具有HfN/HfO2栅结构的p型MOSFET中的负偏置-温度不稳定性研究

研究了HfN/HfO2高K栅结构p型金属-氧化物-半导体(MOS)晶体管(MOSFET)中,负偏置-温度应力引起的阈值电压不稳定性(NBTI)特征.HfN/HfO2高K栅结构的等效氧化层厚度(EOT)为1.3nm,内含原生缺陷密度较低.研究表明,由于所制备的HfN/HfO2高K栅结构具有低的原生缺陷密度,因此在p-MOSFET器件中观察到的NBTI属HfN/HfO2高K栅结构的本征特征,而非工艺缺陷引起的;进一步研究表明,该HfN/HfO2高K栅结构中观察到的NBTI与传统的SiO2基栅介质p-MOSFET器件中观察到的NBTI具有类似的特征,可以被所谓的反应-扩散(R-D)模型表征: HfN/HfO2栅结构p-MOSFET器件的NBTI效应的起源可以归为衬底注入空穴诱导的界面反应机理,即在负偏置和温度应力作用下,从Si衬底注入的空穴诱导了Si衬底界面Si-H键断裂这一化学反应的发生,并由此产生了Si+陷阱在Si衬底界面的积累和H原子在介质层内部的扩散,这种Si+陷阱的界面积累和H原子的扩散导致了器件NBTI效应的发生.     

超深亚微米PMOS器件的NBTI退化机理

对超深亚微米PMOS器件的负栅压温度不稳定性(NBTI)退化机理进行了研究.主要集中在对器件施加NBT和随后的PBT应力后器件阈值电压的漂移上.实验证明反型沟道中空穴在栅氧中的俘获以及氢分子在栅氧中的扩散是引起NBTI退化的主要原因.当应力条件变为PBT时，陷落的空穴可以快速退陷，但只有部分氢分子可以扩散回栅氧与衬底界面钝化硅悬挂键，这就导致了PBT条件下阈值电压只能部分恢复. 关键词： 超深亚微米PMOS器件 负偏压温度不稳定性 界面陷阱 氢气     

超深亚微米PMOSFET的自愈合效应

主要研究负栅压偏置不稳定性(negative bias temperature instability，NBTI)效应中的自愈合效应，研究了器件阈值电压随着恢复时间和应力时间的恢复规律.研究表明器件的退化可以恢复是由于NBTI应力后界面态被氢钝化. 关键词： 负偏置温度不稳定性效应 自愈合效应 应力时间 PMOSFET     

γ射线作用下氧化铪基MOS结构总剂量效应研究

使用原子层淀积方法得到了7.8 nm厚度的HfO₂薄膜并通过直接溅射金属铝电极得到了Al/HfO₂/Si MOS电容结构,测量得到了HfO₂基MOS结构在60Co γ射线辐照前后的电容-电压特性,使用原子力显微镜得到了HfO₂薄膜在辐照前后的表面微观形貌,使用X射线光电子能谱方法测量得到了HfO₂薄膜在辐照前后的化学结构变化。研究发现,使用原子层淀积方法制备的HfO₂薄膜表面质量较高;γ射线辐照在HfO₂栅介质中产生了数量级为1012 cm-2的负的氧化层陷阱电荷;HfO₂薄膜符合化学计量比,介质内部主要的缺陷为氧空位且随着辐照剂量的增加而增加,说明辐照在介质中引入了陷阱从而导致MOS结构性能的退化。     

Sr/Si界面沉积SrTiO3初始生长阶段的扫描遂道显微术研究

本文工作利用脉冲激光沉积术(PLD)和超高真空扫描隧道显微术(UHV-STM),研究了在Sr/Si(001)-(2×1)衬底表面上真空室温沉积几个单层SrTiO₃薄膜的初始生长过程.经660 ℃退火处理后,Sr/Si衬底表面上形成了纳米岛状结构.经分析,这些纳米小岛为C49-TiSi₂和 C54-TiSi₂.实验结果表明,在没有氧气的情况下退火,Sr/Si界面无法有效阻止SrTiO₃薄膜与Si衬底之间的相互作用. 关键词： 脉冲激光沉积术(PLD) 扫描隧道显微镜(STM) 3')" href="#">SrTiO₃ 2')" href="#">C54-TiSi₂     

