Ultrathin silica films immobilized on gold supports: fabrication, characterization, and modification

A novel method for covalent attachment of ultrathin silica films (thickness <10 nm) to gold substrates is reported. Silica layers were prepared using spin-coating of sol-gel precursor solutions onto gold substrates that were cleaned and oxidized using UV photo-oxidation in an ozone atmosphere. The gold oxide layer resulting from this process acts as a wetting control and adhesive agent for the ultrathin silica layer. Control of silica layer thickness between approximately 6 and 60 nm through modification of precursor solution composition or by repetitive deposition is demonstrated. Films were characterized using infrared spectroscopy, ellipsometry, atomic force microscopy, and cyclic voltammetry. For the standard deposition parameters developed here, films were determined to be 5.5 +/- 0.75 nm thick, and were stable in aqueous solutions ranging in pH from 2 to 10 for at least 30 min. Films contained nanoscopic defects with radii of 相似文献   

Synthesis of highly textured superconducting NdBa<Subscript>2</Subscript>Cu<Subscript>3</Subscript>O<Subscript>7-<Emphasis Type="Italic">y</Emphasis></Subscript> thin films by two aqueous sol-gel dip coating techniques

Today, the deposition of coated conductors on a variety of substrates is often performed using a vacuum or low pressure technique. However, obtaining uninterrupted deposition at high speed, increasing flexibility in composition and attaining independence of geometric constraints of the substrates are areas in which vacuum techniques will need sustained development in order to answer industrial demands. The development of the next generation of deposition methods, based on deposition under atmospheric environment and from aqueous precursor solutions is a real challenge. This work describes the deposition of thin NdBa₂Cu₃O_7-y layers on SrTiO₃ single crystals based on a new sol-gel dip coating process using aqueous precursor solutions. Two inorganic aqueous sol-gel routes were investigated, a metal nitrate–citric acid based and a metal acetate–triethanol amine based solution. Using detailed thermal analysis, it is shown that adjusting the different parameters during thermal treatment can be used to control the morphology of the films. Also special attention is given to the microstructure of the thin film because of its relevance to the superconducting transport properties of the coated conductor system.     

Silica-stabilized gold island films for transmission localized surface plasmon sensing

Ultrathin gold films prepared by evaporation of sub-percolation layers (typically up to 10 nm nominal thickness) onto transparent substrates form arrays of well-defined metal islands. Such films display a characteristic surface plasmon (SP) absorption band, conveniently measured by transmission spectroscopy. The SP band intensity and position are sensitive to the film morphology (island shape and inter-island separation) and the effective dielectric constant of the surrounding medium. The latter has been exploited for chemical and biological sensing in the transmission localized surface plasmon resonance (T-LSPR) mode. A major concern in the development of T-LSPR sensors based on Au island films is instability, manifested as change in the SP absorbance following immersion in organic solvents and aqueous solutions. The latter may present a problem in the use of Au island-based transducers for biological sensing, usually carried out in aqueous media. Here, we describe a facile method for stabilizing Au island films while maintaining a high sensitivity of the SP absorbance to analyte binding. Stabilization is achieved by coating the Au islands with an ultrathin silica layer, ca. 1.5 nm thick, deposited by a sol-gel procedure on an intermediate mercaptosilane monolayer. The silica coating is prepared using a modified literature procedure, where a change in the reaction conditions from room temperature to 90 degrees C shortened the deposition time from days to hours. The system was characterized by UV-vis spectroscopy, ellipsometry, XPS, HRSEM, AFM, and cyclic voltammetry. The ultrathin silica coating stabilizes the optical properties of the Au island films toward immersion in water, phosphate buffer saline (PBS), and various organic solvents, thus providing proper conditions where the optical response is sensitive only to changes in the effective dielectric constant of the immediate environment. The silica layer is thin enough to afford high T-LSPR sensitivity, while the hydroxyl groups on its surface enable chemical modification for binding of receptor molecules. The use of silica-encapsulated Au island films as a stable and effective platform for T-LSPR sensing is demonstrated.     

