Melt structure of Bi20Sb80 alloy and its effect on the solidification

In this article, the temperature dependence of electrical resistivity (ρ-T) of Bi₂₀Sb₈₀ alloy was investigated by DC four-probe method. The results showed that there were two kinds of liquid–liquid structure transition (L-LST) in liquid Bi₂₀Sb₈₀ alloy, one was irreversible at high temperature above the liquids (815–1069°C) and the other was reversible near the melting point (600–720°C). The anomalous points on differential scanning calorimetry curve matched well with that on ρ-T curve which verified the effectiveness of the resistivity experiment. L-LST of high temperature refined the solidification organisation of Bi₂₀Sb₈₀ alloy to a certain extent.     

Thermal behavior of ferroelectric Polyamide 11 in relation to pyroelectric properties

The pyroelectric properties of oriented thin films of ferroelectric Polyamide 11 have been studied in the temperature range of −100°C up to +140°C. The temperature dependence of the experimental pyroelectric coefficient has been analyzed. Three changes of slope of the pyroelectric coefficient are observed at −20, +50, and +100°C. The origin of the lower temperature event has not yet been defined. The upper transition is attributed to chain movements in crystalline regions, and more precisely, to a crystalline phase transition. The intermediate event is close to the glass transition temperature T_g observed by DSC. It is attributed to the manifestation of the glass transition. Below T_g, the variations of the pyroelectric coefficient are very small. For higher temperatures, it increases rapidly, attesting to a major contribution of secondary pyroelectricity and dimensional effects above T_g. The breaking of hydrogen bonds occurring at the glass transition temperature observed on DSC thermograms does not affect pyroelectric properties. Pyroelectric properties are mildly reduced after annealing at temperatures up to +140°C. A comparative study of oriented ferroelectric films prepared by quenching from the melt and nonoriented slowly cooled samples has been carried out by means of DSC. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 715–723, 1999     

Phenol‐urea‐formaldehyde cocondensed resol resins: Their synthesis,curing kinetics,and network properties

Several phenol‐urea‐formaldehyde (PUF) cocondensed resol resins were synthesized by different procedures. The curing kinetics and network properties of these PUF resins were examined by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). A kinetic study indicated that the activation energy values of PUF resins are generally higher than those of phenol‐formaldehyde (PF) resins during curing processes, but the curing rates of PUF resins are faster than those of PF resins. The pH values of PUF systems have a significant influence on the rate constants, although they affect the activation energy very slightly. Moreover, the dependence of activation energy on the conversion showed that there are more individual reactions with different activation energies occurring during the curing processes in PUF resins than in PF resins. The decomposition of methylene ether bridges to form methylene bridges probably occurs at high temperature in PUF resins. DMTA data indicated that the network rigidity of PUF resins is slightly lower than that of PF resin. The gel point and T_{tan δ2} transition measured by DMTA were consistent with the kinetic results obtained from the DSC data, but they were also related to the physical and mechanical properties of the network, especially with regard to the T_{tan δ2} transition. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1929–1938, 2003     

Preparation and characterization of multifunctional maleimide macromonomers and their cured resins

Multifunctional compounds with pendent and terminal maleimide groups were prepared through the reaction of 4‐maleimidobenzoic acid and 5‐maleimidoisophthalic acid with diglycidyl ether of bisphenol A. The ratios of the pendent maleimide groups to the terminal maleimide groups in the obtained compounds were varied to tailor the chain length and properties of the maleimide compounds. The maleimide group ratios, determined from differential scanning calorimetry, showed good coincidence with the values calculated from the charged monomer amounts. The good solubility and low softening points of the maleimide compounds indicated their good processability. High glass‐transition temperatures (220 °C) were observed for the cured resins because of the relatively high crosslinking density. The curing reaction, thermal stability, and degradation behavior of the resins were also studied with differential scanning calorimetry and thermogravimetric analysis. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3178–3188, 2004     

Synthesis and properties of a cyanate ester containing dicyclopentadiene(II)

