Porphyrin-containing polyimide films deposited by high vacuum co-evaporation

Thin films of porphyrin-containing polyimide were produced by high vacuum co-evaporation of 4,4′-hexafluoroisopropylidene diphthalic anhydride (6FDA), 3,3′-diaminodiphenyl sulfone (DDS) and 5,10,15,20 meso-tetraphenyl porphyrin (TPP). The films were characterized by FT-IR analysis, optical absorption and emission spectroscopy. FT-IR analysis shows that the film matrix is comprised of only unreacted monomers. The conversion of monomers to polyamic acid and the following condensation to polyimide were studied by curing the samples at temperatures up to 240 °C. The amount of polyamic acid increases from room temperature to 120 °C, while at higher temperature it starts to condense to polyimide. Optical analysis shows that TPP is incorporated in the film matrix and its chemical state is determined by the interaction with the monomers, polyamic acid and polyimide. After curing the TPP molecules are finely dispersed in the polyimide matrix and their absorption and fluorescence properties are wholly preserved.     

Microstructure and properties of organosoluble polyimide/silica hybrid films

Organosoluble polyimide/silica hybrid materials were prepared via the sol-gel process and their pervaporation properties were studied. The organosoluble polyimide (PI) was based on 4,4′-oxydiphthlic dianhydride (ODPA) and 4,4′-diamino-3,3′-dimethyldiphenylmethane (DMMDA). The surface chemical structure of polyimide/silica films was analyzed by Fourier transform infrared (FT-IR) and X-ray photoelectron spectroscopy (XPS) and the results show that the completely hydrolysis of alkoxy groups of precursors and formation of the three-dimensional Si-O-Si network in the hybrid films. The morphology and the silica domain thus obtained were studied by scanning electron microscopy (SEM) and atomic force microscopy (AFM), respectively. The silica particle size in the hybrid is in the range of 40-100 nm for the hybrid films when the amount of silica is less than 20 wt%. The strength and the modulus of the hybrid films are improved and the mechanical properties were found to be strongly dependent on the density of the crosslink. The glass transition temperature (T_g) of the hybrid films was determined by dynamic mechanical analysis (DMA) and the value increased 15-20 °C as the silica content increased. Furthermore, the pervaporation performances of the prepared hybrid films were also investigated for the ethanol/water mixtures at different temperature.     

Thermal degradation kinetics of polyimide containing 2,6-benzobisoxazole units

A novel polyimide (PI) based on 2,6-bis(p-aminophenyl)-benzo[1,2-d;5,4-d′]bisoxazole has been synthesized via a conventional two-stage procedure with bis(ether anhydrides) (HQDPA). The intermediate poly(amic acid) had inherent viscosities of 1.70 dl/g and could be thermally converted into light yellow polyimide film. The resulted polyimide showed excellent thermal stability, and the glass transition temperatures (T_g) were above 283 °C, the 5% weight loss temperature of the polymer was at 572 °C in N₂. The thermal degradation of the polyimide was studied by thermogravimetric analysis (TGA) in order to determine the actual reaction mechanisms of the decomposition process. The activation energy of the solid-state process was determined using Flynn-Wall-Ozawa method, which does not require knowledge of the reaction mechanism, which resulted to be 361.36 kJ/mol. The activation energy of different mechanism models and pre-exponential factor (A) were determined by Coats-Redfern method. Compared with the value obtained from the Ozawa method, the actual reaction mechanism obeyed nucleation and growth model, Avrami-Erofeev function (A₃) with integral form g(X) = [−ln(1−X)]³.     

Solution-processable transparent polyimides with low coefficients of thermal expansion and self-orientation behavior induced by solution casting

