TA2表面磁控溅射CNx/SiC薄膜的纳米压痕与摩擦磨损性能

采用室温磁控溅射技术在工业纯钛(TA2)表面制备出氮化碳/碳化硅(CNx/SiC)双层薄膜,SiC为中间层.研究了CNx薄膜的纳米压痕行为和摩擦磨损性能.试验结果表明:CNx薄膜的纳米硬度(H)为15.80 GPa,杨氏弹性模量(E)为130.88 GPa,硬度与弹性模量比值(H/E)为0.121;与φ4mm的氮化硅球对摩,在载荷1.96 N、室温Kokubo人体模拟体液条件下,CNx薄膜的磨损速率为10-6mm3/(m·N)级,摩擦系数约为0.124,磨损后薄膜未出现裂纹和剥落.分析表明,薄膜具有的良好抗磨性能与其H/E高、抗腐蚀性强以及摩擦系统摩擦系数低相一致.     

Murray lecture tensile testing at the micrometer scale: Opportunities in experimental mechanics

The measurement of mechanical properties using specimens whose minimum dimensions are of the order of micrometers is an important new area of experimental solid mechanics. One obvious application is in the area of micro-electromechanical systems (MEMS) where the final product is on the millimeter or micrometer scale. This paper describes techniques developed at Johns Hopkins University for tensile testing of materials used in MEMS. Polycrystalline silicon is currently the most widely used material; its modulus has been measured as 158±10 GPa, and its Poisson's ratio as 0.22±0.01, with fracture strengths ranging from 1.2 to 3.0 GPa depending upon the manufacturer. The properties of silicon nitride, silicon carbide, and electroplated nickel have also been measured and are presented. In addition to the quasi-static tensile tests, new techniques and procedures for measuring strengths at stress concentrations in brittle thin-film materials, fatique testing, and high-temperature testing are described.     

Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing

Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 μm thick silicon dioxide specimens that are 100, 150, and 200 μm wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage. Strain is measured by digital imaging of two gold lines applied to the gage section of the transparent specimen. Twenty-five tests yield a Young’s modulus of 60.1 ± 3.4 GPa and a fracture strength of 364 ± 57 MPa.     

镁合金表面磁控溅射CNx/SiC/Ti多层膜的摩擦磨损性能

采用室温磁控溅射技术在镁合金(AZ91D)表面制备了CNx/SiC/Ti(氮化碳/碳化硅/钛)多层膜(SiC、Ti为中间层),研究了CNx薄膜的纳米压痕行为和摩擦磨损性能.结果表明:CNx薄膜具有低的纳米硬度(6.67GPa)、低的弹性模量(54.68GPa)和高的硬度与弹性模量比值(0.122);在以氮化硅球为对摩副的室温干摩擦条件下摩擦系数约为0.162,磨损率在10-6mm3/(m.N)级,薄膜经长时间(3.5h)磨损后未出现裂纹和剥落.分析表明,摩擦化学和硬度与弹性模量比值对摩擦系数和磨损率有重要影响.     

Bulge Testing Transparent Thin Films with Moiré Deflectometry

The problem that is addressed here is the measurement of the mechanical properties of very thin, transparent films using bulge tests. All existing techniques make use of reflection from the film surface, but they can be difficult or impossible to apply to very thin, transparent films. Consequently, a novel approach based on the formation of a lens structure and using transmitted light is developed. In this technique, the focal length of the lens structure formed by the bulged film and the pressurizing medium is determined by moiré deflectometry with a corrected governing equation. The resulting curvature of the bulge film is used in the stress analysis of the bulge-test. By combining circular and rectangular configurations, the Young’s modulus and Poisson’s ratio of a 3 μm PET film were 4.65 ± 0.11 GPa and 0.34 ± 0.01, respectively. Consistent residual stresses were obtained from both configurations.     

Deflection Measurement and Determination of Young’s Modulus of Micro-cantilever Using Phase-shift Shadow Moiré Method

The deflection of micro-structures have been previously measured using optical interferometry methods. In this study, the classical phase-shift shadow moiré method (PSSM) was applied to measure the deflection of a silicon micro-cantilever and to determine the Young’s modulus of the cantilever material. The modulus value was determined from the profile based on deflection equation. A normal white light source and a grating of 40 line pairs per mm were used to generate the moiré fringes. Since the use of white light and high-resolution grating produces low contrast moiré fringes, the fringe visibility was enhanced by applying contrast enhancement and filtering techniques. The Young’s modulus of the silicon cantilever material was estimated to be 165.9 GPa with an uncertainty of ±11.3 GPa (6.8%). The experimental results show that the PSSM method can be successfully applied for characterizing micro-cantilevers. Comparison of the deflection profile from the proposed method and a commercial 3-D optical profiler showed that the measurement range and sensitivity of PSSM are not affected by the poor contrast images.     

