tunneling mechanism in both heterostructures strongly decreases the performance of Ga_0.8 In_0.2As_0.19Sb_0.81/GaSb detectors, The optimum detectivity is obtained when the zero-bias resistance-area product is limited by the generation-recombination mechanism. Furthermore, the detectivity in the N-p heterostructure is saturated with a small thickness of p-Ga_0.8In_0.2As_0.19 Sb_0.81 while the one in the P-n heterostructure is maximum with thickness of n-Ga_0.8In_0.2As_0.19 Sb_0.81 in the range of 2.5-3 μm     

InAs/GaSb超晶格中波焦平面材料的分子束外延技术

报道了InAs/GaSb超晶格中波材料的分子束外廷生长技术研究.通过改变GaSb衬底上分子束外延InAs/GaSb超晶格材料的衬底温度,以及界面的优化等,改善超晶格材料的表面形貌和晶格失配,获得了晶格失配△a/a=1.5×10-4,原子级平整表面的InAs/GaSb超晶格材料,材料77 K截止波长为4.87 μm.     

用于红外探测的短周期InAs/GaSb超晶格材料的生长

用金属有机物化学气相淀积法(MOCVD)在GaSb衬底上生长InAs/GaSb超晶格,探索了最佳的生长厚度,优化了各种生长参数,并且分析了源流量控制的重要性.得到的超晶格材料的光致发光(PL)谱、X射线双晶衍射图以及表面形貌图表明,生长的超晶格材料可以响应10μm的长波,且具有良好的表面形貌和外延层质量.     

InAs/GaSb II类超晶格红外焦平面台面的 ICP 刻蚀研究

本文报道了采用Cl2/N2电感耦合等离子（ICP）组合体刻蚀工艺在InAs/GaSb II类超晶格红外焦平面台面加工过程中的研究结果,实验采用分子束外延技术在GaSb衬底上生长的PIN型超晶格材料。结果表明,气体流量比例直接对刻蚀速率和刻蚀形貌产生影响,氯气含量越高,刻蚀速率越大,当氮气含量增加,刻蚀速率降低并趋于一定值。当氯气和氮气的流量比例和等离子腔体内压力等参数一定时,随着温度升高,刻蚀速率和选择比在有限范围内同时线性增大,台面的倾角趋于直角,台面轮廓层状纹理逐渐消失,但沟道内变得粗糙不平,并出现坑点。在实验研究范围内,电感耦合等离子源的ICP功率和RF功率对刻蚀结果产生的影响较小。     

四层结构模型下的InAs/GaSb超晶格材料能带计算

在包络函数近似下采用K.P理论计算了InAs/Ga(In)Sb II类超晶格材料的能带结构.同时, 计算了超晶格材料的电子有效质量和空穴有效质量, 以及不同的结构对应的吸收系数.在此基础上使用了考虑包括界面在内的四层超晶格模型进行能带计算, 并与实验结果进行比较, 超晶格材料响应截止波长的结果更为接近实验值.不同的界面也会引起能带结构的变化, 带来截止波长的变化.对于应变补偿的InAs/GaSb超晶格材料, 非对称InSb界面相比对称界面有更大的截止波长.     

128x128元InAs/GaSb II类超晶格红外焦平面探测器

报道了128×128元InAs/GaSb Ⅱ类超晶格红外焦平面阵列探测器的研究成果.实验采用分子束外延技术在GaSb衬底上生长超晶格材料.红外吸收区结构为13 ML(InAs)/9 ML(GaSb),器件采用PIN结构,焦平面阵列光敏元大小为40μm×40μm.通过台面形成、侧边钝化和金属电极生长,以及与读出电路互连等工艺,得到了128×128面阵长波焦平面探测器.在77 K时测试,器件的100%截止波长为8μm,峰值探测率6.0×109cmHz1/2W-1.经红外焦平面成像测试,探测器可得到较为清晰的成像.     