A fluorinated tetracarboxylic dianhydride (amide-type TA-TFMB) was prepared from trimellitic anhydride chloride and 2,2′-bis(trifluoromethyl)benzidine (TFMB). A chemically imidized polyimide (PI) derived from TA-TFMB and TFMB was rather soluble in various solvents. Solution casting of this PI (TA-TFMB/TFMB) led to a flexible, non-turbid, and seemingly almost colorless PI film with a high T_g of 328 °C and a considerably low coefficient of thermal expansion (CTE) of 9.9 ppm K⁻¹ which results from significant in-plane chain orientation induced during solution casting. The self-orientation mechanism is discussed. The properties of TA-TFMB/TFMB were compared with those of some relevant systems. The results suggest that an electron-withdrawing effect of the 2,2′-CF₃ substituents of TA-TFMB and a twisted conformation of the central biphenyl moiety greatly contribute to the suppressed coloration of the TA-TFMB/TFMB film. The use of a TA-TFMB counterpart (ester-type TA-TFBP) was effective for further enhancing the transparency owing to reduced charge-transfer interaction. However, the thermal properties of TA-TFBP/TFMB were not always satisfactory. Copolymerization using 2,3,6,7-naphthalenetetracarboxylic dianhydride led to a PI film with an increased T_g of 277 °C and a very low CTE of 12.6 ppm K⁻¹ without significant decreases in the transparency and the solubility. Thus, this work proposes promising candidates as novel heat-resistant plastic substrate materials in display devices.     

A 3,3′-dichlorobenzidine-imprinted polymer gel surface plasmon resonance sensor based on template-responsive shrinkage

Molecularly imprinted polymer gel film on the gold substrate of a chip was prepared with minute amount of cross-linker for the fabrication of a surface plasmon resonance (SPR) sensor sensitive to 3,3′-dichlorobenzidine. The molecularly imprinted gel film was anchored on a gold chip by a surface-bound photo-radical initiator. The sensing of 3,3′-dichlorobenzidine is based on responsive shrinkage of the imprinted polymer gel film that is triggered by target binding. This change can improve the responsiveness of the imprinted SPR sensor to 3,3′-dichlorobenzidine. The molecularly imprinted polymer gel film was characterized with contact angle measurements, electrochemical impedance spectroscopy, cyclic voltammogram, swelling measurements and atomic force microscopy. The changes of SPR spectroscopy wavenumber shifts revealed that the imprinted gel sensing film can ‘memorize’ the binding of 3,3′-dichlorobenzidine compared to non-imprinted one. The imprinted gel-SPR sensor showed a linear response in the range of 9.0 × 10⁻¹² to 5.0 × 10⁻¹⁰ mol L⁻¹ (R² = 0.9998) for the detection of 3,3′-dichlorobenzidine, and it also exhibited high selectivity to 3,3′-dichlorobenzidine compared to its structurally related analogues. We calculated the detection limits to be 0.471 ng L⁻¹ for tap water and 0.772 ng kg⁻¹ for soil based on a signal to noise ratio of 3. The method showed good recoveries and precision for the samples spiked with 3,3′-dichlorobenzidine. This suggest that the imprinted gel-SPR sensing method can be used as a promising alternative for the detection of 3,3′-dichlorobenzidine.     

Phenylethynyl terminated oligoimides derived from 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride and their adhesive properties

A series of phenylethynyl terminated oligoimides based on 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride (DSDA), m-phenylene diamine (m-PDA) or/and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) with calculated molecular weight of 5000 g mol⁻¹ were synthesized. The effect of molecular structure on solubility and melt viscosity of oligoimides as well as the thermal properties of cured polyimide resins was investigated. Experimental results indicated that the oligoimides have good solubility in strong polar solvents to afford homogeneous solutions with the solid content as high as 50 wt%. The oligoimides exhibited better solubility and lower minimum melt viscosity at relatively lower temperature with the incorporation of flexible 6FAPB. These oligoimides could be thermally cured at 320-380 °C to give thermosetted resins. The cured resins have good thermal stability with the glass transition temperatures of 278-329 °C and the onset decomposition temperatures higher than 500 °C. Adhesive properties of polyimides adhered to stainless steel at various conditions were evaluated by lap shear strength test. It was found that the LSS at room temperature increased with the molar ratio of 6FAPB increasing. The polyimides with combination of rigid and flexible structures exhibited good adhesive properties. With the increasing of curing temperature, the lap shear strength of polyimides at elevated temperature maintained at a high level due to the formation of strong bond.     

