Synthesis and characterization of a novel cycloaliphatic epoxy resin starting from dicyclopentadiene

A novel tri-functional cycloaliphatic epoxy resin was synthesized starting from dicyclopentadiene. The chemical structures of the resultant epoxy resin and its precursor were characterized with FTIR spectroscopy, EEW, ¹H NMR and Mass spectrographic analyses. The thermal and mechanical properties of the resulting polymer were evaluated with differential scanning calorimeter (DSC), thermo-gravimetric and thermal mechanical analysis. Compared to that of the common cycloaliphatic epoxy resin ERL-4221, the cured polymer of the novel epoxy resin exhibited lower thermal degradation temperature with much higher char yield and similar thermal expansion coefficient. These excellent overall performances make it a promising packaging material.     

Synthesis and degradable property of novel sulfite-containing cycloaliphatic epoxy resins

Liquid cycloaliphatic diepoxide containing sulfite group (Epoxide-S) was designed and synthesized through the two-step reactions: the nucleophilic substitution between thionyl chloride and cyclohex-3-1-methanol, and the subsequent epoxidation. The chemical structures of the epoxidized product and its olefin precursor were confirmed by FTIR and ¹H NMR spectra. Different from conventional thermosetting epoxy resins, the cured Epoxide-S started to decompose at 185 °C. The apparently lower degradable temperature is desirable for reworkable electronic packaging materials because the dismantlement of waste electronic products or the replacement and repair of faulty chips become convenient. Moreover, after co-curing between Epoxide-S and the commercial cycloaliphatic diepoxide ERL-4221, the thermal degradation temperatures of the copolymers were tunable in the range from 185 to 323 °C by varying the ratio of two monomers. The unique degradation behaviors were investigated by means of computer calculation, thermogravimetric analysis, and FTIR spectra.     

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

Synthesis and characterization of novel multifunctional epoxy resin

A novel multifunctional epoxy resin was synthesized by polyphenol and epichlorohydrin.The structure and molecular weight ofthe multifunctional epoxy were characterized by FTIR and ESI-MS.DSC and DMTA were used to investigate the thermal propertyof multifunctional epoxy cured by DDS.The thermal resistance of the synthesized multifunctional epoxy was much better than astandard diglycidyl ether of bisphenol-A epoxy.     

Synthesis and characterization of UV-curable polydimethylsiloxane epoxy acrylate

UV-curable polydimethylsiloxane epoxy acrylate (PSEA) was synthesized by hydrosilylation of allyl glycidyl ether with hydrogen-containing polydimethylsiloxane to give polydimethylsiloxane-type epoxy resin which modified with acrylic acid. The curing speed and the double bond conversion in the UV cured film were influenced by the purity of PSEA with Fourier transform infrared spectroscopy (FT-IR) measurements. The influences of the synthetic process, such as, the reaction temperature, the concentration of reactants and the catalyst which determined the purity and activity of resins were discussed in detail. The structures of this resin were characterized by ¹H-NMR and FT-IR spectra. The molecular weight was checked by gel permeation chromatography, and M_n is 45,000. The properties of the cured film were also investigated by thermogravimetric analyzer, dynamical thermal mechanical analysis, and etc. For example, tensile strength (6.9 Mpa), elongation (20%), hardness (A; 18), water absorption (24 h; 2%), weight loss (40 min, 300 °C; 5%) and etc.     

Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application

In this paper, two silicon‐containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex‐3‐enyl‐1‐methanol with di‐ or tri‐chlorosilane compounds. Then, after epoxidation, two new cycloaliphatic epoxy resins with different epoxy groups were successfully prepared. Their chemical structures were confirmed by ²⁹Si NMR, ¹H NMR, and Fourier‐transform infrared spectra (FTIR). The properties of cured products, including viscoelasticity, glass transition temperature (T_g), coefficient of thermal expansion, thermal stability and water absorption, were investigated. Compared to the difunctional epoxy resin, the trifunctional one exhibited a remarkably increased cross‐linking density from 0.82 to 4.08 × 10^?3 mol/cm³ and T_g from 157 to 228°C. More importantly, prior to curing, they had viscosities of only 240–290 mPa sec at 25°C, which were much lower than that of ERL‐4221 (409 mPa sec), providing the possibility of easy processing. The high glass transition temperatures, good thermal stabilities, and mechanical properties as well as excellent flowability endow the silicon‐containing epoxy resins with promising potential in microelectronic packaging application. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

高性能脂环族环氧树脂分子设计与合成研究进展

脂环族环氧树脂具有优异的加工性、热稳定性、电绝缘性和耐紫外辐射等综合性能,已经广泛应用于航空航天、微电子封装和电机绝缘等重要工业领域。针对现代工业对高分子材料日益提高的性能和功能化要求,近年来脂环族环氧树脂的合成与性能研究非常活跃。本文综述了新型脂环族环氧树脂的分子设计与合成进展,包括环氧官能度、交联密度和玻璃化温度可...     

