Ni基带上的氧化物过渡层制备

本文采用溅射沉积方法在双轴织构的Ni—W5％基带上制备了CeO2和Y2O3薄膜．研究表明CeO2薄膜在Ni基带上的外延方式受生长速率、生长温度的控制．在快速沉积情况下，CeO2薄膜为（111）取向，在沉积速率较低时，以（001）取向为主．CeO2薄膜沉积过程中，可以有效避免Ni的氧化．在Y2O3的沉积过程中，Ni基带的氧化不可避免，但其氧化物也有良好的取向．     

沉积在液相基底表面磁性薄膜的形成机理和特性研究

采用气相沉积方法在硅油基底表面成功制备了一种具有近似自由支撑的新型铁薄膜系统，并研究了其生长机制、内应力分布以及低温磁特性．实验发现，此类铁薄膜的生长机制与沉积在液相基底表面非磁性薄膜的情况类似，即服从二阶段生长模型．在固定基底温度的条件下，当沉积速率较小时，可制得近似透明的连续铁薄膜，薄膜中呈现明显的特征尺寸达10^2μm数量级的带状准周期有序结构，它是由铁薄膜样品中内应力释放时所引起的薄膜板块间相互挤压而逐渐形成的．当沉积速率较大时，制得的连续铁薄膜呈金属色．实验发现，在临界温度Tc=10—15K附近，具有金属色的铁薄膜样品的矫顽力Hc有一明显的极大值峰．研究表明，这一奇异的矫顽力特性与液相基底表面铁薄膜中的原子团簇尺寸分布、无序的薄膜表面磁各向异性以及团簇间的磁性相互作用等因素有关．     

热丝法制备纳米晶硅薄膜结构及沉积机制的研究

用热丝法制备了纳米晶硅薄膜．通过Raman散射谱及X射线谱，系统地研究了沉积气压P_g、高H₂稀释及衬底与钨丝之间距离对沉积速率、纳米硅薄膜的形成和结构等的影响．计算了沉积过程中的温度场分布．讨论了沉积过程中反应基元的输运和相关的气相反应，以及H在薄膜生长中的作用，由此分析了沉积参量对薄膜结构的影响，得到了与实验相一致的结果． 关键词：     

磁控反应溅射制备择优取向氮化铝薄膜

以氮气为反应气体，采用磁控反应溅射方法制备了择优取向的氮化铝薄膜．通过XRD测试发现．靶基距、溅射气压影响薄膜的择优取向：大的靶基距及高的溅射气压利于（100）面择优取向，小的靶基距和低的溅射气压利于（002）面择优取向．通过对沉积速率的分析发现．高的沉积速率利于（002）面择优取向，低的沉积速率利于（100）面择优取向．研究结果表明：沉积速率影响了核在衬底表面的生长方向，从而影响了各晶面的生长速度．最终决定薄膜的择优取向．     

微波化学气相沉积中气压对金刚石薄膜生长速率和质量的影响

研究了微波化学气相沉积中沉积气压对金刚石薄膜生长速率和质量的影响.研究表明，金刚石薄膜的生长速率随沉积气压的提高而增大，生长速率与沉积气压为线性关系.在高沉积气压下生长的金刚石薄膜晶形完整，拉曼谱测量可得到锐利的金刚石相的峰，但电压-电流测量表明，随着制备时沉积气压的提高，金刚石薄膜的暗电流增大，膜的电学质量下降. 关键词： 金刚石薄膜 生长速率 沉积气压     

化学浴沉积法制备CdS多晶薄膜

利用化学浴沉积法制备适合于铜铟镓硒薄膜太阳能电池缓冲层材料的CdS多晶薄膜,研究了在不同温度和不同时间下沉积薄膜的性质．薄膜生长开始由ion-by-ion机制控制,随着时间的进行,cluster-by-cluster机制占据主导．薄膜的生长速度随着沉积温度的升高而快速增加,直到达到饱和厚度．并且饱和厚度随温度升高而相应降低．SEM表明随沉积时间增加以及温度升高,薄膜表面形貌从多孔到粗糙的不均匀转变．XRD结果显示,薄膜由立方和六方两相结构组成,控制沉积时间对薄膜的主要晶相结构很关键．所有温度下沉积的CdS     