Controlled formation of polyamine crystalline layers on glass surfaces and successive fabrication of hierarchically structured silica thin films

The formation of silica films on the glass plate whose surface was precoated by crystalline linear poly(ethylenimine) (LPEI) in advance was systematically investigated via controlling the surface-specific crystallization of the LPEI on the glass plate. Immersing glass substrates into a hot aqueous solution of LPEI containing additives such as transition metal ions and acidic compounds and retaining them on 30 °C for desired periods resulted in the formation of crystalline LPEI layers on the substrates. Subsequently dipping this LPEI-coated glass into silica source solutions afforded successfully hierarchically structured silica film which coated continuously the surface of the substrates. In this two-step process, we found that the formation of hierarchically structured silica films strongly depended on the LPEI layer formed from the LPEI aqueous solutions containing different additives. The LPEI layer formed by changing the kinds of additives and their concentrations provides the differently structured silica films composed of turbine-like structures flatly lying-on and/or vertically standing-on as well as ribbon network structures on the surface of the substrates. Moreover, we functionalized these silica films by the introduction of hydrophobic alkyl chains or emissive Eu(III) complexes and investigated their wettability and emission properties.     

Traveling fronts of copper deposition

We report the experimental observation of traveling fronts during the electroless deposition of copper on passive steel substrates. The low-carbon steel samples are passivated in nitric acid prior to the plating experiment, thus creating a thin, protective oxide layer on the steel surface. The deposition experiments are carried out from slightly acidic (pH 3.2) copper sulfate solution and copper nitrate solution with the latter showing front propagation only in the presence of chloride ions. For up to 30 s, fronts propagate with constant velocities in the range from 0.5 to 5 mm/s depending on the experimental conditions. This phase of constant-speed propagation gives way to accelerating fronts and very rapid, spatially unstructured deposition. Front-mediated plating is observed over a wide range of cupric ion concentration and constitutes a striking and unexpected example for pattern formation in electrochemical systems.     

Structure and properties of nanosized coatings deposited onto polymers

Results of studies aimed at developing a new approach to measuring stress-strain properties of nanosized solids (strength, yield stress, and the value of plastic deformation at uniaxial tension) are generalized. This approach is based on the analysis of the parameters of microrelief arising upon the deformation of polymer films with thin coatings. It is demonstrated for the first time that the stress-strain properties of aluminum coatings deposited onto Lavsan substrates depend on the level of stresses in the substrate, the value of its deformation, and the thickness of the coating. The evolution of these parameters is related to the strain hardening of metal and the effect of nanostructuring of crystalline materials in the range of small thicknesses. When precious metal (Au, Pt) nanosized films are deposited onto polymers by ion-plasma sputtering, in the course of metal deposition, polymer surface layers interact with cold plasma. Stress-strain properties of polymer surface layers modified by plasma are quantitatively estimated for the first time. The model is proposed that makes it possible to take into account the contribution of the properties of precious metal and plasma-modified polymer surface layer to the strength of the coating.     

Pushing the size limits in the replication of nanopores in anodized aluminum oxide via the layer-by-layer deposition of polyelectrolytes

We report on the successful replication of the smallest pores in anodized aluminum oxide (AAO) via the layer-by-layer (LBL) deposition of polyelectrolytes to date to yield free-standing, open nanotubes with inner and outer diameters (±2σ) down to 37 ± 4 and 52 ± 19 nm, respectively. This work is based on the fabrication of defined arrays of highly regular nanopores by anodic oxidation of aluminum. Pores with pore diameters between 53 ± 9 and 356 ± 14 nm and interpore distances between 110 ± 3 and 500 ± 17 nm were obtained using an optimized two-step anodization procedure. 3-(Ethoxydimethylsilyl)propylamine-coated pores were replicated by alternating LBL deposition of poly(styrenesulfonate) and poly(allylamine). The detrimental adsorption of polyelectrolyte on the top surface of the template that typically results in partial pore blocking was eliminated by controlling the surface energy of the top surface via deposition of an ultrathin gold layer. The thickness of the deposited LBL multilayer assembly at the pore orifice agreed to within the experimental error with the thicknesses measured by variable angle spectroscopic ellipsometry and atomic force microscopy (AFM) for layers assembled on flat substrates. The selective dissolution of the alumina template afforded free-standing, open polymer nanotubes that were stable without any cross-linking procedure. The nanotubes thus obtained possessed mean outer diameters as small as 52 nm, limited by the size of the AAO template.     

