Physical aging of poly(ether sulfone)-modified epoxy resin

The physical aging process of 4,4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with poly(ether sulfone) (PES) was studied by differential scanning calorimetry (DSC) at four aging temperatures between T_g-50°C and T_g-10°C. At aging temperatures between T_g-50 and T_g-30°C, the experimental results of epoxy resin blended with 20 wt% of PES showed two enthalpy relaxation processes. One relaxation process was due to the physical aging of PES, the other relaxation process was due to the physical aging of epoxy resin. The distribution of enthalpy relaxation process due to physical aging of epoxy resin in the blend was broader and the characteristic relaxation time shorter than those of pure epoxy resin at the above aging temperatures (between T_g-50 and T_g-30°C). At an aging temperature between T_g-30 and T_g-10°C, only one enthalpy relaxation process was found for the epoxy resin blended with PES, the relaxation process was similar to that of pure epoxy resin. The enthalpy relaxation process due to the physical aging of PES in the epoxy matrix was similar to that of pure PES at aging temperatures between T_g-50 and T_g-10°C. © 1997 John Wiley & Sons, Inc.     

Contributions of side groups to the water diffusion in cured epoxy resins (2) study on physical aging

Novolac epoxy resins cured with novolac resin, novolac acetate resin, novolac butyrate resin, and novolac phenylacetate resin named as EP, EPA, EPB, and EPP, respectively, were prepared. Their physical aging behavior at a T_g‐30 °C (30 °C below glass‐transition temperature) was examined by positron annihilation lifetime spectroscopy and differential scanning calorimetry. The ortho‐positronium annihilation lifetime τ₃ variation extent of EP is less apparent than that of the other three esterified samples during physical aging. The time dependence of ops intensity I₃ agreed with the Kohlrausch‐Williams‐Watts (KWW) equation. The relaxation time (τ₀) and nonexponential parameter were calculated. The free volume and enthalpy relaxation rate characterized by the reciprocal of τ₀ and ?ΔH/?logt, respectively, exhibit the same order—EPP > EPB > EPA > EP. These results suggest that the extend and rate of relaxation are not only related to the frozen free volume produced by quenching but also significantly influenced by segmental mobility of the network that attributed to the side‐group flexibility and their interaction with networks. This work also supports the fact that side‐group flexibility and the free‐volume fraction and distribution act in concert to control the water‐diffusion behavior in epoxy networks. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1135–1142, 2003     

Enthalpy relaxation in a partially cured epoxy resin

The enthalpy relaxation of a partially cured (70%) epoxy resin, derived from diglycidyl ether of bisphenol-A cured by methyl-tetrahydrophthalic anhydride with accelerator, has been investigated. The key parameters of the structural relaxation (the apparent activation energy Δh*, the nonlinearity parameter x, and the nonexponentiality parameter β) are compared with those of the fully cured epoxy resin. The aging rates, characterized by the dependences of the enthalpy loss and peak temperature on log(annealing time), are greater in the partially cured epoxy than they are in the fully cured resin at an equivalent aging temperature (T_a = T_g − 20°C). There is a significant reduction in Δh*, from 1100 kJ mol⁻¹ for the fully cured system to 615 kJ mol⁻¹, as the degree of cure is reduced. The parameter x determined by the peak-shift method appears essentially independent of the degree of cure (x = 0.41 ± 0.03 for the partially cured resin compared with 0.42 ± 0.03 obtained previously for the fully cured resin), and does not follow the usually observed correlation of increasing x as Δh* decreases. This invariability of the parameter x seems to indicate that it is determined essentially by the local chemical structure of the backbone chain, and rather little by the supramolecular structure. On the other hand, the estimated nonexponentiality parameter β lies between 0.3 and 0.456, which is significantly lower than in the fully cured epoxy (β ≅ 0.5), indicative of a broadening of the distribution of relaxation times as the degree of cross-linking is reduced. Like the parameter x, this also does not follow the usual correlation with Δh*. These results are discussed in the framework of strong and fragile behavior of glass-forming systems, but it is difficult to reconcile these results in any simple way with the concept of strength and fragility. © 1996 John Wiley & Sons, Inc.     