Synthesis and characterization of itaconic‐based epoxy resins

A trifunctional epoxy resin from itaconic acid (TEIA) was synthesized from a renewable resource‐based itaconic acid by allylation of itaconic acid to form diallyl itaconate by using m‐chloroperoxybenzoic acid as oxidizing agents followed by epoxidation of allylic C═C bond of diallyl itaconate methylhexahydropthalic anhydride as curing agent in the presence of 2‐methyl imidazole as a catalyst. The chemical structure of the synthesized resins was confirmed by Fourier transform infrared and nuclear magnetic resonance (¹H‐NMR and ¹³C‐NMR) spectroscopy analysis. The mechanical, thermal, and rheological performances of the TEIA were also investigated and compared with diglycidyl ether of bisphenol A and a plant‐based epoxidized soybean oil bioresin cured with the same curing agent. The higher epoxy value of 1.02, lower viscosity (0.96 Pa s at 25°C), higher mechanical, and higher curing reactivity toward methylhexahydropthalic anhydride of TEIA as compared with epoxidized soybean oil and comparable with diglycidyl ether of bisphenol A demonstrated significant evidence to design and develop a novel bio‐based epoxy resin with high performance to substitute the petroleum‐based epoxy resin.     

Effect of structure on thermal behaviour of epoxy resins

The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4^′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3^′,4,4^′-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4^′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA.     

Synthesis,characterization, and properties of novel epoxy resins and cyanate esters

We synthesized a novel epoxy (dopotep) and cyanate ester (dopotcy) based on a phosphorus‐containing triphenol (dopotriol). The proposed structures were confirmed by IR, mass spectra, NMR spectra, and epoxy‐equivalent‐weight titration. The synthesized dopotep or dopotcy was copolymerized with diglycidyl ether of bisphenol A (DGEBA), 6′,6‐bis(3‐phenyl‐3,4‐dihydro‐2H‐1,3‐benzoxazineyl)methane (F‐a), or dicyanate ester of bisphenol A (BADCY). Thus, copolymers based on DGEBA/dopotep/diphenylmethane (ddm), F‐a/dopotep, BADCY/dopotcy, and DGEBA/dopotcy were developed. The thermal properties, dielectric properties, and flame retardancy of these copolymers were investigated. The curing kinetics of dopotep/ddm and dopotep/diamino diphenylsulfone were studied with differential scanning calorimetry. The microstructure of DGEBA/dopotcy was studied with IR. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3487–3502, 2006     

Synthesis and characterization of thiocarbonohydrazone-based epoxy resins

Novel epoxy resins of various thiocarbonohydrazones have been synthesized by reacting the aldehyde or ketone derivatives of thiocarbohydrazide with excess of epichlorohydrin. The resins have been characterized by elemental analyses, epoxy equivalents, ¹H-NMR and IR spectra, thermal analyses, and viscosity measurements. Curing of the resins has been carried out by mixing with thiocarbohydrazide or ethylenediamine and heating at 80°C for 48 h. A comparison of the thermal stability of the cured resin samples has been made.     

Synthesis and characterization of oligosalicylaldehyde-based epoxy resins

The synthesis of a new epoxy resin of oligosalicylaldehyde by the reaction with epichlorohydrin is reported. New resin’s epoxy value and chlorine content were determined and found to be 25% and 1%, respectively. The characterization of the new resin was instrumented by FTIR, ¹H NMR, scanning electron microscopy, and thermal gravimetric analyses. TGA results showed that the cured epoxy resin has a good resistance to thermal decomposition. The mass losses of cured epoxy resin were found to be 5%, 10%, 50% at 175°C, 240°C, and 400°C, respectively. On the curing procedure the resin was cured with polyethylenepolyamine at 25 °C for 8 h and 100°C for 1.5 h. The FTIR spectrum of new epoxy resin gave the peak of oxirane ring at ṽ = 918 cm⁻¹. In memory of Professor Dr. Adalet R. Vilayetoğlu     

Synthesis,characterization, thermal,and flame retardant properties of phosphate-based epoxy resins

A new phosphorus-containing oxirane bis-glycidyl phenylphosphate (BGPP), and a diamine, bis(4-aminophenyl)phenylphosphate (BAPP), were synthesized. Both of these two phosphorus-containing compounds lead to phosphate-containing epoxy resin via curing reaction. The kinetics of the curing reaction of BGPP with various curing agents, including BAPP, were studied. The introduction of electron-withdrawing group into the compounds increases the BGPP and decreases the BAPP reactivity in the curing reaction. The thermal and the weight loss behavior of the cured epoxy resins were studied by TGA. High char yields (32–52%) as well as high limiting oxygen index (LOI) values (34–49) of these phosphorylated resins were found, confirming the usefulness of these phosphorus-containing epoxy resins as flame retardants. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 565–574, 1997.     