封面说明

采用气相沉积方法在液相基底表面成功制备了一种具有近似自由支撑的新型铁薄膜系统．该薄膜的生长机制服从所谓的二阶段生长模型：沉积铁原子在液相基底表面首先成核并凝聚成准圆形原子团簇；然后这些原子团簇在液体表面做无规扩散和旋转运动，从而形成分枝状凝聚体(上图)，并随着薄膜名义厚度的增加，分枝状凝聚体逐渐相互连接成网状薄膜，     

用微波ECR等离子体溅射法在蓝宝石(0112)晶面上生长ZnO薄膜的研究

蓝宝石上外延生长ZnO薄膜在表面波和声光器件中有重要的应用．用微波电子回旋共振(ECR)等离子体溅射法在蓝宝石(0112)晶面上外延生长了ZnO薄膜,膜无色透明,并且表面光滑,基片温度为380℃,为探索沉积工艺参数对薄膜结构的影响,用XRD对不同基片温度和沉积速率生长的ZnO薄膜进行了研究．     

用微波ECR等离子体溅射法在蓝宝石(0112)晶面上生长ZnO薄膜的研究

蓝宝石上外延生长ZnO薄膜在表面波和声光器件中有重要的应用．用微波电子回旋共振(ECR)等离子体溅射法在蓝宝石(0112)晶面上外延生长了ZnO薄膜,膜无色透明,并且表面光滑,基片温度为380℃,为探索沉积工艺参数对薄膜结构的影响,用XRD对不同基片温度和沉积速率生长的ZnO薄膜进行了研究．     

沉积工艺对二氧化锆薄膜生长特性影响的研究

利用反应离子束溅射、反应磁控溅射和电子束蒸发在K9基底上沉积ZrO2薄膜，并用原子力显微镜对薄膜表面形貌进行测量。通过数值相关运算，对不同工艺条件下薄膜生长界面进行定量描述，得到了薄膜表面的粗糙度指数、横向相关长度、标准偏差粗糙度等参量。由于沉积条件的不同，薄膜生长具有不同的动力学过程。在反应离子束溅射和反应磁控溅射沉积薄膜过程中，薄膜生长动力学行为均可用Kuramoto-Sivashinsky方程来描述，电子束蒸发制备薄膜的过程可以用Mullins扩散模型来描述，并发现在沉积薄膜过程中基底温度和沉积过程的稳定性对薄膜表面特征影响很大。     

Effect of Al Doping on Properties of SiC Films

Undoped and Al-doped 3C-SiC films are deposited on Si（100） substrates by low-pressure chemical vapour deposition. Effects of aluminium incorporation on crystallinity, strain stress, surface morphology and growth rate of SiC films have been investigated. The x-ray diffraction patterns and rocking curves indicate that the crystallinity is improved with aluminium doping. Raman scatting patterns also demonstrate that the strain stress in SiC films is released due to the incorporation of Al ions and the increase of film thickness. Furthermore, due to the catalysis of surface reaction which is induced by trimethylaluminium, the growth rate is increased greatly and the growth process varies from three-dimensional island-growth mode to step-flow growth mode.     

Si(100)和蓝宝石(0001)衬底上3C-SiC的Raman研究

单晶Si和蓝宝石(0001)是两种重要的3C-SiC异质外延衬底材料，然而，由于Si及蓝宝石和3C-SiC之间大的晶格失配度和热膨胀系数失配度，在3C-SiC中会产生很大的内应力，直接影响3C-SiC的电学特性。Raman散射测试是一个功能很强的测试方法，其强度、宽度、Raman位移等有关Raman参数可以给出有关SiC晶体质量的信息，其中包括内应力。利用背散射几何构置的Raman方法研究了Si(100)和蓝宝石(0001)村底上LPCVD方法生长的SiC外延薄膜，在生长的所有样品中均观察到了典型的3C-SiC的TO和LO声子峰，在3C-SiC／Si材料中，这两个声子峰分别位于970．3cm-l和796．0cm-1，在3C-SiC／蓝宝石材料中，分别位于965．1cm^-1和801．2cm-1，这一结果表明这两种外延材料均为3C-SiC晶型。利用一个3C-SiC自由膜作为无应力标准样品,并根据3C-SiC／Si和3C-SiC／蓝宝石的TO和LO声子峰Raman位移相对于自由膜的移动量，得到3C-SiC中的内应力约分别为1GPa和4GPa。实验发现在这两种材料的TO声子峰的Raman位移移动方向相反，通过比较3C-SiC、Si和蓝宝石的热膨胀系数，预期Si衬底上的3C-SiC外延膜受到的应力为张应力，而蓝宝石衬底上3C-SiC受到的应力则为压应力。     