High strength electrospun polymer nanofibers made from BPDA-PDA polyimide

A series of high molecular weight PI precursors, poly(p-phenylene biphenyltetracarboxamide acid), were synthesized from 3,4,3′,4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) by using intense mechanical stirring at −15 to 0 °C for 48-72 h. The as-synthesized PI precursor solution was used to make BPDA/PDA polyimide thin films and electrospun nanofibers. IR, Ostward Viscometer, CMT-8102 Electromechanical Universal Testing Machine and scanning electron microscope (SEM) were used for the characterizations of the as-synthesized PI precursor, PI films and nanofiber sheets. The high molecular weight BPDA/PDA PI thin films and electrospun nanofiber sheets possess excellent mechanical properties of up to 900 MPa tensile strength with up to 18.0 GPa E-modulus and up to 210 MPa tensile strength with up to 2.5 GPa E-modulus, respectively.     

Pattern formation of polyimide by using photosensitive polybenzoxazole as a top layer

A versatile method for positive-type patterning of polyimide (PI) based on a two-layer photosensitive poly(benzoxazole) (PSPBO) and poly(amic acid) (PAA) film has been developed to provide a promising material in the field of microelectronics. This patterning system consisted of a pristine PAA thick bottom-layer and a poly(o-hydroxy amide) (PHA) thin top layer with 9,9-bis[4-(tert-butoxycarbonyl-methyloxy)phenyl]fluorene (TBMPF) as a dissolution inhibitor, and (5-propylsulfonyloxyimino-5H-thiophene-2-ylidene)-(2-methylphenyl)-acetonitrile (PTMA) as a photoacid generator (PAG). The PHA and PAA were prepared from 4,4′-(hexafluoroisopropylidene)-bis(o-aminophenol) and 4,4′-oxybis(benzoic acid) derivatives, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-oxydianiline, respectively, in N,N-dimethylacetamide. This two-layer system based on PHA (150-nm thickness) and PAA (1.5-μm thickness) showed high sensitivity of 35 mJ/cm² and high contrast of 10.3 when exposed to a 365 nm line (i-line), post-baked at 100 °C for 2 min, and developed in a 2.38 wt.% tetramethylammonium hydroxide aqueous solution/5 wt.% iso-propanol at 25 °C. A clear positive image of a 4-μm line-and-space pattern was printed on a film which was exposed to 100 mJ/cm² of i-line by a contact-printing mode and fully converted to the corresponding PBO/PI pattern upon heating at 350 °C, confirmed by FT-IR spectroscopy. This two-layer system could be applied to the patterning of various PAAs.     

Effects of substrate temperature on properties of ITO-ZnO composition spread films fabricated by combinatorial RF magnetron sputtering

We have fabricated ITO-ZnO composition spread films to investigate the effects of substrate temperature on their electrical and optical properties by using combinatorial RF magnetron sputtering. It turned out by X-ray measurement that the film with zinc contents above 16.0 at% [Zn/(In+Zn+Sn)] showed amorphous phase regardless of substrate temperature. The amorphous ITO-ZnO film had lower resistivity than polycrystalline films. When the films were deposited at 250 °C, the minimum resistivity of 3.0×10⁻⁴ Ω cm was obtained with the zinc contents of 16.0 at%. The indium content could be reduced as high as ~30 at% compared to that of ITO for the films having similar resistivity (~10⁻⁴ Ω cm). However, a drastic increase of resistivity was observed for the ITO-ZnO films deposited at 350 °C, having zinc contents below 15.2 at%.     

Synthesis and characterization of some novel aromatic polyimides

Three new diamines 1,2-di(p-aminophenyloxy)ethylene, 2-(4-aminophenoxy)methyl-5-aminobenzimidazole and 4,4-(aminopheyloxy) phenyl-4-aminobenzamide were synthesized and polymerized with 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BP), 4,4′-(hexafluoroisopropyledene)diphthalic anhydride (HF) and 3,4,9,10-perylene tetracarboxylic acid dianhydride (PD) either by one step solution polymerization reaction or by two step procedure. The later includes ring opening poly-addition to give poly(amic acid), followed by cyclodehydration to polyimides with the inherent viscosities 0.62-0.97 dl/g. Majority of polymers are found to be soluble in most of the organic solvents such as DMSO, DMF, DMAc, m-cresol even at room temperature and few becomes soluble on heating. The degradation temperature of the resultant polymers falls in the ranges from 240 °C to 550 °C in nitrogen (with only 10% weight loss). Specific heat capacity at 300 °C ranges from 1.1899 to 5.2541 J g⁻¹ k⁻¹. The maximum degradation temperature ranges from 250 to 620 °C. T_g values of the polyimides ranged from 168 to 254 °C.     