Influence of the Metal Work Function on the Photocatalytic Properties of TiO2 Layers on Metals

The photocatalytic properties of titanium dioxide (TiO₂) layers on different metal plates are investigated. The metal–semiconductor interface can be described as a Schottky contact, and is part of a depletion layer for the majority carriers in the semiconductor. Many researchers have demonstrated an increase in the photocatalytic activity, due to the formation of a metal–semiconductor contact that are obtained by deposition of small metal islands on the semiconductor. Nevertheless, the influence of a Schottky contact remains uncertain, sparking much interest in this field. The immobilization of nanoparticulate TiO₂ layers by dip‐coating on different metal substrates results in the formation of a Schottky contact. The recombination rate of photoinduced electron–hole pairs decreases at this interface provided that the thickness of the thin TiO₂ layer has a similar magnitude to the depletion layer. The degradation of dichloroacetic acid in aqueous solution and of acetaldehyde in a gas mixture is investigated to obtain information concerning the influence of the metal work function of the back contact on the efficiency of the photocatalytic process.     

Recovery of heavy metal ions from aqueous solutions using modified organosilicas

Sorption of Cu(II), Pb(II), Cd(II), and Zn(II) from aqueous solutions on two-component organosilicas was studied as influenced by sorbent composition, contact time, ratio of solid and liquid phases, solution pH, nature and concentration of heavy metal ions, and content of modifying agent. The degrees of sorption of these metal ions from aqueous solutions using organosilicas modified with aluminum(III) added into the siloxane matrix or with copper(II) grafted to the sorbent surface layer were compared.     

Scintigraphic Measurement of Liquid Holdup in Foam Fractionation Columns

Alumina-supported copper and copper-manganese oxide catalysts as well as the parent formates were characterized by means of FTIR spectroscopy in situ and nitrogen physisorption. The IR spectroscopic results are discussed on the basis of the deposition scheme proposed recently by Kapteijn et al. (J. Catal. 150, 94 (1994). The infrared bands in the high-frequency region (OH stretches) indicate that the aqueous copper species formed in the solutions are deposited on the basic and neutral surface OH groups, while as our previous studies show the aqueous manganese species are deposited on the basic and acidic OH groups. However, the aqueous manganese species are deposited on the basic and neutral OH groups in the presence of copper ions (pH 4.6-4.7). The deposition of the aqueous metal species on the protonated basic OH groups occurs as a result of the "ion-pairing" process. The driving forces resulting in the deposition of the aqueous metal species on the neutral OH groups are considered to be hydrogen bonds. The deposition of the formate ions is also discussed. The higher uptake of copper as compared to manganese is discussed in terms of the metal ion properties (electronic configuration, the ability to form hydrogen bonds of different strength, metal species-support interaction). The nitrogen physisorption shows that the initial mesoporous character of gamma-Al(2)O(3) structure does not change during impregnation. The r(FHH) values which characterized the adsorbent-adsorbate interaction forces are calculated. The comparative analysis of the pore size distribution curves of the oxide-supported samples and their parent formates proves to be a useful tool to elucidate the metal species-support interaction strength. Copyright 2000 Academic Press.     

Formation of Protective Coatings on Graphite by a Microspark Oxidation Method

Models, mechanisms, and criteria of formation of protective coatings on graphite by a microspark oxidation method (MSO) are considered. It is established that a prerequisite for the graphite MSO is the deposition of a barrier film of a valve metal oxide at the graphite surface. Optimum regimes of the graphite MSO in aqueous solutions of sodium aluminate are determined. Protective coatings on graphite comprising α-phase aluminum oxide are obtained. It is concluded that the graphite MSO should be viewed as a version of MSO of metals, which involves the electrochemical deposition (at high voltages that cause the anode to microspark) of oxide films consisting of electrolyte components on graphite, as opposed to a version of MSO of metals, which involves the formation of an anodic film consisting of electrolyte components and the intrinsic oxide.     

Electropolymerization of Pyrrole on Oxidizable Metals: Role of Salicylate Ions in the Anodic Behavior of Copper

The behavior of copper electrodes in aqueous salicylate solutions is studied by cyclic voltammetry. The results suggest that copper undergoes partial anodic passivation through the deposition of a copper(II) salicylate compound. Evidence for the formation of this layer is also given by the data obtained from surface enhanced Raman spectroscopy (SERS). Such a film appears to be responsible for the successful growth of polypyrrole films on copper in salicylate media.     

Stable sensor layers self-assembled onto surfaces using azobenzene-containing polyelectrolytes.

