Formation of ordered macroporous films from fluorinated polyimide by water droplets templating

Preparation of honeycomb-patterned films from one of soluble fluorinated polyimides in a humid atmosphere was reported in this paper. This polyimide was synthesized from 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (BDAF) by two-steps method, which has excellent solubility both in strong bipolar solvents or in common low boiling-point solvents. The glass transition temperature of 6FDA-BDAF polyimide was determined by DSC and as 238 °C. Thermogravimetric analysis indicated that soluble fluoro-polyimide has good thermal stability with maximum thermal decomposition temperature of 545 °C in nitrogen atmosphere. The honeycomb-patterned films were obtained by casting a drop of polymer solution on a solid substrate in a humid atmosphere. Some influence factors, such as the solution concentration, the type of the solvent and the humidity, were also tested.     

Phenylethynyl terminated oligoimides derived from 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride and their adhesive properties

A series of phenylethynyl terminated oligoimides based on 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride (DSDA), m-phenylene diamine (m-PDA) or/and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) with calculated molecular weight of 5000 g mol⁻¹ were synthesized. The effect of molecular structure on solubility and melt viscosity of oligoimides as well as the thermal properties of cured polyimide resins was investigated. Experimental results indicated that the oligoimides have good solubility in strong polar solvents to afford homogeneous solutions with the solid content as high as 50 wt%. The oligoimides exhibited better solubility and lower minimum melt viscosity at relatively lower temperature with the incorporation of flexible 6FAPB. These oligoimides could be thermally cured at 320-380 °C to give thermosetted resins. The cured resins have good thermal stability with the glass transition temperatures of 278-329 °C and the onset decomposition temperatures higher than 500 °C. Adhesive properties of polyimides adhered to stainless steel at various conditions were evaluated by lap shear strength test. It was found that the LSS at room temperature increased with the molar ratio of 6FAPB increasing. The polyimides with combination of rigid and flexible structures exhibited good adhesive properties. With the increasing of curing temperature, the lap shear strength of polyimides at elevated temperature maintained at a high level due to the formation of strong bond.     

Synthesis,structure and reactivity of novel palladiumdichloride-2,2′-bipyridine with 4,4′-bis(fluorous-ponytail)

With the readily available fluorous alkanols R_fCH₂OH, a series of novel fluorous-ponytailed bpy ligands, 4,4′-bis(R_fCH₂OCH₂)-2,2′-bpy (1a–e), were prepared and treated with [PdCl₂(CH₃CN)₂] to result in the corresponding novel Pd complexes [PdCl₂(4,4′-bis(R_fCH₂OCH₂)-2,2′-bpy)] (2a–e) where R_f = n-C₃F₇ (a), HCF₂(CF₂)₃ (b), HCF₂(CF₂)₇ (c), n-C₈F₁₇ (d), n-C₁₀F₂₁ (e). The new ligands and Pd complexes were spectroscopically characterized by multi-nuclei NMR (¹H, ¹⁹F and ¹³C), FTIR and high resolution mass (FAB). The structure for the Pd complex 2b, the first with fluorinated ponytails on bpy and not on phosphine, was also established by a single crystal X-ray diffraction study. The TGA data of both ligands and Pd complexes indicated that the Pd-complexes were resistant to higher temperatures than the corresponding ligands. The Pd catalysts derived from 2a–c showed an almost quantitative conversion and could be reused for eight runs with Heck reactions, in that the products and unspent reactants were directly removed by distillation. With the highest fluorine content in the series, Pd complex 2e was successfully applied in the Heck reaction using the fluorous biphasic catalysis strategy.     

Synthesis and characterizations of 3,3′-bis(diphenylphosphinoamine)-2,2′-bipyridine and 3,3′-bis(diphenylphosphinite)-2,2′-bipyridine and their chalcogenides

New bis(phosphinoamine) and bis(phosphinite) derivatives of 2,2′-bipyridine were prepared through a single step reaction of 3,3′-diamino-2,2′-bipyridine or 3,3′-dihydroxy-2,2′-bipyridine with diphenylchlorophosphine, respectively. Their P = E chalcogenides (E = O, S, Se) were also prepared. All the new compounds were characterized by elemental analysis, IR and NMR spectroscopies. The molecular structure of 3,3′-bis(diphenylthiophosphinite)-2,2′-bipyridine was elucidated by single-crystal X-ray crystallography.     