四层结构模型下的InAs/GaSb超晶格材料能带计算

在包络函数近似下采用K.P理论计算了InAs/Ga(In) Sb Ⅱ类超晶格材料的能带结构.同时,计算了超晶格材料的电子有效质量和空穴有效质量,以及不同的结构对应的吸收系数.在此基础上使用了考虑包括界面在内的四层超晶格模型进行能带计算,并与实验结果进行比较,超晶格材料响应截止波长的结果更为接近实验值.不同的界面也会引起能带结构的变化,带来截止波长的变化.对于应变补偿的InAs/GaSb超晶格材料,非对称InSb界面相比对称界面有更大的截止波长.     

256×256 focal plane array midwavelength infrared camera based on InAs/GaSb short-period superlattices

An infrared camera based on a 256×256 focal plane array (FPA) for the second atmospheric window (3–5 μm) has been realized for the first time with InAs/GaSb short period superlattices (SLs). The SL detector structure with a broken gap type-II band alignment was grown by molecular beam epitaxy on GaSb substrates. Effective bandgap and strain in the superlattice were adjusted by varying the thickness of the InAs and GaSb layers and the controlled formation of InSb-like bonds at the interfaces. The FPAs were processed in a full wafer process using optical lithography, chemical-assisted ion beam etching, and conventional metallization technology. The FPAs were flip-chip bonded using indium solder bumps with a read-out integrated circuit and mounted into an integrated detector cooler assembly. The FPAs with a cut-off wavelength of 5.4 μm exhibit quantum efficiencies of 30% and detectivity values exceeding 10¹³ Jones at T=77 K. A noise equivalent temperature difference (NETD) of 11.1 mK was measured for an integration time of 5 ms using f/2 optics. The NETD scales inversely proportional to the square root of the integration time between 5 ms and 1 ms, revealing background limited performance. Excellent thermal images with low NETD values and a very good modulation transfer function demonstrate the high potential of this material system for the fabrication of future thermal imaging systems.     

InAs/GaSb超晶格长波红外探测器暗电流特性分析

利用二极管电流解析模型分析了InAs/GaSb超晶格长波红外探测器暗电流的主导机制。首先,通过变面积二极管I-V测试证实77 K下采用阳极硫化加SiO₂复合钝化的InAs/GaSb超晶格长波红探测器的暗电流主要来自于体电流,而非侧壁漏电流;然后,利用扩散电流、产生复合电流、直接隧穿电流和陷阱辅助隧穿电流模型对InAs/GaSb超晶格长波红外探测器的暗电流进行拟合分析。结果表明:在小的反向偏压下(≤60 mV),器件暗电流主要由产生复合电流主导,而在高偏压下(>60 mV）,器件暗电流则主要由缺陷陷阱辅助隧穿电流主导。并分析了吸收层掺杂浓度对这两种电流的影响,证实5×1015~1×1016 cm?3是优化的掺杂浓度。     

1/f noise in very-long-wavelength infrared Hg1−xCdx Te detectors

This paper investigates 1/f noise performance of very-long-wavelength infrared (VLWIR) Hg_1−xCd_xTe (cutoff wavelengths λ_c=15 μm and λ_c=16 μm) photodiodes at 78 K, where detector current is varied by changing detector area, detector bias, and illumination conditions. Holding detector bias and temperature constant, the 1/f noise current is proportional to the detector current. Significant nonuniformity is observed in the noise data for each detector area because of the varying detector quality. Defects are presumed resident in the detectors to produce greater nonuniformity in 1/f noise as compared to dark current at 100-mV reverse bias. For λ_c=16 μm, 4-μ-radius, diffusion-limited diodes at 78 K and 100-mV reverse bias, the average dark current is I_d=9.76±1.59×10⁻⁸ A, while the average noise current measured at 1 Hz is i_n=1.01±0.63×10⁻¹² A/Hz^1/2. For all detector areas measured, the average ratio in 1-Hz bandwidth is α _D =i_n/I_d=1.39±1.09×10⁻⁵. The 1/f noise was also measured on one diode as a function of detector-dark current as the applied bias is varied. In the diffusion-limited portion of this detector’s current-voltage (I-V) curve, to about 130 mV, the 1/f noise was independent of bias. For this diode, the ratio α_D=i_n/I_d=1.51±0.12×10⁻⁵. The 1/f noise associated with tunneling currents is a factor of 3 greater than the 1/f noise associated with diffusion currents, α_T=i_n/I_T=5.21±0.83×10⁻⁵. In addition, 1/f noise was measured on detectors held at −100 mV and 78K under dark and illuminated conditions. The measured ratios α_P ∼α_D ∼1.5×10⁻⁵ were about the same for the dark and photon-induced diffusion currents. Therefore, the diffusion current appears to have a unique value of α as compared to the tunneling current. This may be indicative of unique noise-generation mechanisms associated with each current.     