Comparison of ZnO thin films grown on a polycrystalline 3C-SiC buffer layer by RF magnetron sputtering and a sol-gel method

Zinc oxide (ZnO) thin films were deposited on a polycrystalline (poly) 3C-SiC buffer layer using RF magnetron sputtering and a sol-gel method. The post-deposition annealing was performed on ZnO thin films prepared using both methods. The formation of ZnO piezoelectric thin films with less residual stress was due to a close lattice mismatch of the ZnO and SiC layers as obtained by the sputtering method. Nanocrystalline, porous ZnO film prepared using the sol-gel method showed strong ultraviolet UV emission at a wavelength of 380 nm. The 3C-SiC buffer layer improved the optical and piezoelectric properties of the ZnO film produced by the two deposition methods. Moreover, the different structures of the ZnO films on the 3C-SiC intermediate layer caused by the different deposition techniques were also considered and discussed.     

Spatially resolved Raman spectroscopy evaluation of residual stresses in 3C-SiC layer deposited on Si substrates with different crystallographic orientations

Raman scattering studies were performed on hot-wall chemical vapor deposited (heteroepitaxial) silicon carbide (SiC) films grown on Si substrates with orientations of (1 0 0), (1 1 1), (1 1 0) and (2 1 1), respectively. Raman spectra suggested that good quality cubic SiC single crystals could be obtained on the Si substrate, independent of its crystallographic orientation. Average residual stresses in the epitaxially grown 3C-SiC films were measured with the laser waist focused on the epilayer surface. Tensile and compressive residual stresses were found to be stored within the SiC film and in the Si substrate, respectively. The residual stress exhibited a marked dependence on the orientation of the substrate. The measured stresses were comparable to the thermal stress deduced from elastic deformation theory, which demonstrates that the large lattice mismatch between cubic SiC and Si is effectively relieved by initial carbonization. The confocal configuration of the optical probe enabled a stress evaluation along the cross-section of the sample, which showed maximum tensile stress magnitude at the SiC/Si interface from the SiC side, decreasing away from the interface in varied rate for different crystallographic orientations. Defocusing experiments were used to precisely characterize the geometry of the laser probe in 3C-SiC single crystal. Based on this knowledge, a theoretical convolution of the in-depth stress distribution could be obtained, which showed a satisfactory agreement with stress values obtained by experiments performed on the 3C-SiC surface.     

Si(100)衬底上n-3C-SiC/p-Si异质结构研究

利用LPCVD方法在Si(100)衬底上获得了3C-SiC外延膜,扫描电子显微镜(SEM)研究表明3C-SiC/p-Si界面平整、光滑,无明显的坑洞形成。研究了以In和Al为接触电极的3C-SiC/p-Si异质结的I-V,C-V特性及I-V特性的温度依赖关系,比较了In电极的3C-SiC/p-Si异质结构和以SiGe作为缓冲层的3C-SiC/SiGe/p-Si异质结构的I-V特性,实验发现引入SiGe缓冲层后,器件的反向击穿电压由40V提高到70V以上。室温下Al电极3C-SiC/p-Si二极管的最大反向击穿电压接近100V,品质因子为1.95。     

The influence of ablation products on the ablation resistance of C/C-SiC composites and the growth mechanism of SiO2 nanowires

Ablation under oxyacetylene torch with heat flux of 4186.8(10%kW/m2 for 20 s was performed to evaluate the ablation resistance of C/C-SiC composites fabricated by chemical vapor infiltration（CVI） combined with liquid silicon infiltration（LSI） process.The results indicated that C/C-SiC composites present a better ablation resistance than C/C composites without doped SiC.The doped SiC and the ablation products SiO₂ derived from it play key roles in ablation process.Bulk quantities of SiO₂ nanowires with diameter of 80 nm-150 nm and length of tens microns were observed on the surface of specimens after ablation.The growth mechanism of the SiO₂ nanowires was interpreted with a developed vapor-liquid-solid（VLS） driven by the temperature gradient.     