Synthesis and characterization of novel fluorinated polyimides derived from 4-phenyl-2,6-bis[4-(4′-amino-2′-trifluoromethyl-phenoxy)phenyl]pyridine and dianhydrides

A series of organo-soluble polyimides were prepared from a novel fluorinated diamine monomer, 4-phenyl-2,6-bis[4-(4′-amino-2′-trifluoromethylphenoxy)phenyl]pyridine and various commercial aromatic dianhydrides. These polyimides had good solubility in common organic solvents. The obtained strong and flexible PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) of above 561 °C and the glass transition temperature in the range of 258-312 °C. Moreover, the polymer films showed good electrical insulating property, low dielectric constant and low water uptake due to the introduction of fluorinated substitutes in the polymer backbone. The remarkable combined features ensure these polymers to be ideal candidate materials for advanced microelectronic industry and other related applications.     

High Tg polyimide nanofoams derived from pyromellitic dianhydride and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane

New routes for the synthesis of high T_g thermally stable polymer foams with pore sizes in the nanometer regime have been developed. Foams were prepared by casting well-defined microphase-separated block copolymers comprised of a thermally stable block and a thermally labile material. At properly designed volume fractions the morphology provides a matrix of the thermally stable material with the thermally labile material as the dispersed phase. Upon thermal treatment, the thermally unstable block undergoes thermolysis generating pores, the size and shape of which are dictated by the initial copolymer morphology. Triblock copolymers comprised of a high T_g, amorphous polyimide matrix with poly(propylene oxide) as the thermally decomposable coblock, were prepared. The copolymer synthesis was conducted through the poly(amic acid) precursor and subsequent cyclodehydration to the polyimide by either thermal or chemical means. Dynamic mechanical analysis confirmed microphase separated morphologies for all copolymers, irrespective of the propylene oxide block lengths investigated. Upon decomposition of the thermally labile coblock, a 9–18% reduction in density was observed, consistent with the generation of a foam which was stable to 400°C. © 1996 John Wiley & Sons, Inc.     

A novel class of organosoluble and light-colored fluorinated polyamides derived from 2,2-bis(4-amino-2-trifluoromethylphenoxy)biphenyl or 2,2-bis(4-amino-2-trifluoromethylphenoxy)-1,1-binaphthyl

Two series of novel fluorinated aromatic polyamides were prepared from 2,2^′-bis(4-amino-2-trifluoromethylphenoxy)biphenyl (2) and 2,2^′-bis(4-amino-2-trifluoromethylphenoxy)-1,1^′-binaphthyl (4) with various aromatic dicarboxylic acids using the phosphorylation polycondensation technique. The polyamides had inherent viscosities ranging from 0.43 to 0.62 dl/g and 0.36 to 0.74 dl/g, respectively. All the fluorinated polyamides were soluble in many polar organic solvents such as N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone, and afforded transparent, light-colored, and flexible films upon casting from DMAc solvent. These polyamides showed glass-transition temperatures in the ranges of 190-240 °C (for the 6 series from diamine 2) and 247-255 °C (for the 7 series from diamine 4) by differential scanning calorimetry, softening temperatures in the ranges of 196-230 °C (6 series) and 241-291 °C (7 series) by thermomechanical analysis, and decomposition temperatures for 10% weight loss above 420 °C in both nitrogen and air atmospheres.     

Synthesis and characterization of novel fluorinated polyimides derived from 1,1′-bis(4-aminophenyl)-1-(3-trifluoromethylphenyl)-2,2,2-trifluoroethane and aromatic dianhydrides

A novel fluorinated aromatic diamine 1,1′-bis(4-aminophenyl)-1-(3-trifluoromethylphenyl)-2,2,2-trifluoroethane (6FDAM) was synthesized in a simple procedure, which was then employed to prepare a series of fluorinated polyimides with commercial aromatic dianhydrides, such as pyromellitic dianhydride (PMDA), 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane (6FDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-oxydiphthalic anhydride (ODPA). The polyimides exhibited good solubility in strong dipolar solvents such as NMP, DMAc, DMF and m-cresol as well as some of low boiling point organic solvents of THF and CHCl₃, etc. Experimental results indicated the polyimides possessed low moisture adsorptions of 0.42-0.95%, low dielectric constant of 2.71-2.95 at 1 MHz, high dielectric strength of 92.0-122.6 kV/mm and good optical transparency with cutoff wavelengths of UV-vis at 330-375 nm. The polyimides also exhibited good mechanical properties as well as excellent thermal and thermo-oxidative stability. The fluorinated polyimides possessed better solubility, lower dielectric constant and water adsorption as well as higher optical transparency than the representative non-fluorinated polyimide derived from PMDA and 4,4′-oxydianiline (ODA).     

