Intermetallic phase formation in electrochemical alloy deposition

Three examples of the electrochemical deposition of intermetallic phases are shown. Electrodeposition of the single-phase -brass superlattice at underpotentials of Zn in Cu-Zn alloy plating is explained by an accumulative underpotential deposition (UPD) mechanism. Growth of the Cu-Sn intermetallic phase layer in the contact immersion deposition of Sn onto Cu is accounted for by a UPD/vertical solid-state diffusion mechanism. Ag₃Sn formation in the Sn/Ag-nanoparticle composite plating is illustrated by atomic site exchange at the interface between the deposited Sn matrix and the occluded Ag nanoparticles.     

锰欠电位沉积的密度泛函计算与循环伏安实验的研究

用密度泛函计算和循环伏安法研究了锰在金和铅表面的欠电位沉积(UPD)行为. 理论计算, 假设生成紧密的二维相(2D)欠电位沉积层, 用基于密度泛函理论的DMol3软件计算在金与铅表面生成2D相锰层的欠电位偏移值∆fE2DMe, 证明锰在金表面可发生欠电位沉积, 而在铅表面不能发生欠电位沉积. 循环伏安实验结果与理论计算不一致: 金电极析氢电位高不利于研究锰的还原沉积反应, 没有发现锰的欠电位沉积现象; 铅电极在MnCl2溶液中有锰的欠电位沉积现象. 这种理论计算与电化学实验结果的差异, 主要是因为理论计算没有考虑溶剂与阴离子特性吸附作用的影响, 理论计算模型是电化学实验体系的一种理想模型.     

锌在金电极上的欠电位沉积

采用循环伏安法和计时电流法,研究了强碱溶液中锌在金电极上的欠电位沉积。 通过改变锌离子浓度和扫描速率等实验参数,在约-0.935 V（vs.SCE）开始出现锌的欠电位沉积,并且金属离子浓度的变化可能会影响到欠电位沉积过程的动力学机制;计时电流实验证实,锌欠电位沉积于金衬底上遵循的是受掺入吸附原子控制的二维瞬时成核和生长机制;且OH-离子的吸附对锌欠电位沉积具有重要的影响。     

Underpotential deposition of tin(II) on a gold disc electrode and determination of tin in a tin plate sample

This work describes a study of the underpotential deposition (UPD) of Sn²⁺ on a polycrystalline gold disc electrode using cyclic voltammetry (CV) and chronocoulometry (CC). Sn²⁺ ions showed well-defined peaks from UPD and UPD stripping (UPD-S) in 1 mol/L HCl solutions, while bulk deposition (BD) and BD stripping (BD-S) of the ions were also observed. The measured UPD shifts, E_UPD, between the UPD-S and the BD-S peaks were more than 200 mV. The UPD charge and the surface coverage of tin were measured by CC. A new method for determining Sn²⁺ was therefore developed, based on the excellent electrochemical properties of the Au/Sn UPD system. A plot of the UPD-DPASV (differential pulse anodic stripping voltammetry) signal versus the Sn(II) concentration was obtained for [Sn(II)] of 1.98×10^–7 to 3.64×10^–5 M. The method developed here has been applied to determine the tin in a tin plate sample.     

一种金属单晶电极制备方法的建立和Cu2+在铂单晶上UPD过程的研究

同种材料而表面结构不同的电极往往有完全不同的电化学性能.使用在原子水平上表面结构明确的单晶电极不仅有助于对电极表面吸脱附过程、电场作用下表面结构重组、双电层微观结构、分子水平上的反应机理等基础理论进行深入研究,且对高选择性、高效电催化剂的研制也有指导意义.单晶电化学研究的基础就是制备定向不同的单晶电极.本文建立了金属单晶电极制备方法,并报道了Cu²⁺在Pt单晶电极上UPD(欠电位沉积)过程的研究结果.     