A molecular mechanics study on size-dependent elastic properties of single-walled boron nitride nanotubes

We present an analytical study for the elastic properties of single-walled boron nitride nanotubes via a molecular mechanics model. Closed-form expressions for Young's modulus, Poisson's ratio and surface shear modulus are derived as functions of the nanotube diameter. The results are helix angle sensitive and comparable to those from ab initio calculations. This work is a first effort to establish analytical model of molecular mechanics for composite nanotubes and reveals the dissimilarities between size-dependent elastic properties of carbon and boron nitride nanotubes.     

The Development of a High Rate Tensile Testing System for Micro Scaled Single Crystal Silicon Specimens

Structures have been built at micro scales with unique failure mechanisms that are not yet understood, in particular, under high-rate loading conditions. Consequently, microelectromechanical systems (MEMS) devices can suffer from inconsistent performance and insufficient reliability. This research aims to understand the failure mechanisms in micro-scaled specimens deforming at high rates. Single-crystal silicon (SCS) micro specimens that are 4 μm thick are subjected to tensile loading at an average strain rate of 92 s^?1 using a miniature Hopkinson tension bar. A capacitance displacement system and piezoelectric load cell are incorporated to directly measure the strain and stress of the silicon micro specimens. The average dynamic elastic modulus of the silicon micro specimens is measured to be 226.8?±?18.50 GPa and the average dynamic tensile strength of the silicon is measured to be 1.26?±?0.310 GPa. High-speed images show that extensive fragmentation of the specimens occurs during tensile failure.     

Tensile testing of polysilicon

Tensile specimens of polysilicon are deposited on a silicon wafer; one end remains affixed to the wafer and the other end has a relatively large paddle that can be gripped by an electrostatic probe. The overall length of the specimen is less than 2 mm, but the smooth tensile portion can be as small as 1.5×2m in cross section and 50m long. The specimen is pulled by a computer-controlled translation stage. Force is recorded with a 100-g load cell, whereas displacement is recorded with a capacitance-based transducer. Strain can be measured directly on wider specimens with laser-based interferometry from two small gold markers deposited on the smooth portion of the specimen. The strength of this linear and brittle material is measured with relative ease. Young's modulus measurement is more difficult; it can be determined from either the stress-strain curve, the record of force versus displacement or the comparison of the records of two specimens of different sizes. Specimens of different sizes—thicknesses of 1.5 or 3.5 m, widths from 2 to 50 m and lengths from 50 to 500 m—were tested. The average tensile strength of this polysilicon is 1.45±0.19 GPa (210 ±28 ksi) for the 27 specimens that could be broken with electrostatic gripping. The average Young's modulus from force displacement records of 43 specimens is 162±14 GPa (23.5 ±2.0×10³ ksi). This single value is misleading because the modulus values tend to increase with decreasing specimen width; that is not the case for the strength. The three methods for determining the modulus agree in general, although the scatter can be large.     

Modulus, Fracture Strength, and Brittle vs. Plastic Response of the Outer Shell of Arc-grown Multi-walled Carbon Nanotubes

The fracture strengths and elastic moduli of arc-grown multi-walled carbon nanotubes (MWCNTs) were measured by tensile loading inside of a scanning electron microscope (SEM). Eighteen tensile tests were performed on 14 MWCNTs with three of them being tested multiple times (3×, 2×, and 2×, respectively). All the MWCNTs fractured in the “sword-in-sheath” mode. The diameters of the MWCNTs were measured in a transmission electron microscope (TEM), and the outer diameter with an assumed 0.34 nm shell thickness was used to convert measured load-displacement data to stress and strain values. An unusual yielding before fracture was observed in two tensile loading experiments. The 18 outer shell fracture strength values ranged from 10 to 66 GPa, and the 18 Young's modulus values, obtained from a linear fit of the stress–strain data, ranged from 620 to 1,200 GPa, with a mean of 940 GPa. The possible influence of stress concentration at the clamps is discussed.     