Study of the physical aging of an epoxy/cycloaliphatic amine resin modified with abs

Using differential scanning calorimetry (DSC) we have studied the physical aging of an epoxy resin based on the diglycidyl ether of bisphenol A (DGEBA) modified by two different contents of an acrylonitrile-butadiene-styrene (ABS) and cured with 1,3-bisaminomethylcyclohexane (1,3-BAC). Samples fully cured were annealed at temperature of 125°C for periods of time of 72 and 120 h, to determine the process of physical aging. The apparent activation energy for the enthalpy relaxation, Dh*, is determined as the sample is heated at 10°C min^-1 following cooling at various rates through the glass transition region. DSC studies suggested that the presence of thermoplastic inhibits the process of relaxation. This revised version was published online in July 2006 with corrections to the Cover Date.     

Physical aging of an amorphous polyimide: Enthalpy relaxation and mechanical property changes

The physical aging behavior of an isotropic amorphous polyimide possessing a glass transition temperature of approximately 239°C was investigated for aging temperatures ranging from 174 to 224°C. Enthalpy recovery was evaluated as a function of aging time following sub‐T_g annealing in order to assess enthalpy relaxation rates, and time‐aging time superposition was employed in order to quantify mechanical aging rates from creep compliance measurements. With the exception of aging rates obtained for aging temperatures close to T_g, the enthalpy relaxation rates exhibited a significant decline with decreasing aging temperature while the creep compliance aging rates remained relatively unchanged with respect to aging temperature. Evidence suggests distinctly different relaxation time responses for enthalpy relaxation and mechanical creep changes during aging. The frequency dependence of dynamic mechanical response was probed as a function of time during isothermal aging, and failure of time‐aging time superposition was evident from the resulting data. Compared to the creep compliance testing, the dynamic mechanical analysis probed the shorter time portion of the relaxation response which involved the additional contribution of a secondary relaxation, thus leading to failure of superposition. Room temperature stress‐strain behavior was also monitored after aging at 204°C, with the result that no discernible embrittlement due to physical aging was detected despite aging‐induced increases in yield stress and modulus. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1931–1946, 1999     

The physical properties of bisphenol-a-based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature

The creep behavior of a series of fully cured epoxy resins with different crosslink densities was determined from the glassy compliance level to the equilibrium compliance J_e at temperatures above T_g and at the glassy level below T_g during spontaneous densification at four aging temperatures, 4,4-diamino diphenyl sulfone DDS was used to crosslink the epoxy resins. The shear creep compliance curves J(t) obtained with materials at equilibrium densities near and above T_g were compared at their respective T_gs. T_gs from 101 to 205°C were observed for the epoxies which were based on the diglycidyl ether of bisphenol A. Creep rates were found to be the same at short times, and equilibrium compliances J_e were close to the predictions of the kinetic theory of rubberlike elasticity. Time scale shift factors determined during physical aging were reduced to T_g. At compliances below 2 × 10^?10 cm²/dyn, Andrade creep, where J(t) is a linear function of the cube root of creep time, was observed. The time to reach an equilibrium volume at T_g was found to be longer for the epoxy resin with lower crosslink densities. The increase of density during curing is illustrated for the epoxy resin with the highest crosslink density.     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Positron annihilation in amine-cured epoxy polymers—pressure dependence

Positron annihilation spectroscopy has been used to study free volume in an arnine-cured epoxy as a function of external pressure at temperatures above and below the glass transition temperature. The observed ortho-positronium lifetime τ₃ and formation probability I₃ decreased with increasing pressure. The decrease in τ₃ is interpreted in terms of a corresponding decrease in average free-volume hole size over the range from 0.135 to 0.045 nm³. The fractional free-volume and the free-volume compressibility in the epoxy are calculated as functions of pressure at 100°C.     

Physical Aging of a Tetrafunctional/phenol Novolac Epoxy Mixture Cured with Diamine. DSC and DMA measurements

The physical aging of a system containing tetraglycidyl-4-4′-diaminodiphenylmethane (TGDDM), with a multifunctional novolac glycidyl ether resin hardened by 4,4′-diaminodiphenylsulphone (DDS) has been investigated by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). Samples fully cured were aged at temperatures between 200 and 250°C, during periods of time from 1 to a maximum of 336 h. Furthermore, the dynamic mechanical relaxation behaviour annealed at temperature of 220°C, was studied, aging during 24 and 168 h. The effect of the enthalpy relaxation during DSC heating scan is shown by the presence of an endothermic peak whose position and intensity depends on the aging conditions, both temperature and time. DSC studies suggest that enthalpy relaxation increases gradually with aging time to a limiting value for each temperature where structural equilibrium is reached. DMA results show that the effect of aging is to cause chain stiffening and a decrease in the height of the peak value of the loss factor. This revised version was published online in August 2006 with corrections to the Cover Date.     