Pb deposition on I-coated Au(111). UHV-EC and EC-STM studies

This article concerns the growth of an atomic layer of Pb on the Au(111)( radical3 x radical3)R30 degrees -I structure. The importance of this study lies in the use of Pb underpotential deposition (UPD) as a sacrificial layer in surface-limited redox replacement (SLRR). SLRR reactions are being applied in the formation of metal nanofilms via electrochemical atomic layer deposition (ALD). Pb UPD is a surface-limited reaction, and if it is placed in a solution of ions of a more noble metal, redox replacement can occur, but limited by the amount of Pb present. Pb UPD is a candidate for use as a sacrificial layer for replacement by any more noble element. It has been used by this group for both Cu and Pt nanofilm formation using electrochemical ALD. The I atom layer was intended to facilitate electrochemical annealing during nanofilm growth. Two distinctly different Pb atomic layer structures are reported, studied using in situ scanning tunneling microscopy (STM) with an electrochemical flow cell and ultrahigh vacuum surface analysis combined directly with electrochemical reactions (UHV-EC). Starting with the initial Au(111)( radical3 x radical3)R30 degrees -I, 1/3 monolayer of I on the Au(111) surface, Pb deposition began at approximately 0.1 V. The first Pb UPD structure was observed just below -0.2 V and displayed a (2 x radical3)-rect unit cell, for a structure composed of 1/4 monolayer each of Pb and I. The I atoms fit in Pb 4-fold sites, on the Au(111) surface. The structure was present in domains rotated by 120 degrees. Deposition to -0.4 V resulted in complete loss of the I atoms and formation of a Pb monolayer on the Au(111), which produced a Moiré pattern, due to the Pb and Au lattice mismatch. These structures represent two well-defined starting points for the growth of nanofilms of other more noble elements. It is apparent from these studies that the adsorption of I- on Pb is weak, and it will rinse away. If Pb is used as a sacrificial metal in an electrochemical ALD cycle and adsorbed I atoms are employed for electrochemical annealing, I atoms will need to be applied each cycle.     

Estimation of electrochemical quartz crystal microbalance frequencies from cyclic voltammetric data:—underpotential deposition of metals as an illustration

The estimation of electrochemical quartz crystal microbalance (EQCM) frequencies from a given cyclic voltammetric data is analysed using underpotential deposition (UPD) of metals as an illustrative process. The crucial role played by the surface roughness of electrodes and electrosorption valency of the depositing species is pointed out. The computed EQCM frequency shifts for the UPD of Cd and Tl on polycrystalline Ag electrodes are in satisfactory agreement with the experimental data.

Underpotential deposition studies of copper on glassy carbon

Studies on the deposition and dissolution of copper from 0·5 M sulphuric acid solutions onto glassy carbon (GC) using potential sweep techniques indicated that an additional peak occurs at higher positive potentials than the bulk stripping peak. This peak is identified as due to the stripping of underpotential deposited (UPD) copper. Results of investigations on the effect of sweep rate, deposition potential and time of deposition on the peak characteristics of UPD and bulk deposited copper are also reported.     

Bismuth underpotential deposition on tellurium

Electroless underpotential deposition (UPD) of Bi adatoms (Bi_ad) on Te by Bi^III reduction with Ti^III in aqua solution has been investigated. Comparison studies of electroless Bi UPD on Te and of a corresponding electrochemical process have been performed. Bi_ad stability on Te under the open-circuit conditions has been investigated.     

Underpotential deposition of thallium, lead, and cadmium at silver electrodes modified with self-assembled monolayers of (3-mercaptopropyl)trimethoxysilane

Investigation of the underpotential deposition (UPD) of three metals-Tl, Pb, and Cd-on Ag surfaces modified with self-assembled monolayers (SAMs) of (3-mercaptopropyl)trimethoxysilane (3MPT) is reported. On the basis of the observation of negative potential shifts for their UPD processes, Tl and Pb undergo UPD directly on the underlying Ag surface by insertion between the Ag-S bond. This process is proposed to occur by penetration of the 3MPT monolayer by hydrated metal ions through spaces in six-membered siloxane rings that form at the terminus of the 3MPT layer after hydrolysis and condensation. In contrast, Cd does not undergo similarly facile UPD at 3MPT-modified Ag electrodes due to a hydrated ion size too large to fit through these openings. The voltammetric evidence that suggests that the hydrated metal cation size, as described by the Stokes diameter, is the primary determinant of Ag electrode accessibility for UPD through the cross-linked 3MPT layer is further supported by molecular mechanics energy minimization computations of six-membered siloxane rings on each of the three low-index faces of Ag. Finally, the 3MPT monolayer is shown to be exceptionally stable to repeated UPD/stripping cycles of Tl and Pb in contrast to SAMs of similar thickness formed from normal alkanethiols.     

