动态固化聚丙烯/环氧树脂共混物的研究

将动态硫化技术应用于热塑性树脂 热固性树脂体系 ,制备了动态固化聚丙烯 (PP) 环氧树脂共混物 .研究了动态固化PP 环氧树脂共混物中两组分的相容性、力学性能、热性能和动态力学性能 .实验结果表明 ,马来酸酐接枝的聚丙烯 (PP g MAH)作为PP和环氧树脂体系的增容剂 ,使分散相环氧树脂颗粒变细 ,增加了两组分的界面作用力 ,改善了共混物的力学性能 .与PP相比 ,动态固化PP 环氧树脂共混物具有较高的强度和模量 ,含 5 %环氧树脂的共混物拉伸强度和弯曲模量分别提高了 30 %和 5 0 % ,冲击强度增加了 15 % ,但断裂伸长率却明显降低 .继续增加环氧树脂的含量 ,共混物的拉伸强度和弯曲模量增加缓慢 ,冲击强度无明显变化 ,断裂伸长率进一步降低 .动态力学性能分析 (DMTA)表明动态固化PP 环氧树脂共混物是两相结构 ,具有较高的储能模量 (E′)     

NEPE推进剂固化交联的流变学研究

采用动态流变学方法研究了硝酸酯增塑聚醚(NEPE)推进剂的固化历程. 结果表明, 推进剂固化初期(黏流态)的储能模量(G′)和损耗模量(G″)随时间增加缓慢增大, G′gel)缩短, 但推进剂在凝胶点和固化结束时的储能模量G′_gel(622~781 Pa)和G′_∞(831.1×10³~868.3×10³ Pa)的变化不大. 推进剂在固化初期(反应控制阶段)符合一级反应动力学关系, 推进剂的固化过程符合Hsich动力学模型, 由反应速率常数(k_c)、凝胶时间(t_gel)和特征松弛时间(τ)得到推进剂的表观反应活化能ΔE_c, ΔE_g和ΔE_τ分别为129.6, 122.1和120.6 kJ/mol.     

含共引发剂的环氧树脂电子束固化特性

对引发剂组成、含量不同的环氧树脂体系进行了低吸收剂量及高吸收剂量的电子束辐射固化,通过对不同样品辐射过程中的温度特性和辐射后的凝胶含量、内耗tanδ及动态模量变化趋势的研究,得到共引发剂对环氧树脂辐射固化的影响规律.在相同的树脂含量及吸收剂量下,共引发剂的加入可以提高环氧树脂体系的凝胶含量,但其提高幅度并不随着共引发剂含量的增多而增大,而是存在一个最佳值.随着碘盐引发剂含量的增加,共引发剂对体系凝胶含量的提高幅度减小.在辐射过程中,环氧树脂体系的温度会出现一个峰值,共引发剂对峰值温度和辐射后体系的玻璃化转变温度的影响与对凝胶含量的影响类似.碘盐引发剂含量较低时,加入共引发剂的体系的常温及高温模量与未加体系相比没有明显变化;碘盐引发剂含量较高时,加入共引发剂的体系的常温模量比未加体系有所上升,而高温模量则变化不大.     

苯并噁嗪/环氧树脂/4,4′-二氨基二苯砜三元共混体系玻璃化转变温度的研究

采用动态热机械分析(DMA)研究了苯并噁嗪/环氧树脂/4,4′-二氨基二苯砜(DDS)三元共混体系玻璃化转变温度(Tg)与固化剂DDS含量的关系.随着DDS含量的增加,三元体系的交联密度呈现先增加后降低的变化趋势,介于聚苯并噁嗪和苯并噁嗪/环氧树脂体系之间;但是三元体系的Tg却逐渐降低,当DDS的含量超过20 mol%时,低于聚苯并噁嗪的Tg.差示扫描量热法(DSC)的结果表明,DDS对苯并噁嗪和环氧树脂都有很强的固化效果.通过测定体系的凝胶化时间,借助Arrhenius方程,判断三元体系的初始反应过程,推测了固化体系可能的网络化学结构.对各体系DMA曲线中损耗模量,储能模量和力学损耗因子的变化情况分析,结果表明体系最终Tg受氢键相互作用、交联密度和网络规整性以及链段的刚性等因素综合影响,其中氢键的类型和相互作用的强弱对Tg的影响最大.     