Enthalpy relaxation of an epoxy–anhydride resin by temperature‐modulated differential scanning calorimetry

The enthalpy relaxation of an epoxy–anhydride resin was studied by physical aging and frequency‐dependence experiments with alternating differential scanning calorimetry (ADSC), which is a temperature‐modulated differential scanning calorimetry technique. The samples were aged at 80 °C, about 26 K below the glass‐transition temperature, for periods up to 3800 h and then scanned under the following modulation conditions: underlying heating rate of 1 K min⁻¹, amplitude of 0.5 K, and period of 1 min. The enthalpy loss was calculated by the total heat‐flow signal, and its variation with the log (aging time) gives a relaxation rate (per decade), this value being in good agreement with that calculated by conventional DSC. The enthalpy loss was also analyzed in terms of the nonreversing heat flow, revealing that this property is not suitable for calculating enthalpy loss. The effect of aging on the modulus of the complex heat capacity, |Cp*|, is shown by a sharper variation on the low side of the glass transition and an increase in the inflexional slope of |Cp*|. Likewise, the phase angle also becomes sharper in the low‐temperature side of the relaxation. The area under the corrected out‐phase heat capacity remains fairly constant with aging. The dependence of the dynamic glass transition, measured at the midpoint of the variation of |Cp*|, on ln(frequency) allows one to determine an apparent activation energy, Δh*, which gives information about the temperature dependence of the relaxation times in equilibrium over a range close to the glass transition. The values of Δh*, determined from ADSC experiments in a range of frequencies between 4.2 and 33 mHz and at an amplitude of 0.5 K, and an underlying heating rate of 1 K min⁻¹, were analyzed and compared with that obtained by conventional DSC from the dependence of the fictive temperature on the cooling rate. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2272–2284, 2000     

Physical aging of epoxy polymers and their composites

Exposure to extended periods of sub‐T_g temperatures causes physical changes in the molecular structure of epoxy resins and epoxy‐based materials to occur. These physical aging mechanisms include the reduction in free volume and changes to the molecular configuration. As a result, mechanical, thermodynamical, and physical properties are affected in ways that can compromise the reliability of epoxy‐based engineering components and structures. In this review, the physical changes in the molecular structure of epoxies are described, and the influence of these changes on the bulk‐level response is detailed. Specifically, the influence of physical aging on the quasistatic mechanical properties, viscoelasticity, fracture toughness, thermal expansion coefficient, volume relaxation, enthalpy relaxation, endothermic peak temperature, fictive temperature, and moisture/solvent absorption capability is reviewed. Also discussed are relationships between relaxation functions, crosslink density, composite reinforcement, and epoxy/copolymer blending and the physical aging response of epoxies. Finally, the concepts of thermal and mechanical rejuvenation are discussed. © 2011 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2011     

The evolution of the viscoelastic retardation spectrum during the development of an epoxy resin network

The evolution of the viscoelastic behavior of an epoxy resin at various stages of curing has been followed with the changes in the retardation spectrum. The creep J(t) and recoverable creep compliance J_r(t) curves of the neat epoxy resin Epon l00lF (Shell) were determined at temperatures between 30 and 77°C. The viscosity decreased over 8 orders of magnitude as the temperature was increased. Specimens with eight stages of network development were prepared by reacting all of the epoxy resin's oxirane rings with amine hydrogens from varying ratios of a monofunctional amine (methyl aniline) and a tetrafunctional amine 4,4′-diamino diphenyl sulfone (DDS). Preparations in which 25, 35, and 40% DDS were used did not result in a molecular network, so they were viscoelastic liquids. With 45% DDS, the product had a nascent network and was judged to be just beyond the point of incipient gelation. The remaining preparations from 0.50, 0.60, 0.70, and 1.0 DDS yielded tighter less compliant molecular networks. The creep and recoverable compliance curves were measured over a range of temperatures above the glass transition temperature, T_g. They were reduced to T_g, and retardation spectra L(ln τ) were calculated.     