Stripping voltammetry of copper and lead using gold electrodes modified with self-assembled monolayers

One problem associated with using bare solid metal electrodes, such as gold and platinum, in stripping analysis to determine heavy metal ions such as lead and copper ions in dilute solutions is that underpotential deposition (UPD) gives multiple stripping peaks in the analysis of mixtures. These peaks are often overlapped and cannot be conveniently used for analytical purposes. Bifunctional alkylthiols, such as 3-mercaptopropionic acid, with an ionizable group on the other terminal end of the thiol can form self-assembled monolayers (SAMs) on the surface of the gold electrode. It is shown that such an SAM-modified gold electrode minimizes the UPD effects for the stripping analysis of lead and copper. The anodic peak potential shifts and the peak shape changes, indicating that the SAM changes the deposition and stripping steps of these heavy metal ions. Thus, the sensitivity levels for both single species and mixtures can be significantly improved for the conventional solid electrodes. The mechanism of the deposition reaction at the SAM-modified gold electrodes is discussed. Received: 29 May 1997 / Accepted: 24 June 1997     

欠电势沉积Bi-Te基体系热电材料的平衡热力学分析

基于普通的能斯特方程, 建立了单原子层平衡电势的热力学模型. 据此, 分析了单原子层覆盖度以及电吸附价与欠电势之间的相互关系, 获得了沉积物与衬底之间干涉特性. 并且分析了Bi-Te基体系欠电势沉积热力学特性. 通过对Bi欠电势沉积在几个不同的金属衬底体系的分析阐明了功函数随覆盖度的变化机制. 研究了铋离子的浓度变化对铋的欠电势及覆盖度的影响关系, 结果表明, 铋在铂上欠电势沉积的体系在整个欠电势范围内具有恒定的电吸附价, 而铋在覆盖了一层碲的铂衬底上欠电势沉积的体系其电吸附价随覆盖度的增加而降低, 从热力学理论角度对铋在碲覆盖的衬底上导致欠电势负移的特性给予了解释.     

New insights into the Sn underpotential deposition on Au(100)

The underpotential deposition (UPD) of Sn in the system Au(100)/Sn²⁺, SO₄^2? has been studied by classical electrochemical techniques and in situ scanning tunneling microscopy. The results show that the Sn UPD initiates at relatively high potentials with the formation of a quasi‐hexagonal structure characterized as Au(100) ? (√2 × 7)R45°. This expanded overlayer contributes to the modification of the surface morphology which exhibits flat terraces with step edges showing angles of 60 or 120°. At lower potentials two‐dimensional (2D) islands are formed which tend to grow, causing a coverage increase. In the underpotential region close to the formation of the 3D bulk phase the long time polarization experiments indicate the formation of different Au–Sn alloy phases. Copyright © 2011 John Wiley & Sons, Ltd.     

铅于旋转银盘电极上欠电位沉积的计时库仑法研究

用计时库仑法研究了Ｐｂ２＋于旋转Ａｇ盘电极（Ａｇ－ＲＤＥ）上的欠电位沉积（ＵＰＤ）性质。实验证明,支持电解质（０．０１ｍｏｌ／Ｌ　ＨＮＯ３＋０．０１　ｍｏｌ／Ｌ ＮａＣＩ）中Ｃｌ－离子的存在有利于取得稳态条件下ＵＰＤ Ｐｂ的电量值。其氧化过程电量（Ｑａ）,代表Ｐｂ２＋吸附单层被定量转化为ＵＰＤ Ｐｂ单层的量,Ｑａ的平均值为３９３．３μＣ／ｃｍ２,相应于２×１０－９ｍｏｌ／ｃｍ２Ｐｂ２＋表面复盖量。     

Influence of steric and intramolecular inductive effects on the variable trends in R-X (R=Alkyl) bond dissociation energy

The question “why are the variation trends of R-X bond dissociation energy different?” is answered. The R-X bond dissociation energy (BDE) may be influenced by three main factors: the C-X intrinsic bond energy, the 1,3 geminal repulsion, and the intramolecular charge-induced dipole. In the presence of atom X, the variation trend of BDE in R-X (R= Me, Et, i-Pr, t-Bu) is dominated by two factors, the 1,3 geminal repulsion and the intramolecular charge-induced dipole. The former decreases the R-X BDE, and the latter either increases or decreases the R-X BDE. For the series of R-X with the R-C bond (such as R-Me, R-CH == CH², R-C≡CH, and R-CN), the 1,3 geminal repulsion decreases the R-X BDE, and the variation trends of R-C BDE decrease from Me to t-Bu. As regards the series of R-X (such as R-H, R-BH², and R-SiH²) in which the electronegativity of atom X is smaller than that of the carbon atom, the above two factors decrease the R-X BDE, and the variation trends of the R-X BDE decrease from Me to t-Bu. As to the series of R-X (such as R-F, R-OH, R-Cl, R-Br, R-I, and R-NH²) in which the electronegativity of atom X is larger than that of the carbon atom, the 1,3 geminal repulsion decreases the R-X BDE, while the intramolecular charge-induced dipole increases the R-X BDE. In this case, the variation trends of R-X BDE depend on the competition of the two factors. As a result, some of them (e. g., R-F, R-OH) increase from Me to t-Bu, some (e. g., R-I) decrease from Me to t-Bu, and some (e. g., R-Br) change very little.     

