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1.
Corrosion of iron in slightly acidified sodium sulphate solutions (mainly pH 4.5) in the open air was studied with a rotating disk electrode method at room temperature.Microscopic observations of corroded iron disk surfaces in the pH 4.5 solution revealed that iron initially corrodes locally with the formation of round pits of 10–30 μm in diameter and of(0.6–1.3) × 103 in number per apparent square centimetre followed by the U-shaped brown protective wall formation of precipitates (rust) outside the pits. Each protective wall is formed along the lines of flow of the solution adjacent to the iron surface and each pit is located near the upstream end of the wall. Steady state of corrosion sets in when the parts of surface area surrounded by the wall are completely covered with a microscopically non-porous rust film.The amount of iron in the rust film and the total amount of corrosion of iron including that in the film increase parabolically with the increase in the time of immersion. The amount of iron in the film increases in proportion to the total amount of corrosion independently of the speed of rotation of the disk electrode even in the steady state.The fraction of area of iron surface not covered with the film decreases with time and reaches a certain fixed value in the steady state: the value is smaller at higher rotational speed. The corrosion rate is proportional to the uncovered area, as the corrosion is near the steady state. The pH of the bulk solution increases as corrosion progresses.The corrosion rate of iron can be well interpreted by assuming that the rate is controlled by the diffusion of oxygen from the bulk solution to the surface of iron and that the rust film on iron impedes the diffusion of oxygen.  相似文献   

2.
Effects of 3-amino-1,2,4-triazole (ATA) on the inhibition of copper corrosion in 0.5 M HCl solutions have been studied using gravimetric, electrochemical, and Raman spectroscopy investigations. Weight-loss measurements after varied immersion periods revealed that the dissolution rate of copper decreased to a minimum, while the inhibition efficiency (zeta%) and consequently the degree of surface coverage (theta) increased with the presence of ATA and the increase of its concentration. Potentiodynamic polarization, chronoamperometric, and electrochemical impedance spectroscopy (EIS) measurements after 0, 24, and 48 h immersion of the copper electrode in the test solutions showed that the presence of ATA molecules significantly decreased cathodic, anodic, and corrosion (jcorr) currents and corrosion rates (Rcorr) and greatly increased polarization resistance (Rp), zeta%, and theta; this effect was increased on increasing the ATA content in the solution. Raman spectroscopy confirmed that ATA molecules strongly adsorbed onto the copper surface, blocking its active sites and preventing it from being corroded easily.  相似文献   

3.
弱碱性介质中氯离子对铜电极腐蚀行为的影响   总被引:6,自引:0,他引:6  
应用循环伏安法、X射线光电子能谱法、电化学阻抗谱法以及现场椭圆偏光法研究了在弱碱性介质中添加Cl-对铜电极腐蚀行为的影响.结果表明, Cl-的加入能加剧铜电极的腐蚀,使腐蚀电流以及现场椭圆偏振参数Δ的变化范围都增大1个数量级, Cl-对Cu2O的掺杂将使铜电极的表面膜变得疏松,膜的耐蚀性变差.椭圆偏光实验不仅与电化学和能谱实验的结果一致,而且还能定性地、清楚地分辨出铜电极腐蚀过程中Cu2O的生成、Cl-对Cu2O的掺杂、CuO的生成等不同阶段;同时,利用恰当的模型还能定量地确定各个阶段铜电极表面膜的组成、厚度的变化,从而为研究铜电极的腐蚀与防护机理提供更多有用信息.  相似文献   

4.
中性介质中铜缓蚀剂的成膜过程   总被引:4,自引:0,他引:4  
使用光电化学与电化学石英晶体微天平联用(PECQCM)技术对中性介质铜缓蚀剂成膜过程进行了现场研究.结果表明,在中性Na2SO4溶液中钝化型缓蚀剂Na2OrO4对Cu成膜生长有抛物线规律,而由于Cl-的影响,在中性NaCl溶液中,该缓蚀剂膜生长曲线为折线型.沉淀型缓蚀剂Na2SiO3在Na2SO4溶液中的铜晶振电极上不成膜,而在NaCl溶液中可成膜.  相似文献   

5.
Carboxylic acids and sodium carboxylates are used to protect metals against aqueous and atmospheric corrosion. In this paper, we describe the application of a layer of copper carboxylate on the surface of a copper electrode by means of cyclic voltammetry technique and tests which measure the corresponding resistance to aqueous corrosion. Unlike the soaking process, which also forms a film on the surface, the use of cyclic voltammetry allows one to follow the deposition process of the copper carboxylates onto the electrode. The modified electrodes have been characterised with infrared spectroscopy. In addition, the corrosion resistance of the film has been investigated using polarisation resistance and Tafel plot measurements.  相似文献   

6.
The corrosion behaviour of copper in aerated 3% NaCl solution was investigated by rotating electrode at various rates. The reduction of O2 obeys the Levich equation. The inhibition of the copper corrosion in aerated 3% NaCl solution was studied by using potentiodynamic polarisation and linear polarisation resistance (LRP) in the presence of different concentrations of a bipyrazolic compound named N,N-bis (3-carbomethoxy-5-methylpyrazol-1-ylmethyl) cyclohexylamine (BiPyA). The presence of this compound in the solution decreases the corrosion current density and increases the linear resistance polarisation. The inhibition efficiencies obtained from cathodic Tafel plots and LRP methods are in good agreement. BiPyA compound presents an efficient inhibitor of copper corrosion, acts as a mixed-type inhibitor and adsorbs on the copper surface according to the Langmuir isotherm model.  相似文献   