Polyelectrolytes functionalized with photoisomerizable azobenzene chromophores were multi-layered onto inorganic and metal surfaces, by the repeated adsorption from dilute aqueous solution, alternating between oppositely charged polymers. These layer-by-layer ionically self-assembled thin films were investigated for their suitability as sensor host materials with respect to the criteria of control over physical layer properties, versatility to different substrates and adsorption geometries, and stability of the formed layers to heat, solvent, and sonication. Layer thickness was found to be controllable between 5 A and 500 nm by varying the total number of layers deposited, from a single monolayer to 1000 layers. Control over individual layer thickness was achieved by varying the pH of the adsorption solutions. This multi-layer self-assembly was demonstrated to be suitable for a wide range of metal and inorganic substrates, and achievable with surfaces of high curvature (r = 50 nm), and confined geometry. The deposited layers exhibited good stability to desorption in a range of organic solvents, aqueous temperatures to 100 degrees C, and cleaning protocols such as sonication. The laser-induced geometric isomerization of the azobenzene chromophores was shown to be strongly dependent on aqueous solution properties, demonstrating an application as a hydroxide ion sensor in highly alkaline media.     

Sacrificial adhesion promotion layers for copper metallization of device structures

The adhesion of copper films to adjacent device layers including TiN, Ta, and TaN diffusion barriers is a crucial reliability issue for integrated circuits. We report that ultrathin layers of poly(acrylic acid) (PAA) prepared on barrier surfaces or on the native oxide of Si wafers dramatically increase the interfacial adhesion of Cu films deposited by the H2 assisted reduction of bis(2,2,7-trimethyloctane-3,5-dionato)copper in supercritical carbon dioxide. Similar improvements were achieved on Si wafers using a simple vapor phase exposure of the substrate to acrylic acid prior to metallization. The deposited films and the substrate/Cu interfaces were analyzed by X-ray photoelectron spectroscopy (XPS), electron microscopy, atomic force microscopy, and variable-angle spectroscopic ellipsometry. No trace of the adhesion layer was detected at the interface, indicating it was sacrificial at the deposition conditions used. Moreover, the presence and subsequent decomposition of the PAA layer during deposition substantially reduced or eliminated metal oxides at the substrate interface. For depositions on PAA-treated Si wafers, copper was present primarily as Cu0 at the interface and Si was present only as Si0. On PAA-treated Ta substrates, XPS analysis indicated Ta was present primarily as Ta0 at the metallized interface whereas Ta2O5 dominated the interface of samples prepared without the adhesion layers. The technique can be extended to patterned substrates using adsorption of acrylic acid or thermal/UV polymerization of acrylic acid.     

Complexation of copper ions with histidine-containing tripeptides immobilized on solid surfaces

Short oligopeptides that complex with metal ions with high affinity and high specificity are of interest to the design of chemical sensors. In this study, we compare the complexation properties of two copper-selective tripeptides, Gly-Gly-His and His-Gly-Gly, either in aqueous solutions or immobilized on solid surfaces. Our results show that the copper complex formed by Gly-Gly-His is more stable than the complex formed by His-Gly-Gly in aqueous solutions, because the position of histidine (His) in the Gly-Gly-His permits the formation of a tetragonal copper complex with a high stability. However, when the tripeptides are immobilized on aldehyde-decorated silicon wafer surfaces under a reaction condition that gives rise to near maximum surface densities of tripeptides, both immobilized Gly-Gly-His and His-Gly-Gly experience strong steric hindrance on the over-crowded surfaces. The surface crowding effect causes less complexation with copper ions than that in aqueous solutions. To ensure a proper surface density on the surface for complexation with copper ions, a so-called two-dimensional (2D) metal-ion imprinting technique is employed to avoid the surface crowdedness. By immobilizing Gly-Gly-His in the presence of copper ions, we create a tripeptide-functionalized surface that exhibits high complexation capability for copper ions. We attribute the higher copper complexation capability to the proper intermolecular distances obtained from the ion-imprinting procedure that gives the copper-tripeptide complex a preferential tetragonal geometry. Our results show that the amounts of copper complexed to a copper-imprinted surface functionalized with Gly-Gly-His are 62% higher than those of a nonimprinted surface.     