Synthesis and characterization of soluble polyimides based on a new fluorinated diamine: 4-Phenyl-2,6-bis[3-(4′-amino-2′-trifluoromethyl-phenoxy) phenyl] pyridine

A new kind of pyridine-containing aromatic diamine monomer, 4-phenyl-2,6-bis[3-(4′-amino-2′-trifluoromethyl-phenoxy) phenyl] pyridine (m-PAFP), was successfully synthesized by a modified Chichibabin reaction of 3-(4′-nitro-2′-trifluoro-methyl-phenoxy)-acetophenone with benzaldehyde, followed by a catalytic reduction. A series of fluorinated pyridine-bridged aromatic poly(ether-imide)s were prepared from the resulting diamine monomer with various aromatic dianhydrides via a conventional two-step thermal or chemical imidization method. The inherent viscosities values of these polyimides were in the range of 0.56-1.02 dL/g, and they could be cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimides displayed higher solubility in polar solvents such as NMP, DMSO and m-cresol. The polyimides had good thermal stability, with the glass transition temperatures (T_g) of 187-211 °C, the temperatures at 5% weight loss of 511-532 °C, and the residue at 800 °C in air was higher than 50%. These films also had dielectric constants of 2.64-2.74 at 10 MHz and low water uptake 0.53-0.66%. Wide-angle X-ray diffraction measurements revealed that these polyimides were predominantly amorphous. Moreover, the polymer films of these novel polyimides showed outstanding mechanical properties with the tensile strengths of 90.1-96.6 MPa, elongations at breakage of 8.9-10.7% and tensile modulus of 1.65-1.98 GPa.     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

Novel fluorinated polyimides derived from 9,9-bis(4-amino-3,5-difluorophenyl)fluorene and aromatic dianhydrides

Novel fluorinated polyimides (PIs) were prepared from 9,9-bis(4-amino-3,5-difluorophenyl)fluorene with three aromatic dianhydrides via a one-step high-temperature polycondensation procedure. These obtained PIs showed excellent solubility and could be readily soluble in a variety of organic solvents such as NMP, DMAc, DMF, CHCl₃, CH₂Cl₂ and THF. All the PIs could afford flexible and strong films with low dielectric constants (2.62-2.79 at 1 MHz) and low moisture absorptions (0.18-0.41%). Thin films of these PIs exhibited high optical transparency and light color, with the cutoff wavelength at 341-355 nm and transmittance higher than 80% at 450 nm. Meanwhile, these PIs possessed eminent thermal stability, with decomposition temperatures (T_d) above 570 °C in both air and nitrogen atmospheres and glass transition temperatures (T_g) beyond 376 °C. Moreover, these fluorinated PI films showed low surface free energy and hydro-oleophobic character. The contact angles on the films for water and glycerol were in the range of 102.3-107.9° and 94.0-100.3°, respectively. In comparison with the analogous PI non-containing fluorine group, these fluorinated PIs showed better solubility, higher optical transparency, lower dielectric constants and lower surface free energy.     

Spectroscopic, thermal and structural studies of cocrystal of 2,2′-diamino-4,4′-bis(1,3-thiazole) with 4,4′-bipyridine, 1,2-bis(4-pyridyl)ethylene and 1,3-bis(4-pyridyl)propane

Three new cocrystals based upon 2,2′-diamino-4,4′-bis(1,3-thiazole) (DABTZ) with 4,4′-bipyridine (4,4′-bipy), 1,2-bis(4-pyridyl)ethylene (bpe) and 1,3-bis(4-pyridyl)propane (bpp): [(DABTZ) (4,4′-bipy)], [(DABTZ) (bpe)] and [(DABTZ) (bpp)] have been synthesized and characterized by elemental analysis, IR-, ¹H NMR-, ¹³C NMR spectroscopy and studied by thermal and X-ray crystallography. Self-assembly of these compounds in the solid state is likely caused by both hydrogen bonding, and π-π stacking.     

Synthesis and properties of novel fluorinated polynaphthalimides derived from 1,4,5,8-naphthalenetetracarboxylic dianhydride and trifluoromethyl-substituted aromatic bis(ether amine)s

A series of novel fluorinated polynaphthalimides (PNIs) (2a-g) were synthesized from 1,4,5,8-naphthalenetetracarboxylic dianhydride (NTDA) and trifluoromethyl (CF₃)-substituted aromatic bis(ether amine)s (1a-g) by high-temperature solution polycondensation in m-cresol using isoquinoline as catalyst. Almost all the PNIs were readily soluble in polar solvents such as N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc) and could be solution-cast to transparent and tough films with high tensile strengths. The PNIs exhibited high thermal stability, with glass-transition temperatures of 262-383 °C, 10% weight loss temperatures above 528 °C in nitrogen or air, and char yields at 800 °C in nitrogen higher than 50%. In comparison with analogous PNIs without the -CF₃ substituents, these fluorinated PNIs revealed an enhanced solubility and better film-forming capability.     