电子束辐射固化环氧树脂的动态力学分析——树脂化学结构、分子量及其分布的影响

应用不同化学结构、分子量及其分布的环氧树脂进行了电子束辐射固化实验 ,对固化物进行了动态力学分析 ,研究了不同样品凝胶含量、内耗tanδ及动态模量的变化规律 .分析结果表明环氧树脂辐射反应活性与其化学结构有很大关系 ,酚醛型环氧树脂的辐射反应活性高 ,固化后高温模量及玻璃化温度较高 ,而脂环族环氧树脂反应活性小 .在低辐射剂量下 ,环氧树脂的固化度随分子量增大略有下降 ,但固化物的玻璃化温度随分子量增加而升高 .增大辐射剂量 ,树脂固化度的提高受分子量大小的影响很小 ,分子量较大样品的网络均匀程度有所提高 ,在较高反应程度下 ,玻璃化温度主要受固化度影响 .树脂固化程度也是决定其模量高低的主要因素 ,而在固化程度相近的情况下 ,分子量的影响作用很大 .在同样辐射剂量下 ,分子量分布宽的树脂固化反应程度高 ,但交联网络均匀性低 .     

负载PVDF的尼龙无纺布插层的碳纤维/环氧树脂复合材料的结构阻尼性能研究

以负载定量聚偏二氟乙烯(PVDF)的尼龙无纺布为插层材料,采用共固化工艺制备了碳纤维增强环氧树脂基复合材料,并系统研究了其力学和阻尼性能.测试了复合材料的弯曲强度、弯曲模量、层间剪切强度、Ⅰ型和Ⅱ型断裂韧性等力学性能,并通过动态力学分析仪测试了复合材料的储能模量、损耗模量和损耗因子的温度谱,采用单悬臂梁自由振动实验研究了其阻尼减振性能.与此同时,采用光学显微镜和扫描电镜等分析了复合材料微观结构,进而研究了阻尼机理.结果表明,在复合材料层间插入负载PVDF的尼龙无纺布能在不引起力学性能明显下降的前提下,显著提高复合材料的阻尼性能和断裂韧性.其基本阻尼机理是在共固化过程中热塑性插层材料在复合材料的层间形成了具有较高损耗因子的富树脂区,使损耗因子提高150%,而力学性能基本保持不变.     

聚酯热熔胶增韧环氧树脂

利用扫描电子显微镜研究了聚酯热熔胶PE30增韧环氧树脂的微观相结构;利用DSC、DMA和TGA研究了聚酯热熔胶PE30对环氧树脂耐热性能的影响;测试了环氧树脂的冲击强度、弯曲强度和断裂韧性,考察了聚酯热熔胶PE30对环氧树脂力学性能的影响。结果表明,聚酯热熔胶PE30的最佳质量分数为15%,在固化过程中环氧体系发生诱导相分离,相结构由单相到连续相再到反转相;断裂韧性和冲击强度分别提高了127%和250%;弯曲强度和弯曲模量分别降低27%和44%;而体系玻璃化转变温度与起始热失重温度下降约1.5%,损耗峰温度下降约2.5%,说明聚酯热熔胶PE30可以在很大程度上提高环氧树脂的韧性,同时保持其耐热性能基本不变。     

双组分加成型硅橡胶交联固化过程的流变学研究

采用流变学方法研究了双组分加成型硅橡胶的交联固化过程,并研究了反应温度对反应速率的影响.随着加成反应的进行,体系中的交联程度逐渐增加;反应温度升高,硅橡胶完全交联固化所需时间减少.     