InAs/GaSb超晶格探测器台面工艺研究

InAs/GaSb SLs探测器台面刻蚀常用的工艺有干法刻蚀和湿法刻蚀。研究了三种等离子刻蚀气体(Cl2基, Ar基和CH4基)对超晶格的刻蚀效果,SEM结果表明,CH4基组分能够得到更加平整的表面形貌和更少的腐蚀坑;之后采用湿法腐蚀工艺,用于消除干法刻蚀带来的刻蚀损伤,分别研究了酒石酸系和磷酸系两种腐蚀溶液的去损伤效果,结果表明,磷酸系腐蚀液的去损伤效果更好,且腐蚀速率更加稳定。采用优化的台面工艺制备了InAs/GaSb SLs探测器,其I- V特性曲线表明二极管具有较低的暗电流,其77 K时动态阻抗R0A =1.98×104Ωcm2。     

红外成像寻的用红外探测器现状和发展趋势

分析了红外成像寻的用红外探测器的现状。根据导弹的应用领域、红外成像导引头和焦平面探测器技术的发展,讨论了成像寻的用红外焦平面探测器的发展趋势。     

Molecular beam epitaxial regrowth of InAs/AiSb/GaSb heterostructures on patterned substrates

The molecular beam epitaxial growth of InAs/AISb/GaSb heterostructures on GaSb epilayers patterned by dry etching is investigated. Faceted growth occurs at pattern edges, depending on the adatom species, crystallographic planes and growth parameters. The morphology of the overgrown structure is determined by (111), (110), and (100) Planes near the edges of the patterned stripes, oriented in the [011], [001 ], or [0 11] direction. During the regrowth of InAs, additional (311)A planes are formed at the edges for stripe orientations in the [0 11] direction. Utilizing the faceted growth behavior at pattern edges, resonant interband tunneling diodes with a room temperature peak-to-valley current ratio of 13 have been fabricated on patterned substrates. The results indicate that this approach has the potential of realizing advanced devices with higher complexity.     

InAs/GaSb应变超晶格红外调制光谱研究

在用步进扫描傅里叶变换红外(Fourier Transform Infrared, FTIR)调制光致发光(Photoluminescence, PL)光谱仪进行测试时,基于FTIR的优势,并结合PL无损、灵敏度高、简单的优点,通过减弱背景干扰来提高信号强度。研究了背景噪声、杂质能级和温度对InAs/GaSb应变超晶格材料的发射峰强度及位置的影响,并通过改变测试参数,总结出了针对不同材料的测试方法。这项研究结果对InAs/GaSb应变超晶格材料的外延生长及后续加工具有参考价值。     

Growth and fabrication of a mid-wavelength infrared focal plane array based on type-II InAs/GaSb superlattices

We present the fabrication of a mid-wavelength infrared focal plane array(FPA)based on type-II InAs/GaSb strain layer superlattices(SLs).The detectors contain a 400-period 8 ML InAs/8 ML GaSb SL active layer,which is grown by solid source molecular beam epitaxy on GaSb(100)N type substrates.Lattice mismatch between the superlattices and GaSb substrate achieves 148.9 ppm.The full width at half maximum of the first order satellite peak from X-ray diffraction was 28 arcsec.Single element detectors and FPA with a 128 128 pixels were fabricated using citric acid based solution wet chemical etching.Chemical and physical passivation effectively reduces the surface leakage and this process was characterized by I–V measurement.The devices showed a 50%cut-off wavelength of 4.73 m at 77 K.The photodiode exhibited an R0A of 103cm2.The FPA was characterized with an integration time of 0.5 ms and F/2.0 optics at 77 K and the average blackbody detectivity of the detectors is 2.01 109cm Hz1=2/W.