Novel organosoluble and colorless poly(ether imide)s based on 1,1-bis[4-(3,4-dicarboxyphenoxy)phenyl]cyclohexane dianhydride and trifluoromethyl-substituted aromatic bis(ether amine)s

A series of novel fluorinated poly(ether imide)s (IV) having inherent viscosities of 0.70-1.08 dL/g were prepared from 1,1-bis[4-(3,4-dicarboxyphenoxy)phenyl]cyclohexane dianhydride (I) and various trifluoromethyl (CF₃)-substituted aromatic bis(ether amine)s II_a-g by a standard two-step process with thermal and chemical imidization of poly(amic acid) precursors. These poly(ether imide)s showed excellent solubility in many organic solvents and could be solution-cast into transparent, flexible, and tough films. These films were essentially colorless, with an ultraviolet-visible absorption edge of 375-380 nm and a very low b^∗ value (a yellowness index) of 5.5-7.3. They also showed good thermal stability with glass-transition temperatures of 207-269 °C, 10% weight loss temperatures in excess of 474 °C, and char yields at 800 °C in nitrogen more than 62%. In comparison with analogous V series poly(ether imide)s without the -CF₃ substituents, the IV series polymers showed better solubility, lower color intensity, and lower dielectric constants.     

Study of electrochemical stability of conducting polymers by bidimensional spectroelectrochemistry: p- and n-doping of poly(4,4′-bis(butylthio)-2,2′-bithiophene) films

UV-vis bidimensional spectroelectrochemistry has been applied to the study of the electrochemical stability of conducting polymer films during p- and n-doping processes. Specifically, poly(4,4′-bis(butylthio)-2,2′-bithiophene) has been chosen as example to prove the usefulness and suitability of this multi-response technique to characterize polymer stability during p- and n-doping. It was found that oxidative doping and corresponding de-doping alone did not result in noticeable polymer film degradation. However, in experiments involving both p- and n-doping of this conducting polymer, soluble species arising from the polymer film were detected in solution for the first time, indicating a lower electrochemical stability of the film under these experimental conditions. Moreover, bidimensional spectroelectrochemistry has enabled us not only to detect the soluble degradation products, but also the potential range in which the degradation takes place.     

Preparation and properties of new soluble aromatic polyimides from 2,2′-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride and aromatic diamines

A new aromatic tetracarboxylic dianhydride having a crank and twisted noncoplannar structure, 2,2′-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, was synthesized by the reaction of 4-nitrophthalonitrile with biphenyl-2,2′-diol, followed by hydrolysis and cyclodehydration. The biphenyl-2,2′-diyl-containing aromatic polyimides having inherent viscosities up to 0.66 dL/g were obtained by the conventional two-step procedure starting from the dianhydride monomer and various aromatic diamines. Most of the polyimides were readily soluble in amide-type solvents such as N,N-dimethylacetamide and N-methyl-2-pyrrolidone. The aromatic polyimides had glass transition temperatures in the range of 205–242°C, and began to lose weight around 415°C, with 10% weight loss being recorded at about 500°C in air. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2021–2027, 1998     

Meltable phenylethynyl-capped oligoimide resins derived from 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene and 3,4′-oxydianiline

A series of meltable oligoimide resins with controlled molecular weights by reactive phenylethynyl endcapping groups have been prepared by the thermal polycondensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with the aromatic diamine mixtures consisting of different mole ratios of 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (1,4,4-6FAPB) and 3,4′-oxydianiline (3,4′-ODA) in the presence of 4-phenylethynylphthalic anhydride (PEPA) as molecular weight-controlling and reactive endcapping reagent. Experimental results indicated that the molecular weight-controlled oligoimide resins were mixtures containing a series of biphenylethynyl-endcapped oligoimides with different chemical structures and different molecular weights. The typical oligoimide resins could be melted at temperatures of 300 °C to yield stable molten fluid with melt viscosity of 13.4 Pa s, which was suitable for melt processing. The molten oligoimide resins could be further polymer chain extended and crosslinked by thermal curing of the reactive phenylethynyl groups to give strong and tough thermosetted polyimides. Thus, the oligoimide resin with calculated molecular weight of 2500 exhibited not only good meltability with low melt viscosity, but also high melt stability and fluidability at temperatures of <300 °C. After thermal curing, the obtained thermosetted polyimide showed high glass transition temperature (>316 °C, DMA), excellent thermal stability with initial thermal decomposition temperature of 588 °C and good mechanical properties with flexural strength of 159.1 MPa, flexural moduli of 3.3 GPa, tensile strength of 94.7 MPa and elongation at breakage of 9.0%.     