环氧树脂固化过程中的黏弹性分析

环氧树脂在电子线路板、航空工业以及高性能运动器材行业有着广泛的应用,其成型工艺普遍采用反应注射浇铸成型技术,注射温度及时间、保温温度及时间对得到尺寸满意的制品具有重要意义.通过升温测试,获得了树脂黏度和动态模量对温度的演变关系;通过一系列不同温度的保温测试,获得了凝胶化时间对温度的关系.结果表明,可以通过黏弹性能有效示踪固化过程中的结构演变,从而为反应成型加工提供有效、有用的工艺参数.     

环氧树脂电子束固化过程中的电子能量传播机制

将环氧树脂辐射固化过程中的温度分布和辐射固化后的固化度分布与反应前的电子能量沉积模拟计算结果相结合, 探讨电子束在辐射固化过程中的能量传播机制. 结果表明, 辐射开始初期, 固化反应发生前, 电子能量在聚丙烯模具内环氧树脂体系中的沉积满足离子注入理论, 即电子能量沉积在距辐射表面一定距离处达到最大, 然后随辐射距离的增加沉积能量减小; 而在玻璃模具内的树脂体系中, 电子能量从辐射表面向里逐渐降低. 随体系中固化反应的发生, 最大电子浓度区域转移, 最终出现在临近最大电子沉积浓度区域辐射深度稍远的地方. 能量吸收和反应放热导致的升温不影响树脂固化度大小, 但会影响固化度分布.     

Effect of internal mold release agent on flexural and inter laminar shear properties of carbon and glass fabric reinforced thermoset composites

The study is focused on thermoset composites reinforced with carbon and glass woven fabrics. Two types of thermoset resins, for example, epoxy and vinyl ester were used as the matrix. Varying concentrations of internal mold releasing (IMR) agent was used in the resin. The composites were cured both at room temperature and at 80°C. The flexural properties were studied using 3‐point bending test method. Further theinter‐laminar shear strength (ILSS) was investigated using the short beam shear strength test based on 3‐point bending. The flexural modulus of room temperature cured epoxy resin is higher than that of high temperature cured epoxy resin and cured vinyl ester resin. The flexural modulus is lowest for 1% IMR sample in epoxy system and the modulus for 0% and 2% epoxy are not significantly different. Lowest flexural strength and modulus can be observed for the combination of reinforcement and curing conditions for samples containing 1% IMR for the epoxy systems. Carbon fiber is found to be less compatible with the vinyl ester resin system and the addition of IMR to the resin degraded the properties further. Inter‐laminar shear strength for epoxy‐based composites is not much affected by presence of IMR, but in case of vinyl ester based composites there is a decrease in ILSS on addition of IMR agent. The study explains variation in flexural properties on addition of IMR and change of curing conditions. These results can be used for ascertaining variation in mechanical properties in real use.     

用环形剪切方法分析环氧树脂的固化过程

应用动态粘弹谱仪的环形剪切方法，在恒定的温度条件下，对环氧树脂的固化化潜伏期、凝胶化时间和固化过程进行了分析测定。     

Influence of the Curing Temperature in the Mechanical and Thermal Properties of Nanosilica Filled Epoxy Resin Coating

0.5–3 wt% nanosilica was added to an epoxy resin based on diglycidyl ether of bisphenol A (DGEBA) and cured at 25, 40 or 60 °C using isophoronediamine (IPDA) as hardener. Aggregates of nanosilica were properly dispersed into the DGEBA-IPDA resin and agglomerates formation was avoided. Addition of nanosilica increased the storage modulus E′ and the area and height of the tan δ curve of DGEBA-IPDA resin cured at 25 °C, but no significant differences were found by curing at higher temperature. Gel time measurements and the results obtained by applying the Kamal model to isotherm DSC curing of DGEBA-IPDA-nanosilica revealed that nanosilica catalysed the curing reaction between DGEBA and IPDA, in less extent by increasing the curing temperature.     