Sorption and transport properties of MY720/DDS epoxy reacted with blocking reagents

Thin films of the epoxy formed by the reaction of tetraglycidyl 4,4'-diamino-diphenylmethane and 4,4'-diaminodiphenyl sulfone (73:27 w/w) were reacted with acrylonitrile (ACN) and isocyanates as blocking reagents for hydroxyl, amine, and epoxy groups. The water uptake at 30, 45, 55, and 70°C of the epoxy resin was monitored gravimetrically. At each temperature the epoxy exhibited case I or Fickian behavior. The diffusion coefficient D increased from 30 to 55°C, but decreased at 70°C because of the reaction of water with residual oxirane groups. Diffusion of ACN is accompanied by both reaction and polymerization, so equilibrium could not be reached. Sorption of the isocyanates essentially follows case I or Fickian behavior. Equilibrium moisture absorptions showed a correspondence between the reduction of moisture absorption and the number of blocked functional groups, irrespective of the nature of the blocking groups. Moisture absorption reductions as high as 68% were obtained. Moisture diffusion of the films after blocking with the various reactants exhibits case I or Fickian behavior. At 30°C, D values are significantly higher for reacted films. At 70°C, the value of D is unchanged as compared with the 30°C value for films reacted with ACN, but D values are significantly lower for films reacted with isocyanate blocking reagents as compared with the epoxy resin.     

Molecular motion during physical aging in polystyrene: Investigation using probe reorientation

A photobleaching method has been used to observe the reorientation of tetracene and rubrene in polystyrene during physical aging. Rotation times change more than an order of magnitude during isothermal aging after a temperature quench from above T_g. Down‐ and up‐jumps of the temperature show the expected asymmetry due to the nonlinearity of the aging process. The rotation times of tetracene and rubrene require the same amount of time to reach equilibrium after a temperature change (10³ − 10⁵ s in the range 93–99 °C). These equilibration times are the same order of magnitude as equilibration times for volume and enthalpy relaxation, but have a somewhat weaker temperature dependence. Very near equilibrium, the rates of aging are different for the two probes, with rubrene approaching equilibrium more rapidly at very long times. This may be understood if the aging process is spatially heterogeneous, that is, if aging occurs more rapidly in some small regions of the sample than in others. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 68–79, 2000     

Synthesis and characterization of oligosalicylaldehyde-based epoxy resins

The synthesis of a new epoxy resin of oligosalicylaldehyde by the reaction with epichlorohydrin is reported. New resin’s epoxy value and chlorine content were determined and found to be 25% and 1%, respectively. The characterization of the new resin was instrumented by FTIR, ¹H NMR, scanning electron microscopy, and thermal gravimetric analyses. TGA results showed that the cured epoxy resin has a good resistance to thermal decomposition. The mass losses of cured epoxy resin were found to be 5%, 10%, 50% at 175°C, 240°C, and 400°C, respectively. On the curing procedure the resin was cured with polyethylenepolyamine at 25 °C for 8 h and 100°C for 1.5 h. The FTIR spectrum of new epoxy resin gave the peak of oxirane ring at ṽ = 918 cm⁻¹. In memory of Professor Dr. Adalet R. Vilayetoğlu     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Physical aging of a polyetherimide: Creep and DSC measurements

Creep and differential scanning calorimetry (DSC) measurements have been used to study the physical aging behavior of a polyetherimide. Isothermal aging temperatures ranged from 160°C to T_g with aging times ranging from 10 min to 8 days. The only measurable effect of physical aging on the short-time creep curves is a shift of the creep compliance to longer times. Andrade plots of the compliance versus the cube root of time are linear at short times with the slope β decreasing with increasing aging time to a constant value once equilibrium is reached. Log β³ is related directly to the degree to which the creep curves shift to longer times with physical aging, and is used in this work as a measure of physical aging. A reduced curve of log β³ versus log aging time is obtained for the aging temperatures investigated by appropriate vertical and horizontal shifts. The enthalpy change during aging increases linearly with the logarithm of the aging time, t_a, leveling off at equilibrium at values which increase with decreasing aging temperature. Hence, both nonequilibrium and equilibrium temperature shift factors can be calculated from the DSC data. Good agreement is observed between the equilibrium temperature shift factors obtained from the creep and DSC data. The temperature dependence of the nonequilibrium temperature shift factors is found to be an order of magnitude smaller than that of the equilibrium shift factors. The time scales to reach equilibrium for enthalpy and for mechanical measurements are found to be the same within experimental error. © 1995 John Wiley & Sons, Inc.     