Al-N共掺杂3C-SiC介电性质的第一性原理计算

采用基于密度泛函理论的第一性原理平面波超软赝势法,建立了未掺杂,Al,N单掺杂和Al-N共掺杂3C-SiC的4种超晶胞模型,并分别对模型进行了几何结构优化,对比研究了其能带结构,态密度分布和介电常数.计算结果表明:Al掺杂会增大SiC的晶格常数,而N对SiC的晶格影响很小.Al掺杂会导致费米能级进入价带,使3C-SiC成为p型半导体,且带隙宽度略为加宽.N掺杂后的SiC其导带和价带均向低能端发生移动,带隙稍有减小.本征3C-SiC几乎不具备微波介电损耗性能.但是可以通过进行Al掺杂或N掺杂加以改善,Al掺杂后的效果尤为突出.计算发现Al-N共掺杂后的3C-SiC材料在8.2—12.4 GHz范围内其微波介电损耗性能急剧下降,与实验结果相符合,并对这一结果进行了讨论分析.     

Effects of carbonization and substrate temperature on the growth of 3C-SiC on Si(1 1 1) by SSMBE

The growth of 3C-SiC on Si(1 1 1) substrate was performed at different carbonization temperatures and substrate temperatures by solid-source molecular beam epitaxy (SSMBE). The properties of SiC film were analyzed with in situ reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The best carbonization temperature of 810 °C was found to be optimal for the surface carbonization. The quality of SiC film grown on Si at substrate temperature of 1000 °C is best. The worse crystalline quality for the sample grown at higher temperature was attributed to the large mismatch of thermal expansion coefficient between SiC and Si which caused more dislocation when sample was cooled down to room temperature from higher substrate temperature. Furthermore, the larger size of single pit and the total area of the pits make the quality of SiC films grown at higher temperature worse. More Si atoms for the sample grown at lower temperature were responsible for the degradation of crystalline quality for the sample grown at lower temperature.     

High-dose carbon implantations into silicon: fundamental studies for new technological tricks

Depending on the implantation temperature, the implantation of carbon ions into silicon at high doses results in the formation of either amorphous SiC_x or crystalline 3C-SiC precipitates. Various aspects of the precipitation behaviour observed, such as the impeded nucleation, the limited growth and the resulting sensitivity to ballistic destruction are attributed to the large interfacial energy between crystalline silicon and 3C-SiC. Periodically arranged amorphous SiC_x nanoclusters, which are formed at lower temperatures, are shown to promote amorphisation by their surrounding stress field and to represent sinks for silicon self-interstitials, which can be activated by annealing at 900 °C. By control of the depth distribution of equally sized, oriented 3C-SiC precipitates formed at higher implantation temperatures, it is possible to establish suitable starting conditions for the formation of buried homogeneous, single-crystalline 3C-SiC layers during a post-implantation anneal. The properties of these ion-beam-synthesised SiC layers are described and attempts to combine them with insulating and metallic layers are reviewed. A survey is given of the emerging applications of ion-beam-synthesised buried SiC layers and microstructures in electronic, optical and micromechanical devices and as large-area SiC pseudosubstrates. Received: 11 November 2002 / Accepted: 12 November 2002 / Published online: 4 April 2003 RID="*" ID="*"Corresponding author. Fax: +49-821/598-3425, E-mail: lindner@physik.uni-augsburg.de     

Synthesis of silicon carbide hexagonal nanoprisms

SiC hexagonal nanoprisms have been prepared by a reaction of multiwall carbon nanotubes and Si vapor in an Astro furnace at 1450 °C for 3 h. The polytype, morphology, crystal structure of the nanoprisms were studied by X-ray powder diffraction, scanning electron microscopy and high resolution transmission electron microscopy, showing their hexagonal nanoprism shapes with a 3C-SiC single crystal structure with a diameter of about 100 nm and 2 μm in length. The photoluminescence spectrum of the nanoprisms exhibits a significant blue-shift relative to bulk 3C-SiC and other nanostructured SiC. The possible growth mechanism that controls the nanostructure formation is also analysed. PACS 42.70.Nq; 68.37.-d; 78.55.-m; 78.67.Bf; 81.07.Vb