Mechanism of the tertiary amine-catalyzed dicyandiamide cure of epoxy resins

Infrared and NMR data on tertiary amine-catalyzed, dicyandiamide—epoxy resin (and model compound) systems have been utilized to elucidate the mechanism of the curing process. The early exothermic curing reaction is shown to be ring opening of the resin epoxy groups by dicyandiamide imino and amino anionic species, giving rise to N-alkyl cyanoguanidines; a minor amount of polyether formation also occurs at this time. After the exothermic reaction is essentially complete at <90°C., a slow, high temperature (110–200°C.) addition of hydroxyl hydrogen across the nitrile triple bond occurs, giving rise to an imino ether which then rearranges to the guanyl urea.     

升温与等温法非模型动力学研究环氧树脂固化反应

基于DSC数据,采用以Vyazovkin积分法为基础的升温法非模型动力学和等温法非模型动力学对双酚A型环氧树脂E51/4,4′-二氨基二苯基砜(DDS)体系及多官能度环氧树脂AG80/DDS体系的固化过程进行了研究,并结合玻璃化转变温度的变化和原位红外测试技术,对比分析了升温与等温条件下的固化反应规律.结果表明,与传统的模型拟合法相比,非模型动力学更适合定量预测树脂固化反应过程,并能为固化过程中反应机理变化的研究提供重要依据;等温法非模型动力学能够更好地预测两种树脂体系在不同恒温条件下的固化反应历程,并且升温法与等温法非模型动力学所得到的反应活化能-固化度之间的变化关系不同,表明不同温度条件下树脂的反应机理不同,这与升温和恒温条件下玻璃化效应及环氧官能团的变化规律相吻合.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

Mechanism Studies on Water Sorption and Permeation in Epoxy Resin by Impedance Spectroscopy. II. Cure Kinetics of O-Cresol Novolac Resin with Esterfied Phenol Novolac Resin

Abstract

To study the effect of water affinity of the cured epoxy resin on water sorption and permeation in the cured epoxy resin, a novel hardener (esterfied phenol novolac was synthesized and used for obtaining the cured product without free hydroxyl group. Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FT-IR) were used to study the cure kinetics of o-cresol novolac epoxy resin using esterfied phenol novolac resin as curing agent in the presence of 2-methylimidazole as accelerator. Some kinetic parameters of the curing reaction such as the reaction order, activation energy, and frequency factor were obtained in the temperature range studied. The results show that this curing process is a first-order kinetic mechanism, which was different with that cured with phenol novolac resin.     

Effect of Non-Woven Carbon Nanofiber Mat Presence on Cure Kinetics of Epoxy Nanocomposites

Summary : An investigation was carried out into the cure kinetics of carbon nanofiber (CNF) mat-epoxy nanocomposites, composed of bisphenol-A based epoxy resin and diethylene triamine as a curing agent. It was observed that the rate of cure reaction for CNF mat-epoxy nanocomposites was higher than that for neat epoxy resin at low curing temperatures and the presence of the CNF mat produced the maximum influence at a certain curing temperature and time. At high curing temperature and long curing times, the effect of CNF mat on the cure rate was insignificant. The CNF mat-epoxy composite exhibited somewhat lower value of activation energy than that of the neat epoxy system at the beginning of the curing stage. The weight fraction of CNF mat also affected the cure reaction of epoxy nanocomposites at the same curing temperature. As the amount of CNF mat increased, the cure rate was higher at the same cure time. However, at high CNF mat loading, the cure reaction was retarded since the amount of epoxy and hardener decreased dramatically at high CNF contents together with the hindering effect of the CNF mat on the diffusion of epoxy resin and the curing agent, leading to lower crosslinking efficiency. Although the curing efficiency of epoxy nanocomposites dropped at high CNF mat content, the glass transition temperature (T_g) was still high due to the ultra-high strength of the CNF mat. The cure kinetics of CNF mat-epoxy nanocomposites was in good agreement with Kamal's model.