有限厚度模型校准二维MoS2的Bimodal-AFM杨氏模量测量

二维材料因其独特的晶体结构、新奇的物理特性和优异的力学性能, 在微纳机电系统、柔性电子器件等诸多领域有着广阔的应用前景. 弹性模量是二维材料的基本力学特性参量之一, 对其器件应用及应变调控有重要影响. 受限于二维结构和原子级厚度特征, 难以实现二维材料弹性模量的精确测量. 双模原子力显微镜的振幅调制-频率调制模式是一种高效测量二维材料杨氏模量的方法, 但刚性衬底对测量结果的影响不可忽视. 本工作通过双模原子力显微镜直接测得衬底与二维硫化钼的杨氏模量分布图, 并基于有限厚度模型对衬底效应进行修正, 得到了样品的本征杨氏模量值. 利用第一性原理计算得到了二维二硫化钼的弹性系数和杨氏模量, 对比发现实验和计算结果相当. 这说明双模原子力显微镜测量是一种可靠的二维材料杨氏模量直接测试方法, 且该方法无需制备悬空二维材料等繁琐步骤, 避免了常规测试中的不足. 本工作为大面积二维材料薄膜力学性能的程序化测试分析以及高通量力学实验数据的统计分析提供了可靠的实验基础.      

Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices

The mechanical properties of ultrananocrystalline diamond (UNCD) thin films were measured using microcantilever deflection and membrane deflection techniques. Bending tests on several free-standing UNCD cantilevers, 0.5 μm thick, 20 μm wide and 80 μm long, yielded elastic modulus values of 916–959 GPa. The tests showed good reproducibility by repeated testing on the same cantilever and by testing several cantilevers of different lengths. The largest source of error in the method was accurate measurement of film thickness. Elastic modulus measurements performed with the novel membrane deflection experiment (MDE), developed by Espinosa and co-workers, gave results similar to those from the microcantilever-based tests. Tests were performed on UNCD specimens grown by both micro and nano wafer-seeding techniques. The elastic modulus was measured to be between 930–970 GPa for the microseeding and between 945–963 GPa for the nanoseeding technique. The MDE test also provided the fracture strength, which for UNCD was found to vary from 0.89 to 2.42 GPa for the microseeded samples and from 3.95 to 5.03 for the nanoseeded samples. The narrowing of the elastic modulus variation and major increase in fracture strength is believed to result from a reduction in surface roughness, less stress concentration, when employing the nanoseeding technique. Although both methods yielded reliable values of elastic modulus, the MDE was found to be more versatile since it yielded additional information about the structure and material properties, such as strength and initial stress state.     

Modeling and measuring visco-elastic properties: From collagen molecules to collagen fibrils

Collagen is the main structural protein in vertebrate biology, determining the mechanical behavior of connective tissues such as tendon, bone and skin. Although extensive efforts in the study of the origin of collagen exceptional mechanical properties, a deep knowledge of the relationship between molecular structure and mechanical properties remains elusive, hindered by the complex hierarchical structure of collagen-based tissues. Understanding the viscoelastic behavior of collagenous tissues requires knowledge of the properties at each structural level. Whole tissues have been studied extensively, but less is known about the mechanical behavior at the submicron, fibrillar and molecular level. Hence, we investigate the viscoelastic properties at the molecular level by using an atomistic modeling approach, performing in silico creep tests of a collagen-like peptide. The results are compared with creep and relaxation tests at the level of isolated collagen fibrils performed previously using a micro-electro-mechanical systems platform. Individual collagen molecules present a non-linear viscoelastic behavior, with a Young's modulus increasing from 6 to 16 GPa (for strains up to 20%), a viscosity of 3.84±0.38 Pa s, and a relaxation time in the range of 0.24–0.64 ns. At the fibrils level, stress–strain–time data indicate that isolated fibrils exhibit viscoelastic behavior that could be fitted using the Maxwell–Weichert model. The fibrils showed an elastic modulus of 123±46 MPa. The time-dependent behavior was well fit using the two-time-constant Maxwell–Weichert model with a fast time response of 7±2 s and a slow time response of 102±5 s.     

A Sequential Tensile Method for Rapid Characterization of Extreme-value Behavior in Microfabricated Materials

A high-throughput sequential tensile test method has been developed to characterize the fracture strength distribution of microfabricated polycrystalline silicon, the primary structural material used in microelectromechanical systems (MEMS). The resulting dataset of over 1,000 microtensile tests reveals subtle extreme-value behavior in the tails of the distribution, demonstrating that the common two-parameter Weibull distribution is inferior to a three-parameter Weibull model. The results suggest the existence of a cut-off or threshold stress (1.446 GPa for this particular material) below which tensile failure will not occur. The existence of a cut-off stress suggests that the material’s flaw size distribution and toughness distribution are both also bounded. From an application perspective, the cut-off stress provides a statistically-sound basis for reliable design. While the sequential method is demonstrated here for tensile strength distributions in polycrystalline silicon MEMS, the technique could be extended to a wide range of mechanical tests (bending strength, elastic modulus, fracture toughness, creep, etc.) for both microsystem and conventional materials.     