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac (DCPDNO) was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant DCPDNO was reacted with cyanogen bromide into 2,6‐dimethyl phenol‐dicyclopentadiene cyanate ester (DCPDCY). The structures of the novolac and cyanate ester were confirmed with Fourier transform infrared spectroscopy, elemental analysis, mass spectrometry (MS), and nuclear magnetic resonance. For the purpose of increasing the mobility of residual DCPDCY during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of a monofunctional cyanate ester, 4‐tert‐butylphenol cyanate ester (4TPCY), was added to DCPDCY to form the cyanate ester copolymer. The synthesized DCPDCY was then cured with 4TPCY at various molar ratios. The thermal properties of the cured cyanate ester resins were studied with dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those of the commercial bisphenol A cyanate ester system. Compared with the bisphenol A cyanate ester system, the cured DCPDCY resins exhibited lower dielectric constants (2.52–2.67 at 1 GHz), dissipation factors (0.0054–0.0087 at 1 GHz), glass‐transition temperatures (261–273 °C), thermal stability (5% degradation temperature at 406–450 °C), thermal expansion coefficients (4.8–5.78 × 10^?5/°C before the glass‐transition temperature), and moisture absorption (0.8–1.1%). © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 671–681, 2005     

The curing of epoxy resins with aminophenoxycyclotriphosphazenes

Aminophenoxycyclotriphosphazenes have been used as curing agents for epoxy resins. The thermal curing was performed in stages at 120–125 and 175–180°C followed by postcuring at 225°C to give tough brown polymers. The thermal curing reaction was monitored using FTIR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins has shown thermal stability up to 350–340°C. The char yield obtained in nitrogen at 800°C was about 55–42% and in air at 700°C was about 40–32%. Graphite cloth laminates were prepared. The mechanical properties evaluated were found superior to those of commonly used epoxy resin systems. These resins are useful for making fire- and heat-resistant composites, laminates, molded parts, and adhesives.     

Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin

A kind of aromatic diamine, 4′, 4″-(2, 2-diphenylethene-1, 1-diyl)dibiphenyl-4-amine (TPEDA), was successfully synthesized via Suzuki coupling reaction. The TPEDA containing nonplanar rigid moieties can be used as epoxy resins curing agent to improve the complex properties of cured composites. The curing kinetics during thermal processing of E51/TPEDA system was investigated by nonisothermal differential scanning calorimeter. The average activation energy (E _α), pre-exponential factor (lnA), and reaction order (n) calculated from the Kissinger, the Ozawa, the Friedman and the Flynn–Wall–Ozawa methods were 55.8 kJ mol^?1, 9.4 s^?1 and 1.1, respectively. By the aid of estimated kinetic parameters, the predicted heat generation vs temperature curves fit well with the experimental data, which supported the validity of the estimated parameters and the applicability of the analysis method used in this work. By the introduction of nonplanar rigid moieties, the cured epoxy resins with TPEDA exhibited a higher glass transition temperature (T _g = 258 °C), good thermal stability (≈395 °C at 10 % mass-loss), and high char yield (36.6 % at 700 °C under nitrogen) compared with conventional curing agents.     

Thermostable laminating resins based on aromatic diketone bis- and tetramaleimides

Twelve structurally different bis- and tetramaleimides were synthesized by Friedel–Crafts reaction between 4-maleimido-benzoylchloride or 3,5-bismaleimido-benzoylchloride and various aromatic reagents. They were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. Crosslinked resins were obtained by curing the monomers at 250°C/6 h. Thermal characterization of monomers and cured resins was accomplished by differential thermal analysis (DTA), dynamic thermogravimetric analysis (TGA), and isothermal gravimetric analysis (IGA). Tetramaleimides were polymerized at lower temperatures than did the respective bismaleimides. The cured resins were stable up to 317–385°C in N₂ atmosphere and formed an anaerobic char yield of 52–66% at 800°C.     

Processing studies and thermal stability of addition polymers from 1,4,5,8-tetrahydro-1,4;5,8-diepoxyanthracene and Bis-dienes

1,4,5,8-Tetrahydro-1,4;5,8-diepoxyanthracene reacts with various anthracene end-capped polymide oligomers to form Diels-Alder cycloaddition copolymers. The polymers are soluble in common organic solvents, and dehydrate thermally at temperatures of 300–350°C to give thermal oxidatively stable pentiptycene units along the polymer backbone. Because of their high softening points and good thermal oxidative stability, the polymers are candidates for matrix resins for high temperature composite applications. To assess their usefulness for such applications, several parameters have been studied affecting the properties of the final polymer. These parameters include varying the formulated molecular weight of the end-capped prepolymers, and use of meta-substituted aromatic diamine in place of some of the para-substituted diamine. Processability of the resins was studied using rheometric spectrometry, and a processing scheme was devised. Finally, several formulations of neat resins were compression molded into coupons, and evaluated for longterm stability in air at 315 and 371°C. The best combination of good processability and thermal oxidative stability was obtained from polymers synthesized with small amounts of meta-diamine substitution and higher formulated molecular weight prepolymers.     