Synthesis of novel polyimides with (tert-butyldimethylsiloxy)biphenyloxy groups and the effect of side-chains content on their properties

A novel aromatic diamine 4′-(tert-butyldimethylsiloxy)biphenyl-4-yl 3,5-diaminobenzoate (DPA) was synthesized through three steps including monoesterification, silylation and hydrogenation. DPA with different ratios was copolymerized with 4,4′-diaminodiphenyl ether (ODA) and 3,3′,4,4′-biphenyl dianhydride (BPDA) to give poly(amic acid)s which were converted into polyimides (PIs) by thermal imidization. The effect of side-chain content on the thermal stability, optical transparency and surface energies was investigated by DSC, TGA, UV-vis spectra and contact angle measurement. With the content of side-chains increasing, the PIs revealed lower thermal stability, higher optical transparency and lower surface energies. The pretilt angles of 4-pentyl-4′-cyanobiphenyl (5CB) on the PI films were measured by a crystal rotation method. For the same rubbing strength, the pretilt angles increased with the increasing of the content of side-chains. When the content of side-chains rose from 5% to 20%, the pretilt angles increased from 2.8° to 15.0° under 28.5 mm of rubbing strength. When the content of side-chains increased to 70%, 80%, 90%, and 100%, the pretilt angles was 75.0°, 82.9°, 87.0°, and 87.7°, respectively, under 28.5 mm rubbing strength.     

Adhesive and dielectric properties of novel polyimides with bis(3,3′-aminophenyl)-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO)

Polyimides with a low dielectric constant and excellent adhesion were prepared from a diamine containing phosphine oxide and fluorine groups, bis(3,3′-aminophenyl-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO), and rigid-rod type dianhydride containing fluorine groups, such as 3,6-di(3′,5′-bis(trifluoromethyl)-phenyl)pyromellitic dianhydride (12FPMDA). The polyimides were synthesized via the known two-step process, preparation of poly(amic-acid) followed by solution imidization, and characterized by FT-IR, NMR, DSC, TGA and TMA. In addition, their solubility, intrinsic viscosity, dielectric constant and adhesive property were also evaluated. For comparison, 3,6-di(4′-trifluoromethylphenyl) pyromellitic dianhydride (6FPMDA) and 3,6-diphenylpyromellitic dianhydride (DPPMDA) were also utilized. The prepared polyimides exhibited high T_g (276-314 °C), excellent thermal stability (>500 °C in air), good adhesive property (104.7-126.3 g/mm), good solubility, and very low dielectric constant (2.34-2.89).     

Electrochromic properties of novel strictly alternating poly(amine-amide-imide)s with electroactive triphenylamine moieties

A series of novel triphenylamine-containing aromatic poly(amine-amide-imide)s (PAAIs) were prepared by the phosphorylation polyamidation reactions from the diamine, N,N′-bis(4-aminophenyl)-N,N′-diphenyl-1,4-phenylenediamine, and various imide ring-preformed dicarboxylic acids. All the PAAIs were amorphous, had good solubility in many polar aprotic solvents, and exhibited excellent thin film forming capability with good mechanical properties. They displayed relatively high glass-transition temperatures (220-306 °C) and good thermal stability, with 10% weight-loss temperatures in excess of 522 °C in air or nitrogen and char yields at 800 °C in nitrogen higher than 66%. The solutions of polymers in NMP exhibited strong UV-vis absorption bands with a maximum around 315 nm. The hole-transporting and electrochromic properties were examined by electrochemical and spectroelectrochemical methods. Cyclic voltammograms of the PAAIs prepared by casting polymer solution onto an indium-tin oxide (ITO)-coated glass substrate exhibited two reversible oxidation redox couples at 0.63 and 1.01 V vs. Ag/AgCl in acetonitrile solution. All the PAAIs revealed very stable electrochromic characteristics, changing color from original pale brownish to green, and then to blue at 0.67 and 1.08 V, respectively.     