辐照下背栅偏置对部分耗尽型绝缘层上硅器件背栅效应影响及机理分析

基于部分耗尽型绝缘层上硅（SOI）器件的能带结构,从电荷堆积机理的电场因素入手,为改善辐照条件下背栅Si/SiO₂界面的电场分布,将半导体金属氧化物（MOS）器件和平板电容模型相结合,建立了背栅偏置模型.为验证模型,利用合金烧结法将背栅引出加负偏置,对NMOS和PMOS进行辐照试验,得出:NMOS背栅接负压,可消除背栅效应对器件性能的影响,改善器件的前栅I-V特性;而PMOS背栅接负压,则会使器件的前栅I-V性能恶化.因此,在利用背栅偏置技术改善SOI/NMOS器件性能的同时,也需要考虑背栅偏置对PMOS的影响,折中选取偏置电压.该研究结果为辐照条件下部分耗尽型SOI/MOS器件背栅效应的改善提供了设计加固方案,也为宇航级集成电路设计和制造提供了理论支持.     

Ta和TaN底电极对原子层淀积HfO2介质MIM电性能的影响

以Ta,TaN为衬底,采用原子层淀积方法制备高介电常数HfO₂介质,比较研究了不同衬底电极对金属-绝缘体-金属（MIM）电容的性能影响.结果表明,采用TaN底电极能够获得较高的电容密度和较小的电容电压系数（VCC）,在1MHz下的其电容密度为7.47fF/μm²,VCC为356ppm/V²和493ppm/V,这归因于TaN底电极与HfO₂介质之间良好的界面特性.两种电容在3?V时漏电流为5×10^-8关键词： 高介电常数 MIM电容 2薄膜')" href="#">HfO₂薄膜 电极     

HfO2基铁电薄膜的结构、性能调控及典型器件应用

大数据、物联网和人工智能的快速发展对存储芯片、逻辑芯片和其他电子元器件的性能提出了越来越高的要求.本文介绍了HfO₂基铁电薄膜的铁电性起源,通过掺杂元素改变晶体结构的对称性或引入适量的氧空位来降低相转变的能垒可以增强HfO₂基薄膜的铁电性,在衬底和电极之间引入应力、减小薄膜厚度、构建纳米层结构和降低退火温度等方法也可以稳定铁电相.与钙钛矿氧化物铁电薄膜相比, HfO₂基铁电薄膜具有与现有半导体工艺兼容性更强和在纳米级厚度下铁电性强等优点.铁电存储器件理论上可以达到闪存的存储密度,读写次数超过10¹⁰次,同时具有读写速度快、低操作电压和低功耗等优点.此外,还总结了HfO₂基薄膜在负电容晶体管、铁电隧道结、神经形态计算和反铁电储能等方面的主要研究成果.最后,讨论了HfO₂基铁电薄膜器件当前面临的挑战和未来的机遇.     

Al2O3介质层厚度对AlGaN/GaN金属氧化物半导体-高电子迁移率晶体管性能的影响

在蓝宝石衬底上采用原子层淀积法制作了三种不同Al₂O₃介质层厚度的绝缘栅高电子迁移率晶体管.通过对三种器件的栅电容、栅泄漏电流、输出和转移特性的测试表明：随着Al₂O₃介质层厚度的增加,器件的栅控能力逐渐减弱,但是其栅泄漏电流明显降低,击穿电压相应提高.通过分析认为薄的绝缘层能够提供大的栅电容,因此其阈值电压较小,但是绝缘性能较差,并不能很好地抑制栅电流的泄漏;其次随着介质厚度的增加,可以对栅极施加更高的正偏压,因此获 关键词： 2O₃')" href="#">Al₂O₃ 金属氧化物半导体-高电子迁移率晶体管 介质层厚度 钝化     

工艺偏差下PMOS器件的负偏置温度不稳定效应分布特性

当器件特征尺寸进入纳米级,负偏置温度不稳定性(NBTI)效应和工艺偏差都会导致p型金属氧化层半导体(PMOS)器件性能和可靠性的下降.基于反应-扩散(R-D)模型,本文分析了工艺偏差对NBTI效应的影响;在此基础上将氧化层厚度误差和初始阈值电压误差引入到R-D模型中,提出了在工艺偏差下PMOS器件的NBTI效应统计模型.基于65 nm工艺,首先蒙特卡罗仿真表明在工艺偏差和NBTI效应共同作用下,PMOS器件阈值电压虽然会随着应力时间增大而沿着负方向增加,但是阈值电压的匹配性却随着时间推移而变好;其次验证本文提出的统计模型准确性,以R-D模型为参考,在10~4s应力时间内,PMOS器件阈值电压退化量平均值和均方差的最大相对误差分别为0.058%和0.91%;最后将此模型应用到电流舵型数模转换器中,仿真结果显示在工艺偏差和NBTI效应共同作用下,数模转换器的增益误差会随着应力时间的推移而增大,而线性误差会逐渐减小.     