Allyl ether of aralkyl phenolic resin with low melt viscosity and its Alder‐ene blends with bismaleimide: synthesis,curing, and laminate properties

This paper outlines the synthesis and characterization of O‐allyl aralkyl phenolic (O‐allyl Xylok, OAX) resins having low melt viscosity and its Alder‐ene blends with 2, 2′‐bis 4‐[(4′‐maleimido phenoxy) phenyl] propane. The blends manifested a three‐stage curing pattern that converged to a two‐stage pattern on enhancing the maleimide content. The polymerization kinetics of typical allyl and maleimide rich resin systems showed apparent activation energy increasing and pre‐exponential factor decreasing from ene to the Diels–Alder step. Increased allyl content improved mechanical and impact properties of the composites at ambient temperature, although it diminished the retention of interlaminar shear strength at elevated temperature. Increased maleimide content of the resin was conducive for the higher rigidity for the composite and its retention at elevated temperature. A substantial increase in T_g (from 153°C to 280°C) and thermal stability was observed with an increase in maleimide content. High allyl content resulted in improved mechanical properties thanks to better resin–reinforcement interaction as revealed from morphological analysis. Copyright © 2014 John Wiley & Sons, Ltd.     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Synthesis and properties of a novel high temperature pyridine‐containing phthalonitrile polymer

A novel pyridine‐containing aromatic phthalonitrile monomer, 2,6‐bis[4‐(3,4‐dicyanophenoxy)benzoyl]pyridine (BCBP) was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide of 2,6‐bis (4‐hydroxybenzoyl)pyridine (BHBP). 4‐(Aminophenoxy) phthalonitrile (APPH) was selected to promote the curing reaction, and the curing behavior has been investigated by differential scanning calorimetric (DSC), suggesting a wide processing window about 64 °C. Different curing additive concentrations resulted in polymers with different crosslinking degrees and subsequently influenced the performance of resins. The resulting BCBP polymer exhibited high glass transition temperatures exceeding 400 °C, outstanding thermo‐oxidative stability with weight retention of 95% at 530 °C, indicating a significant improvement in thermal properties endowed by pyridine units. Additionally, it also showed a lower overall water absorption after submersion in boiling water for 50 hours. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3819–3825     

Thermal cured epoxy resins using certain calixarenes and their esterified derivatives as curing agents

The acetyl esterified calixarene (CA) derivatives were prepared from calix[4]resorcinarene (CRA), and p‐tert‐butylcalixarene (BCA[n], n = 4, 6, 8), respectively. Using these CA derivatives as curing agents, the thermal curing reactions of two multifunctional epoxy resins (jER 828, 186 g/equiv., and ESCN, 193.7 g/equiv.) were investigated. The temperatures of glass transition (T_g) and decomposition (T) were measured by DSC and TGA, respectively. Based on the yields, T_gs, and T_ds of the thermal cured jER 828 epoxy resin with CRA‐E100, the curing conditions were optimized to be tetrabutylphosphonium bromide (TBPB) as catalyst in NMP at 160 °C for 15 h. Under this curing condition, the cured materials of jER 828 or ESCN using various CA derivatives as curing agents were prepared. Except for BCA4 derivatives, the yields of thermal curing reaction were higher than 90%. T_gs and Ts of the resultant cured materials were in the range of 113–248 °C and 363–404 °C, respectively. These results mean that the cured epoxy resins with excellent T_gs were successfully formed by using CA derivatives as curing agents. It was also found that the T_gs of cured epoxy resins were strongly affected by the degree of esterification of CA derivatives. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1931–1942, 2010     

Synthesis and characterization of novel epoxy resins‐filled microcapsules with organic/inorganic hybrid shell for the self‐healing of high performance resins