Novel thermally stable and chiral poly(amide-imide)s bearing from N,N′-(4,4′-diphthaloyl)-bis-l-isoleucine diacid: Synthesis and characterization

Novel optically active aromatic poly(amide-imide)s (PAIs) were prepared from newly synthesized N,N′-(4,4′-diphthaloyl)-bis-l-isoleucine diacid (3) via polycondensation with various diamines. The diacid was synthesized by the condensation reaction of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (1) with l-isoleucine (2) in a mixture of acetic acid and pyridine (3:2 v/v). All the polymers were obtained in quantitative yields with inherent viscosities of 0.20-0.43 dL g⁻¹. All the polymers were highly organosoluble in solvents like N-methyl-2-pyrrolidinone (NMP), N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), tetrahydrofuran, γ-butyrolactone, cyclohexanone and chloroform at room temperature or upon heating. These poly(amide-imide)s had glass transition temperatures between 198 and 231 °C, and their 10% weight-loss temperatures were ranging from 368 to 398 °C and 353 to 375 °C under nitrogen and air, respectively. The polyimide films had tensile strengths in the range of 63-88 MPa and tensile moduli in the range of 0.8-1.4 GPa. These poly(amide-imide)s possessed chiral properties and the specific rotations were in the range of −3.10° to −72.92°.     

Synthesis and characterization of crosslinkable polyimides

A series of copolyimides were prepared from benzophenone-3,3′,4,4′-tetracarboxylic dianhydride (BTDA) and various aromatic diamines which contain a fluorenyl group and/or alkyl substituents in ortho position to the amine groups. The effect of the chemical composition on the glass transition temperature (T_g), thermal stability as well as on the dielectric constant of these polymers was studied. High T_g polymers (T_g ranging from 260 °C to 370 °C), withstanding temperatures as high as 400 °C for 10 h and having a low dielectric constant (from 2.6 to 3.1) were successfully synthesized. All these polymers were able to crosslink under UV or thermal treatments.     

Some aromatic polyimides based on diamines containing hydrazo group and ether linkages

Three new hydrazo-bridged diamines, 4,4′-bis [4-(4-aminophenyloxy) phenylhydrazyl] biphenyl (BPD-2), 4,4′-bis [4-(4-aminophenyloxy) phenylhydrazyl] biphenyl ether (SPD-2) and 4,4-bis [4-(4-aminophenyloxy) phenyl] hydrazine (APD-2), were synthesized by the reduction of three azo-diols, 4,4′-bis (4-azo-1-hydroxyphenyl) biphenyl (BPD), 4,4′-bis (4-azo-1-hydroxyphenyl) biphenyl ether (SPD) and azo-4-hydroxybenzene (APD), and polymerized with pyromellitic dianhydride (PM), 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BP) and 3,4,9,10-perylenetetracarboxylic acid dianhydride (PR) either by one-step solution polymerization or by two-step procedure which includes ring-opening polyaddition to give poly(amic acid) followed by cyclic dehydration to polyimide. The monomers and polyimides were characterized by their elemental analyses, FTIR and ¹H NMR spectroscopy. Glass transition temperatures of the polymers are quite high (175-310 °C), characteristic of polyimides. The decomposition temperatures for 10% weight loss fall in the range of 280-575 °C in nitrogen. Activation energies of pyrolysis for each of the polymers calculated from Horowitz and Metzger's method are also high (52.54-95.28 kJ mol⁻¹). The inherent viscosities of the polyimides at a concentration of 0.5 g/dl in DMF range from 0.94 to 1.93 dl/g.     

Synthesis and properties of oligomers containing substituted bithiazole rings

A series of novel polyimide and poly(Schiff base) oligomers containing substituted bithiazole rings were designed and synthesized, for the first time, by polycondensation of 5,5^′-dimethyl-2,2^′- diamino-4,4^′-bithiazole (MDABT) with dianhydrides (pyromellitic dianhydride, 3,3^′-4,4^′-benzophenone tetracarboxylic dianhydride and bis (3,4-dicarboxyphenyl) ether dianhydride), and dialdehydes (oxalic aldehyde, isophthalaldehyde and terephthalaldehyde). The structure of the oligomers was determined by IR and ¹H NMR spectroscopy, and elemental analysis. The oligomers showed good thermal stability. The Fe²⁺ complex of poly(Schiff base), synthesized from MDABT with oxalic aldehyde (PMTOA), was prepared with 13.7% Fe content and found to be a ferromagnet at low temperature.     