Interfaces analysis of the HfO2/SiO2/Si structure

The physical and chemical properties of the HfO₂/SiO₂/Si stack have been analyzed using cross-section HR TEM, XPS, IR-spectroscopy and ellipsometry. HfO₂ films were deposited by the MO CVD method using as precursors the tetrakis 2,2,6,6 tetramethyl-3,5 heptanedionate hafnium—Hf(dpm)₄ and dicyclopentadienil-hafnium-bis-diethylamide—Сp₂Hf(N(C₂H₅)₂)₂.The amorphous interface layer (IL) between HfO₂ and silicon native oxide has been observed by the HRTEM method. The interface layer comprises hafnium silicate with a smooth varying of chemical composition through the IL thickness. The interface layer formation occurs both during HfO₂ synthesis, and at the annealing of the HfO₂/SiO₂/Si stack. It was concluded from the XPS, and the IR-spectroscopy that the hafnium silicate formation occurs via a solid-state reaction at the HfO₂/SiO₂ interface, and its chemical structure depends on the thickness of the SiO₂ underlayer.     

Band bending and band alignment at HfO2/HfSixOy/Si interfaces

Band bending and band alignment at HfO₂/SiO₂/Si and HfO₂/Hf/SiO₂/Si interfaces were investigated using X-ray photoelectron spectroscopy. After Hf-metal pre-deposition, a 0.55 eV band bending in Si and a 1.80 eV binding energy decrease for Hf 4f and O 1s of HfO₂ were observed. This was attributed to the introduction of negative space charges at interface by Hf pre-deposition. Band bending decrease and synchronous binding energy increases of O 1s and Hf 4f for HfO₂ were observed during initial Ar⁺ sputtering of the Hf pre-deposited sample. This was interpreted through the neutralization of negative space charges by sputtering-induced oxygen vacancies.     

Low-temperature deposition of stoichiometric HfO2 on silicon: Analysis and quantification of the HfO2/Si interface from electrical and XPS measurements

An understanding of the exact structural makeup of dielectric interface is crucial for development of novel gate materials. In this paper a study of the HfO₂/Si interface created by the low-temperature deposition ultrathin stoichiometric HfO₂ on Si substrates by reactive sputtering is presented. Analysis, quantification and calculation of layer thickness of an HfO₂/Hf-Si-O_x/SiO₂ gate stack dielectrics have been performed, using X-ray photoelectron spectroscopy (XPS) depth profile method, angle resolved XPS and interface modeling by XPS data processing software. The results obtained were found to be in good agreement with the high frequency capacitance-voltage (C-V) measurements. The results suggest a development of a complex three layer dielectric stack, including hafnium dioxide layer, a narrow interface of hafnium silicate and broad region of oxygen diffusion into silicon wafer. The diffusion of oxygen was found particularly detrimental to the electrical properties of the stack, as this oxygen concentration gradient leads to the formation of suboxides of silicon with a lower permittivity, κ.     

Formation of interfacial iron silicides on the oxidized silicon surface during solid-phase epitaxy

The early stages of iron silicide formation in the Fe/SiO _x /Si(100) ternary system during solid-phase epitaxy are studied by high-resolution (～100 meV) photoelectron spectroscopy using synchrotron radiation. The spectra of core and valence electrons taken after a number of isochronous heat treatments of the samples at 750°C are analyzed. It is found that the solid-phase reaction between Fe and Si atoms proceeds in the vicinity of the SiO _x /Si interface, which metal atoms reach when deposited on the sample surface at room temperature. Iron silicide starts forming at 60°C. Solid-phase synthesis is shown to proceed in two stages: the formation of the metastable FeSi interfacial phase with a CsCl-like structure and the formation of the stable β-FeSi₂ phase. During annealing, structural modification of the silicon oxide occurs, which shows up in the growth of the Si⁺⁴ peaks and attenuation of the Si⁺² peaks.     

Characteristics of sandwich-structured Al2O3/HfO2/Al2O3 gate dielectric films on ultra-thin silicon-on-insulator substrates

Sandwich-structure Al₂O₃/HfO₂/Al₂O₃ gate dielectric films were grown on ultra-thin silicon-on-insulator (SOI) substrates by vacuum electron beam evaporation (EB-PVD) method. AFM and TEM observations showed that the films remained amorphous even after post-annealing treatment at 950 °C with smooth surface and clean silicon interface. EDX- and XPS-analysis results revealed no silicate or silicide at the silicon interface. The equivalent oxide thickness was 3 nm and the dielectric constant was around 7.2, as determined by electrical measurements. A fixed charge density of 3 × 10¹⁰ cm⁻² and a leakage current of 5 × 10⁻⁷A/cm² at 2 V gate bias were achieved for Au/gate stack /Si/SiO₂/Si/Au MIS capacitors. Post-annealing treatment was found to effectively reduce trap density, but increase in annealing temperature did not made any significant difference in the electrical performance.     