Novel microcapsules (MCs) with organic/inorganic hybrid shell were successfully fabricated using epoxy resin as core material and nano boron nitride (BN) and mesoporous silica (SBA‐15) as inorganic shell materials in aqueous solution containing a water‐compatible epoxy resin curing agent. The morphologies, thermal properties and Young's moduli of MCs were investigated. The results indicated that epoxy resins were encapsulated by BN/SBA‐15/epoxy polymer hybrid layer, the resulting MCs were spherical in shape and the introduction of inorganic particles made MCs had rough surface morphology. The mean modulus value of MCs was from 2.8 to 3.1 GPa. The initial decomposition temperature (T_di) of MCs at 5 wt% weight loss was from 309 to 312°C. MCs showed excellent thermal stability below 260°C. The structures and properties of MCs could be tailored by controlling the weight ratio of inorganic particle. When the weight ratio of BN to SBA‐15 was 0.15:0.10, MCs had the highest T_di and modulus. The resulting MCs were applied to high performance 4,4′‐bismaleimidodiphenylmethane/O,O′‐diallylbisphenol A (BMI/DBA) system to design high performance BMI/DBA/MC systems. Appropriate content of MCs could improve the fracture toughness and maintain the glass transition temperature (T_g) of BMI/DBA system. The core materials released from fractured MCs could bond the fracture surfaces of the BMI/DBA matrix through the polymerization of epoxy resins. When the healing temperature schedule of 100°C/2h+150°C/1h was applied, 15 wt% MCs recovered 98% of the virgin fracture toughness of BMI/DBA. Copyright © 2016 John Wiley & Sons, Ltd.     

Effect of temperature and volume on the tensile and adhesive properties of photocurable resins

Knowing the mechanical properties of UV‐curable resins at cryogenic conditions is important to ongoing fusion‐energy research and to emerging aerospace applications. The tensile and interfacial shear strengths of two commercially available UV‐curable resins were measured at room‐temperature and cryogenic conditions for both bulk and reduced (subnanoliter) specimen volumes. The tensile properties of cured specimens are remarkably sensitive to both testing temperature and specimen size. For one type of resin, the cold (?150 °C) tensile strength of subnanoliter specimens is ～9× larger (179 ± 19 MPa) than bulk values at room temperature. The interfacial shear strength between SiC fibers and small volumes of resin volumes is comparable to the bulk, room‐temperature tensile strength, but it varies over a wide range at ?150 °C (15–53 MPa). All resins were fully cured, and an analysis of fractured surfaces revealed microstructural features. The enhanced strength in microscopic specimens may be related to inhomogeneous stress fields that develop during cure. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 936–945     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Structure and properties of poly-2,5-distyrylpyrazine

Poly-2,5-distyrylpyrazine (poly-DSP) was investigated by differential thermal analysis (DTA), thermogravimetric analysis (TGA), and measurements of dynamic viscoelastic and electrical properties. From DTA and TGA studies it was confirmed that poly-DSP melts at 321°C and depolymerizes rapidly to the monomer at temperatures between 335°C and 345°C in helium. The polymer is affected by oxygen above 200°C. The E′ value from dynamic viscoelasticity measurements on amorphous film is 2 × 10¹¹ dyne/cm² at room temperature. It decrease abruptly in the temperature range 140–150°C; but the net decrease of E′ within this temperature range is relatively small. The electrical properties of amorphous poly-DSP are characterized by a small temperature dependence of the dielectric constant between room temperature and 100°C. The dielectric loss tangent was observed to be small, and the dc conductivity was extremely small. It is concluded that rotation of the phenyl branches in the polymer occurs above ?30°C and the glass transition occurs at about 150°C. These properties are discussed in some detail in relation to the polymer structure.     

Adhesives and coatings based on phenolic/epoxy resins

Low molecular weight epoxy resin based on bis (4‐hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol–, cresol–, resorcinol–and salicylic acid–formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol–or cresol–formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol–or salicylic acid–formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints. Copyright © 1999 John Wiley & Sons, Ltd.     

Influence of curing conditions and dibutyl phthalate concentration on the properties of cured epoxy resin

The influence of the curing conditions and dibutyl phthalate additions on the physicomechanical properties of cured polyepoxides based on ED-20 resin and 4,4'-diaminodiphenylmethane curing agent was examined. An increase in the curing temperature over 150°С does not noticeably influence the physicomechanical properties of the cured resin, and keeping of the reaction mixture at 180°С for 12 h leads to a considerable decrease in the glass transition temperature of the polymer. Addition of dibutyl phthalate in concentrations of up to 10 wt % decreases the glass transition teperature of the polymer by 44°C, but with increasing concentration of dibutyl phthalate the elastic modulus increases and the breaking strain slightly decreases. The dependence of the ultimate strength on the dibutyl phthalate concentration passes through a maximum at 3 wt % dibutyl phthalate.