Electroactive aromatic polyamides and polyimides with adamantylphenoxy-substituted triphenylamine units

A new triphenylamine-containing aromatic diamine monomer, 4-[4-(1-adamantyl)phenoxy]-4′,4″-diaminotriphenylamine, was synthesized from cesium fluoride-mediated N,N-diarylation of 4-(1-adamantyl)-4′-aminodiphenyl ether with 4-fluoronitrobenzene and subsequent reduction of the resultant dinitro compound. Novel electroactive aromatic polyamides and polyimides with adamantylphenoxy-substituted triphenylamine moieties were prepared from the newly synthesized diamine monomer with aromatic dicarboxylic acids and tetracarboxylic dianhydrides, respectively. All the resulting polymers were amorphous and most of them were readily soluble in polar solvents such as N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc) and could be solution-cast into transparent and strong films with good mechanical properties. These polymers exhibited glass-transition temperatures between 254 and 310 °C, and they were fairly stable up to a temperature above 450 °C for the polyamides and above 500 °C for the polyimides. These polymers exhibited strong UV-vis absorption maxima at 293-346 nm in solution, and the photoluminescence spectra of polyamides showed maximum bands around 408-452 nm in the blue region. Cyclic voltammograms of the polyamide and polyimide films on an indium-tin oxide (ITO)-coated glass substrate exhibited one pair of reversible redox couples at half-wave oxidation potentials (E_1/2) around 0.83-0.86 V and 1.12-1.13 V, respectively, versus Ag/AgCl in an acetonitrile solution. All the polymer films revealed good electrochemical and electrochromic stability by repeatedly switching electrode voltages between 0.0 V and 1.1-1.4 V, with coloration change from the pale yellowish neutral state to the green or blue oxidized state.     

High performance polymer films 4. Mechanical behavior

Tensile properties of the polyimide and copolyimide films based on two dianhydrides, pyromellitic dianhydride (PMDA) and 3,3^′,4,4^′-benzophenonetetracarboxylic dianhydride (BTDA) and two diamines, 4,4^′-oxydianiline (ODA), and a proprietary aromatic diamine (PD) have been described. The tensile strength of the films containing higher proportions of BTDA or PMDA and PD is much higher (except the fully rigid film based on PMDA-PD which is brittle in nature) than the films containing higher proportion of ODA moiety. The films containing PD as the diamine moiety exhibit high initial moduli than the films containing exclusively or mainly ODA as the diamine moiety. The films having higher concentration of the -O- linkage originated from diamine ODA are found to exhibit higher elongation values. There is found to be no direct correlation between η_inh of the precursor casting solutions and mechanical properties of structurally different polyimide/copolyimide films. For a particular polyimide or copolyimide film, the tensile strength value is found to be less sensitive than the elongation to the variation of η_inh value of the precursor poly(amic acid) or copoly(amic acid). Tensile strength and elongation of the film, basically rigid in nature, may be improved by post-curing at 360°C/370°C. While Kapton H film retains 78% and 63.5% of its tensile strength and % elongation at break (% E_b) respectively after hot-wet mechanical test, the film based on BTDA 80, PMDA 20 and PD shows an increase of about 27% and 22% in its tensile strength and % E_b respectively.     

Synthesis and characterization of new polyimides containing pendent pentadecyl chains

A new unsymmetrical aromatic diamine, viz., 4-pentadecylbenzene-1,3-diamine was synthesized through a series of reaction steps starting from 3-pentadecylphenol. 4-Pentadecylbenzene-1,3-diamine was employed to synthesize a series of new polyimides by one-step polycondensation in m-cresol with four commercially available aromatic dianhydrides, viz., 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 4,4′-oxydiphthalic anhydride (ODPA) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6-FDA). Inherent viscosities of resulting polyimides were in the range 0.33-0.67 dL/g and number average molecular weights were in the range 14,700-52,200 (GPC, polystyrene standard). Polyimides containing pendent pentadecyl chains were soluble in organic solvents such as chloroform, m-cresol, N,N-dimethylacetamide (DMAc), 1-methyl-2-pyrrolidinone (NMP), pyridine and nitrobenzene. Strong and flexible films of polyimides could be cast from their chloroform solutions. Polyimides exhibited glass transition temperature in the range 158-206 °C. The temperature at 10% wt. loss (T₁₀), determined by TGA in nitrogen atmosphere, of polyimides was in the range 470-480 °C indicating good thermal stability.