Styrylpyridine-based epoxy resins: Synthesis and characterization

Polymers containing rigid aromatic structures in the chain backbone usually gave high thermal stability and good flammability resistance. Three glycidyl ethers of epoxy resins were prepared from 2,4-di(p-hydroxystyryl)pyridine (2,4-DGESP), 2,6-di-(p-hydroxystyryl)pyridine (2,6-DGESP), and 2,4,6-tri-(p-hydroxystyryl)pryidine (2,4,6-TGESP) to study the relationships of structure to polymer degradation. To prepare a highly crosslinked material, trimethoxyboroxine (TMB) was used as the curing agent. The relative char yields of the three different resins, as measured by TGA, were 2,4-DGESP ≈ 2,6-DGESP > 2,4,6-TGESP. The char yield of the cured 2,6-DGESP varied with different amounts of the TMB curing agent, and was higher than the uncured 2,6-DGESP. The oxygen index increased as a function of thermal curing time for the 2,6-DGESP epoxy resin. An intermolecular Diels–Alder reaction with 2,6-DGESP is proposed as a primary reaction during thermal curing.     

Synthesis and characterization of bismaleimides from epoxy resins

Novel bismaleimides (BMIs) were prepared from functional monomaleimides and diglycidyl ether of bisphenol A (DGEBA) and some of them were shown to have good processibility and improved water resistance while retaining characteristic thermal stability of polyimide. Functional monomaleimides were synthesized via the condensation reaction of maleic anhydride with either aminobenzoic acid or aminophenol. Crosslinking reaction of thus obtained BMIs was carried out with or without catalyst at the temperature range of 100–250°C. The type of the functional group species and their position in monomaleimides significantly affected the crosslinking behavior of the resulting BMIs and the thermal property of their crosslinked products. BMIs with meta linkage, obtained from meta monomaleimides, exhibited much faster thermal crosslinking behavior than corresponding para BMIs. When the molecular weight of BMI was larger, the crosslinking density became smaller and T_g was lower as expected, while the viscosity started to increase at a higher temperature. Glass transition temperatures of the crosslinked resins were in the range of 160–250°C and these resins showed excellent thermal stability up to 370°C.     

Synthesis and characterization of epoxy resins containing imine group and their curing processes with aromatic diamine

The epoxy resins containing imine bonding were prepared from hydroxyl substituted Schiff base monomers in two steps. At the first step, hydroxyl substituted Schiff base monomers were synthesized via condensation reaction. At the second step, epoxy resins were synthesized from the reaction between Schiff base monomers and epichlorohydrine (EPC). Then curing processes of epoxy resins were achieved by p-phenylenediamine compound. The structures of resulting compounds were confirmed by FT-IR, UV-Vis and ¹H-NMR. TG-DTA and DSC measurements were performed for thermal characterizations of the compounds. Chemical resistances of the cured epoxy-amine systems were determined for coating applications in acidic, alkaline and organic solvents. HCl (10%, aqueous solution), NaOH (10%, aqueous solution), DMSO, DMF, N-methylpyrrolidone, ethanol, THF and acetone were used for corrosion tests. Chemical resistance data of the synthesized epoxy resins demonstrated that they have good chemical resistance against various acid, alkaline and common organic solvents. Surface morphologies of epoxy resin and the cured epoxy resin were determined with scanning electron microscopy (SEM) measurements. Also, optical band gap (E_g) values of Schiff base monomers and epoxy resins were calculated from UV-Vis measurements.     

Synthesis and characterization of imide modified poly(dimethylsiloxane) with maleopimaric acid as raw material

With the natural rosin derivative(maleopimaric acid,MPA) as the raw material,imide modified vinyl poly(dimethylsiloxane)(MP-VMS) was synthesized and characterized by ~1H NMR and ~(13)C NMR.The curing kinetic parameters of MP-VMS were determined by differential scanning calorimetry(DSC) at various heating rates(5,8,10,15 ℃/min) from the Kissingner.Ozawa and Crane methods.The activation energy(E_α),pre-exponential factor(A) and reaction order(n) were respectively 18.6 kJ/mol,71,108 and0.902.The low-temperature and high-temperature resistance of its curing product were respectively investigated by DSC and thermogravimetric analysis.The results showed that incorporation of MPA could significantly improve the thermal stability of silicone while had no effect on the low-temperature resistance,and the T_(max)(the temperature corresponding to the maximum weight loss rate) increased by 70.7 C.