Origin of HfO2/GaAs interface states and interface passivation: A first principles study

First principles calculations of HfO₂/GaAs interfaces indicate that the interface states originate from the charge mismatch between HfO₂ and GaAs surfaces. We find that a model neutral interface (HfO₂ and GaAs surfaces terminated with two O and one Ga atoms per surface unit cell) removes gap states due to the balance of the interface charge. F and H can neutralize the HfO₂/GaAs interface resulting in useful band offsets, thus becoming possible candidates to passivate the interface states.     

Band structure and valence-band offset of HfO2 thin film on?Si?substrate from photoemission spectroscopy

Synchrotron radiation photoemission spectroscopy and optical transmission spectrum measurements have been performed on an HfO₂ thin film grown on a Si(100) substrate to determine the band structure of the HfO₂/Si stack. The result shows a valence-band offset of 2.5 eV and a conduction-band offset of 2.2 eV for the HfO₂/Si interface. The Schottky barrier height between Au and HfO₂ is obtained from current density–voltage measurement. The characterization reveals that the dominant conduction mechanism in the region of low field under gate injection is Schottky emission. The energy-band diagram of an Au–HfO₂–Si MOS stack was obtained from these results.     

Formation of the buffer layer of silicon suboxides SiOx in the Si/SiO2 low-dimensional heterosystem after Si+ ion implantation: Si L2, 3 X-ray emission spectra

Nanosized heterostructures n-Si/SiO₂ with different thicknesses of the oxide film (20, 500 nm) after implantation by Si⁺ ions with energies of 12 and 150 keV have been investigated using Si L _{2, 3} X-ray emission spectroscopy (the Si 3d3s → Si 2p _{1/2, 3/2} electronic transition). The ion-beam modification of the interface has been revealed and studied for the heterostructure with a silicon dioxide thickness of 20 nm. An analysis of the Si L _{2, 3} X-ray emission spectra has demonstrated that the Si⁺ ion implantation leads to the self-ordering of the structure of the initially amorphous SiO₂ film 20 nm thick due to the effect of high doses. A mechanism of ion-beam modification of the insulator-semiconductor interface has been proposed. No substantial transformation of the atomic and electronic structures of the heterostructure with a silicon dioxide thickness of 500 nm has been revealed after the ion implantation.     

Statistical mechanism of the formation of the energy spectra of sputtered molecular clusters

The energy spectra of Si _n O _m ^? clusters sputtered from Si targets by Xe⁺ ions with O₂ pumping onto a bombarded surface, as well as by O ₂ ⁺ ions, are studied. It is shown that the form of the Si _n O _2n+1 ^? energy distributions does not depend on the experimental conditions. Significant differences in the energy spectra of O and Si monomers as compared to Si _n O _2n+1 ^? clusters are revealed. The mentioned features of the energy distribution of Si _n O _m ^? clusters are explained within the framework of the statistical recombination mechanism of their formation in combinatorial synthesis processes.     

Ta/Ni/Ta multilayered ohmic contacts on n-type SiC

The interface formation, electrical properties and the surface morphology of multilayered Ta/Ni/Ta/SiC contacts were reported in this study. It was found that the conducting behavior of the contacts so fabricated is much dependent on the metal layer thickness and the subsequent annealing temperature. Auger electron spectroscopy (AES) and X-ray diffraction analyses revealed that Ni₂Si and TaC formed as a result of the annealing. The Ni atoms diffused downward to metal/SiC interface and converted into Ni₂Si layer in adjacent to the SiC substrate. The released carbon atoms reacted with Ta atoms to form TaC layer. Ohmic contacts with specific contact resistivity as low as 3 × 10⁻⁴ Ω cm² have been achieved after thermal annealing. The formation of carbon vacancies at the Ni₂Si/SiC interface, probably created by dissociation of SiC and formation of TaC during thermal annealing, should be responsible for the ohmic formation of the annealed Ta/Ni/Ta contacts. The addition of Ta into the Ni metallization scheme to n-SiC restricted the accumulation of carbon atoms left behind during Ni₂Si formation, improving the electrical and microstructure properties.