Surface-Grafted Polymer-Assisted Electroless Deposition of Metals for Flexible and Stretchable Electronics

Surface-grafted polymers, that is, ultrathin layers of polymer coating covalently tethered to a surface, can serve as a particularly promising nanoplatform for electroless deposition (ELD) of metal thin films and patterned structures. Such polymers consist of a large number of well-defined binding sites for highly efficient and selective uptake of ELD catalysts. Moreover, the polymer chains provide flexible 3D network structures to trap the electrolessly deposited metal particles, leading to strong metal–substrate adhesion. In the past decade, surface-grafted polymers have been demonstrated as efficient nanoplatforms for fabricating durable and high-performance metal coatings by ELD on plastic substrates for applications in flexible and stretchable electronics. This focus review summarizes these recent advances, with a particular focus on applications in polymeric flexible and stretchable substrates. An outlook on the future challenges and opportunities in this field is given at the end of this paper.     

Microtextured surfaces with gradient wetting properties

Patterned surfaces with microwrinkled surface structures were prepared by thermally evaporating thin aluminum (10-300 nm thick) (Al) layers onto thick prestrained layers of a silicone elastomer and subsequently releasing the strain. This resulted in the formation of sinusoidal periodic surface wrinkles with characteristic wavelengths in the 3-42 μm range and amplitudes as large as 3.6 ± 0.4 μm. The Al thickness dependence of the wrinkle wavelengths and amplitudes was determined for different values of the applied prestrain and compared to a recent large-amplitude deflection theory of wrinkle formation. The results were found to be in good agreement with theory. Samples with spatial gradients in wrinkle wavelength and amplitude were also produced by applying mechanical strain gradients to the silicone elastomer layers prior to deposition of the Al capping layers. Sessile water droplets that were placed on these surfaces were found to have contact angles that were dependent upon their position. Moreover, these samples were shown to direct the motion of small water droplets when the substrates were vibrated.     

Electrochemical Processing of Reaction-bonded Ceramic Composite Coatings

Ceramic matrix composite coatings are currently of much interest for application in high-temperature and highly corrosive environments. Formation of ceramic coatings by electrochemical processing is a relatively new mean^[1-2]. It presents several advantages over alternative coating techniques, the thickness and morphology of the deposit can be controlled by the electrochemical parameters, relatively uniform deposits are obtainable on complex shapes, the deposition rate is higher than that using most other methods and the equipment required is of low cost Recently we developed a novel fabrication technique for the production of ceramic/ceramic and ceramic/metal composite coatings by electrochemical processing^[3]. The technique combined two electrochemical deposition methods, electrophoretic deposition (EPD) and electrolytic deposition (ELD), which can produce uniform composite layers of closely controlled thickness on both metallic and ceramic substrates at ambient temperature with inexpensive equipment. However, the main problem associated with electrochemical processing is the difficulty in sintering of the coatings. First, high temperature is required for sintering of the coatings. Secondly, the volume shrinkage of the coatings during sintering leads to the formation of cracks in coatings bonded to metal substrates. So a reaction forming technique, reaction bonding process, also has been developed to produce near net-shape ceramic coatings, which overcome problems caused by the shrinkage of ceramics during sintering.     

Novel Electroless Deposition of Cu<Subscript>3</Subscript>Se<Subscript>2</Subscript> Film on Silicon Substrate by a Simple Galvanic Displacement Process

A novel electroless deposition method for depositing highly uniform adhesive thin films of copper selenide (Cu₃Se₂) on silicon substrates from aqueous solutions is described. The deposition is carried out by two coupled galvanic reactions in a single deposition bath containing copper cations, hydrogen fluoride, and selenous acid: the galvanic deposition of copper on silicon and the subsequent galvanic reaction between the deposited copper with selenous acid in the deposition bath. The powder X-ray diffraction and scanning electron microscopy are used to characterize and examine the deposited films.     

Total-reflection X-ray fluorescence study of electrochemical deposition of metals on a glass-ceramic carbon electrode surface

The features of electrochemical deposition and co-deposition of copper, cadmium and lead from aqueous solutions on disc glass-ceramic carbon (GCC) electrode surfaces were studied by total-reflection X-ray fluorescence analysis (TXRF). This method was found to be highly sensitive to the varieties of electrodeposit morphology and depth distribution of elements on the electrode surface. It allows identification of the mechanisms of metal nucleation and growth of thin film electrodeposits. The results of the TXRF study are in good agreement with the recent data of a number of spectroscopic and microscopic methods of solid surface analysis. The polished GCC was shown to be an excellent material for preparation of the sample carriers for TXRF analysis.