离子液体中Au(111)和Pt(111)表面Ge欠电位沉积的现场STM研究

本文研究BMIPF₆离子液体中Au(111)和Pt(111)表面Ge的电沉积行为. 循环伏安法测试结果表明,在含0.1 mol·L^-1 GeCl₄的BMIPF₆溶液Au(111)和Pt(111)表面均有两个与Ge沉积过程相关的还原峰. 第一个还原峰包含了Ge⁴⁺还原成Ge²⁺及Ge的欠电位沉积,第二个还原峰对应Ge的本体沉积. 现场扫描隧道显微镜研究结果表明,Ge在Au(111)和Pt(111)表面均有两层欠电位沉积. 第一层欠电位沉积厚度约为0.25 nm、形貌平整、带有缝隙的亚单层结构. 第二层欠电位沉积形貌相对粗糙的点状团簇结构. 该欠电位沉积过程伴随表面合金化.     

Lead underpotential deposition on Au(110)

The electrochemical underpotential deposition (UPD) of lead on Au(110) was investigated by XPS using a custom‐built ultrahigh vacuum apparatus containing a chamber for electrochemical studies. A two‐step deposition process for lead UPD was confirmed. A large increase in the surface concentration of oxygen was found in solutions containing lead. The presence of lead was detected on the gold surface at all potentials within the range investigated (?500 mV to 1500 mV vs. Ag/AgCl). Degradation of chlorine by x‐rays was observed. The change in surface components with potential was investigated and linked to models of UPD and oxidation. The initial random deposition of lead from solution led to surface disordering. Copyright © 2003 John Wiley & Sons, Ltd.     

Three-dimensional porous Au nanocoral structure decorated with Pt submonolayer via galvanic displacement of copper adatoms for electrooxidation of formic acid

Three-dimensional (3D) porous Au nanocoral network (GNN) structure was fabricated on glassy carbon (GC) electrode by one-step, template-free electrodeposition and decorated with ultrathin Pt film by combining the underpotential deposition (UPD) of copper adatoms and the galvanic displacement (GD) between PtCl₆^2- and Cu. The thickness of Pt atomic layers can be controlled precisely by repeating the UPD–GD process. Scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM) were employed to characterize the morphology of GNN and Pt_n/GNN (n, the cycles of repeating the UPD–GD process). Cyclic voltammometric and chronoamperometric tests indicate that all Pt_n/GNN samples effectively support the direct oxidation of formic acid and show higher electrocatalytic performance than the commercial Pt/C catalyst (Pt, 20 wt %, Johnson Matthey Co.), where Pt₁/GNN completely eliminates the indirect oxidation of formic acid, exhibiting the best electrocatalytic activity and stability among all Pt_n/GNN samples due to the optimal coverage and distribution of Pt atoms on GNN.     

Investigation of nucleation processes under the influence of magnetic fields

The present work demonstrates the possibilities and the limits of the in situ electrochemical scanning tunneling microscopy for investigation of nucleation processes in magnetic fields on the examples of Cu and Co electrodeposition onto Au(111) electrodes from sulfate electrolytes with pH 3. Cyclic voltammograms of Cu in the underpotential range (UPD) exhibit no significant change in the cathodic and anodic peaks recorded in magnetic fields parallel to the surface. In magnetic fields of a permanent magnet, the reconstruction of Au has been annihilated during UPD of Cu. In the overpotential range, the dissolution of Cu is inhibited. This triggers the formation of a Cu–Au surface alloy. The UPD deposition of Co onto Au(111) could be proven without magnetic field, which leads to the formation of two monolayers. The nucleation in an applied field could not be observed due to higher induced fluctuations and microconvective effects. Contribution to special issue “Magnetic field effects in Electrochemistry”.     

Underpotential deposition of Cu on partially oxidized Rh electrodes

The underpotential deposition (UPD) of copper on partially oxidized rhodium electrodes was studied in acid medium using potentiodynamic techniques. The process was analyzed as a function of the potential and time of deposition. The potentiodynamic I-E patterns for the oxidative dissolution of Cu provide evidence for the existence of a chemical reaction between Cu and oxygen existing on the electrode surface. Redistribution of the active sites is also possible when appreciable quantities of oxidized species are simultaneously reduced by the UPD process. The partially oxidized rhodium electrodes were prepared by cyclic voltammetry and anodic polarization. The later method provided the most oxidized surfaces, but, even in this case, the degree of oxygen surface coverage was lower than that corresponding to a monolayer. Received: 11 July 1997 / Accepted: 10 February 1998