Synthesis and characterization of novel fluorinated polyimides derived from 1,3-bis(4-amino-2-trifluoromethylphenoxy)naphthalene and aromatic dianhydrides

A new structurally asymmetric diamine monomer containing flexible ether linkages and bulky trifluoromethyl substituents, namely 1,3-bis(4-amino-2-trifluoromethylphenoxy)naphthalene, was prepared from 1,3-dihydroxynaphthalene and 2-chloro-5-nitrobenzotrifluoride. New series of fluorinated polyimides were synthesized from the diamine with six commercially available aromatic tetracarboxylic dianhydrides using a conventional two-stage process with thermal or chemical imidization. The resulting polyimides were highly soluble in a variety of organic solvents and could afford transparent and tough films via solution casting. These polyimides exhibited moderately high glass-transition temperatures (by DSC) of 236-268 °C and softening temperatures (by thermomechanical analysis) of 231-250 °C, and they did not show significant decomposition before 500 °C under either nitrogen or air atmosphere. Also, they revealed low moisture absorptions (0.32-0.78%), low dielectric constants (2.81-3.24 at 10 kHz), and high optical transparency (ultraviolet-visible absorption cutoff wavelengths of 377-426 nm).     

Colorless poly(ether-imide)s deriving from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(BPADA) and aromatic bis(ether amine)s bearing pendent trifluoromethyl groups

A series of poly(ether-imide)s (III) characterized by colorless, highly solubility was synthesized from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(BPADA) and various fluorinated aromatic diamines (I_a-h) in DMAc via polycondensation to form poly(amic acid) (II), followed by chemical (C) and thermal (H) imidization. These polymers had inherent viscosities ranging from 0.60 to 1.3 dL/g. These polyimides were highly soluble in a variety of organic solvent such as amide-type, ether-type and chlorinated solvents. Moreover, these poly(ether-imide) films were almost colorless, with an ultraviolet-visible absorption cutoff wavelength below 390 nm and low b* value (a yellowness index) of 4.6-18.0. The III series showed strength tensile of 72-101 MPa, elongation at break of 11-25%, initial modulus of 1.5-2.0 GPa. The glass transition temperature (T_g) of III_a-h were in the range of 202-267 °C, and the decomposition temperature above 493 °C and left 40-65% char yield at 800 °C in nitrogen. They had the lower dielectric constants of 3.39-3.72 (1 MHz) and moisture absorptions in the range of 0.11-0.40%.     

Crystallization kinetics of a thermotropic liquid crystalline polyimide derived from 1,3-bis[4-(4′-aminophenoxy) cumyl] benzene

We have studied the nonisothermal and isothermal crystallization kinetics of an aromatic thermotropic liquid crystalline polyimide synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA) and 1,3-bis[4-(4′-aminophenoxy) cumyl] benzene (BACB) by means of differential scanning calorimetry (DSC). Polarized light microscopy (PLM) and wide-angle X-ray diffraction (WAXD) results confirm that this polyimide exhibits a smectic texture. Nonisothermal crystallization showed two strong and one weak exothermic peaks during cooling. The phase transition from isotropic melt to liquid crystalline state is extremely fast which completes in several seconds. The mesophase transition has a small Avrami parameter, n, of approximate 1. The isothermal crystallization of 253–258°C has been examined. The average value n is about 2.6 and the temperature-dependent rate constant k changes about two orders of magnitude in the crystallization temperature range of 6°C. The slope of ln k versus 1/(T_cΔT) is calculated to be −2.4 × 10⁵, which suggests nucleation control, via primary and/or secondary nucleation for the crystallization process. During the annealing process, a new phase (slow transition) is induced, which grows gradually with annealing time. At lower annealing temperatures (220–230°C), the slow transition process seems not to be influenced by the crystals formed during cooling process and its Avrami parameter n is ca. 0.3–0.4. However, the slow transition was hindered by the crystals formed during cooling process when annealed at higher temperature (230–240°C). © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 1679–1694, 1998