Physical aging studies of amorphous linear polyesters. Part II. Dependence of structural relaxation parameters on the chemical structure

The enthalpy relaxation of a series of linear amorphous polyesters (poly(propylene isophthalate) (PPIP), poly(propylene terephthalate) (PPTP), poly(ethylene terephthalate) (PETP), and poly(dipropylene terephthalate) (PDPT)) has been investigated by differential scanning calorimetry (DSC). These polyesters have been annealed at equal undercooling below their respective glass transition temperatures, T_g, (T_g − 27°C, T_g − 15°C, and T_g − 9°C) for periods of time from 15 min to 480 h. The key parameters of structural relaxation, namely the apparent activation energy (Δh*), the nonlinearity parameter (x) and the nonexponentiality parameter (β), have been determined for each polyester and related to an effective relaxation rate (1/τ_eff) and to the chemical structure. We observe that the variation of the structural relaxation parameters shows a trend that is common to other polymeric systems, whereby an increase of x and β corresponds a decrease in Δh*. The comparison of these parameters in PETP and in PPTP gives information about the effect of the introduction of a methyl group pendant from the main chain; the x parameter increases (i.e., a reduced contribution of the structure to the relaxation times), β increases (i.e., a narrow distribution of relaxation times), and Δh* decreases. Additionally, enthalpy relaxation experiments show that a decrease of Δh* correlates with an increase of 1/τ_eff, when they are measured at a fixed value of the excess enthalpy, δ_H. The introduction of an isopropyl ether group in PDPT with respect to PPTP decreases both x and β, but increases Δh*, which the rate of relaxation decreases. The ring substitution in PPTP and PPIP originates less significant changes in the structural parameters. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36 : 113–126, 1998     

Acceleration of the cationic polymerization of an epoxy with hexanediol

Thin films of 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexane carboxylate were UV irradiated (1.1 J cm^-2) under isothermal conditions ranging from 0 to 50°C. Under these conditions the polymerization advanced quickly but only to a conversion level of less than 10% before the reaction rate slowed by more than an order of magnitude. This drop off in rate was not caused by the glass transition temperature, T _g, reaching or exceeding the reaction temperature, T _rxn, since the epoxide's T _g remained at least 40°C below T _rxn. Raising the sample temperature above 60°C caused a sharp increase in the conversion level. At 100°C conversion exceeds 80% and the ultimate T _g approaches 190°C. The addition of 10 mass% 1,6-hexanediol, HD, to the epoxy caused the conversion at room temperature to quintuple over the level obtained without the alcohol present. The heat liberated from this alcohol epoxy blend during cure on a UV conveyor belt system caused the sample's temperature to increase by about 100°C above ambient whereas the epoxy alone under these conditions only experienced a modest temperature rise of about 26°C. If the amount of HD in the blend is increased above 10% the heat of reaction at 23°C decreases due to HD being trapped in a nonreactive crystalline phase. Boosting reaction temperatures above 50°C melts the HD crystals and yields significantly improved conversion ratios. As the level of alcohol blended with the epoxy is raised its ultimate T _g is lowered and when the concentration of alcohol in the blend nears 30 mass%T _g drops below room temperature. This revised version was published online in July 2006 with corrections to the Cover Date.     

Cure behavior of epoxy resin/MMT/DETA nanocomposite

The Flory's gelation theory, non-equilibrium thermodynamic fluctuation theory and Avrami equation have been used to predict the gel time t _g and the cure behavior of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposites at various temperatures and organo-montmorillonite loadings. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method, and the results show that the addition of organo-montmorillonite reduces the gelation time t _gand increases the rate of curing reaction, the value of k, and half-time of cure after gelation point t_1/2 decreases with the increasing of cure temperature, and the value of n is ~2 at the lower temperatures (<60°C) and decreases to ~1.5 as the temperature increases, and the addition of organo-montmorillonite decreases the apparent activation energy of the cure reaction before gelation point, but has no apparent effect on the apparent activation energy of the cure reaction after gelation point. There is no special curing process required for the formation of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposite. This revised version was published online in July 2006 with corrections to the Cover Date.