EFFECTS OF SI,N AND B DOPING ON THE MECHANICAL PROPERTIES OF GRAPHENE SHEETS

Molecular dynamics(MD) simulations were performed to stretch the rectangular graphene sheets doped with silicon, nitrogen or boron atoms. Young's modulus, ultimate stress(strain) and energy absorption were measured for the graphene sheets with the doping concentration(DC) ranging from 0 to 5%. The emphasis was placed on the distinct effects of each individual dopant on the fundamental mechanical properties of graphene. The results indicated that incorporating the dopants into graphene led to an almost linear decrease in Young's modulus. Monotonic reductions in ultimate strength, ultimate strain and energy absorption were also observed. Such doping effects were found to be most significant for silicon, less pronounced for boron, and small or negligible for nitrogen. The outputs provide an important guidance for the development and optimization of novel nanoscale devices, and facilitate the development of graphene-based M/NEMS.     

ANALYSIS OF NANOBRIDGE TESTS

This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam.Analytical displacement-load relation, including adhesive contact deformation and substrate deformation, is presented here for small deformation of bending.The analytic results are confirmed by finite element analysis.If adhesive contact deformation and substrate deformation are not considered in the analysis of nanobridge test data, they might lead to lower values of Young＇s modulus of tested nanobeams.     

稀土超磁致伸缩材料应力与电磁耦合特性的实验研究

讨论了稀土超磁致伸缩棒特性实验的若干应力与电磁耦合问题，利用自己设计制作的实验装置建立了应力电磁耦合系统的物理模型，应用阻抗分析方法得到了相应的等效电路。测定了在电磁场与应力场共同作用下ＴｂｘＤｙ１－ｘＦｅ２－ｚ三元稀土合金超磁致伸缩棒的磁致伸缩系数，机电耦合系数等。针对磁通泄漏问题，专门设计制作了圆柱型硅钢密闭磁路，本的实验结果为稀土眼磁致伸缩材料应用器提供了重要而准确的数据。     

高分子材料机械密封磨损特性及表面织构的影响

为提高金属/高分子材料机械密封的抗磨损性能,采用光刻-电解技术在316不锈钢表面制作微凹坑阵列形式的表面织构,与5种不同弹性模量的高分子材料组成摩擦副进行磨损试验.试验结果表明,对弹性模量最小的UHMWPE材料,表面织构起到了增磨作用,对其他四种弹性模量较高的材料,表面织构起到减磨作用,而且,随着高分子材料弹性模量的增大,表面织构表现出的减磨作用也随之增大.为解释这个现象,利用ANSYS有限元分析软件对摩擦副接触面进行了应力和变形分析,结果表明:织构化表面在接触过程中会产生应力集中和表面形变,材料的弹性模量越小,凹坑引起的变形越明显,可能产生的切削作用越显著.     

NANOINDENTATION OF THIN-FILM-SUBSTRATE SYSTEM： DETERMINATION OF FILM HARDNESS AND YOUNG’S MODULUS

In the present paper, the hardness and Young‘s modulus of film-substrate systems are determined by means of nanoindentation experiments and modified models. Aluminum film and two kinds of substrates, i.e. glass and silicon, are studied. Nanoindentation XP Ⅱ and continuous stiffness mode are used during the experiments. In order to avoid the influence of the Oliver and Pharr method used in the experiments, the experiment data are analyzed with the constant Young‘s modulus assumption and the equal hardness assumption. The volume fraction model (CZ model) proposed by Fabes et al. (1992) is used and modified to analyze the measured hardness. The method proposed by Doerner and Nix (DN formula) (1986) is modified to analyze the measured Young‘s modulus. Two kinds of modified empirical formula are used to predict the present experiment results and those in the literature, which include the results of two kinds of systems, i.e., a soft film on a hard substrate and a hard film on a soft substrate. In the modified CZ model, the indentation influence angle, φ, is considered as a relevant physical parameter, which embodies the effects of the indenter tip radius, pile-up or sink-in phenomena and deformation of film and substrate.