7.
The anodic corrosion of copper in presence of acetic acid derivatives were determined by measuring the limiting current. It is found that the rate of corrosion increased by decreasing H3PO4 concentration and electrode height. The experimental results showed that the inhibition efficiency increased with increasing concentration of the investigated compounds at a fixed temperature, but decreases with increasing temperature. Values of activation energy indicate that the reaction is diffusion controlled. The isotherm Langmuir, Temkin, and Flory Huggins are applied. The values of free energy of adsorption (ΔGads) obtained indicate the spontaneous adsorption of the inhibitor. The overall mass transfer correlations under the present conditions have been obtained using dimensional analysis method. The results agreed with the previous studies of mass transfer to rotating cylinder in turbulent flow.At the end of the corrosion process the morphology of the specimens after experiment is monitored using scanning electron microscope (SEM). SEM examination of the copper surface revealed that these compounds inhibited copper from corrosion by adsorption on its surface to form protective film. The presence of these organic compounds adsorbed on the electrode surface was confirmed by SEM investigations.  相似文献   

8.
Potentiostatic current oscillations were observed during electrodissolution of a helical coiled copper wire electrode in acidic sodium chloride when nitrogen was sparged through the solution. The oscillations were studied as a function of solution pH, chloride ion concentration and sparging rate over the potential range of 0.2 to 0.7 V versus Ag/AgCl (3 M NaCl). The surface morphology of the copper was observed during the oscillatory process using in situ, real-time optical microscopy, and the formation of a surface film was correlated with the oscillations.  相似文献   

9.
The corrosion inhibition mechanism of cerium hydroxycinnamate compounds has been studied and compared as an effective corrosion inhibitor for steel in an aqueous 0.6?M NaCl solution. Surface analysis results showed that the surface of steel coupons exposed to solutions containing cerium hydroxycinnamate compounds has less signs of corrosion attack due to a formation of the protective film, while the surface of mild steel coupons exposed to 0.6?M chloride solution without inhibitor additions was severely corroded due to pitting. Electrochemical results performed a good inhibition performance and information of the formed protective deposit that hinders the electrochemical corrosion reactions with a dominance of anodic inhibition mechanism. The results also indicated that the addition of cerium hydroxycinnamate compounds to 0.6?M NaCl solution could mitigate electrochemical corrosion reactions, reduce protective and double layer CPE magnitudes, and improve protective and charge transfer resistances. Furthermore, cerium 2-hydroxycinnamate showed better efficient corrosion inhibitor in comparison with cerium 4-hydroxycinnamate for steel in aqueous media containing 0.6?M chloride ion.  相似文献   

10.
The influence of 1H-benzotriazole, 5-methyl-1H-benzotriazole and 5-chloro-1H-benzotriazole on copper corrosion in an acidic sulphate medium was studied, as well as the influence of chloride ions on the corrosion behaviour of copper. The methods used were potentiodynamic measurements, open circuit potential and mass loss. The results show that the examined compounds possess good inhibitory properties in an acidic medium. The potentiodynamic polarisation results indicate that the degree of copper protection against corrosion depends on the concentration of Cl? ions and the concentration of organic compounds. The adsorption of these compounds on the copper surface follows the Langmuir adsorption isotherm.  相似文献   

11.
In this study, 5-naphthylazo-8-hydroxyquinoline (5NA8HQ) was synthesized, characterized, and tested as a corrosion inhibitor for mild steel in 1 M HCl solution in the temperature range 20 to 50 °C. Weight-loss and potentiodynamic polarization measurements were used to analyse the corrosion behaviour of the metal in the absence and presence of different concentrations of the inhibitor. Analyses of surface film and inhibited solutions by FT-IR and UV–visible spectroscopy enabled us to clarify aspects of the inhibition mechanism. Further examination using X-ray diffraction confirmed the action of 5NA8HQ as an effective inhibitor of corrosion of mild steel in acidic media. The results obtained showed that this compound was a good inhibitor of corrosion. The inhibition is of mixed anodic–cathodic nature with predominance of anodic character. The Langmuir isotherm was found to accurately describe the adsorption behaviour of 5NA8HQ. Spectrophotometric analysis showed the formation of a layer at the surface of the corroded sample; this was interpreted as formation of complexes between 5NA8HQ and metal cations present in the steel structure.  相似文献   

12.
The synergistic effect of benzotriazole (BTAH) and molybdate on the inhibition of copper tarnish was studied in this paper. The antitarnish treatment of copper was conducted with BTAH solution containing molybdate. The surface morphology observation and composition analysis were investigated by SEM with energy dispersive X‐ray (EDX) spectroscopy. The addition of molybdate improved the protection of BTAH significantly. The BTAH + molybdate treated copper specimen has higher N concentration in its surface. The structure of the protective film was studied by XPS and AES measurements. It was characterized to be a complex of Cu(I)BTA. The antitarnish effect is certified by the formation of the protective Cu(I)BTA film. Molybdate does not participate in the formation of the protective film. The presence of molybdate promotes the passivation of copper. This facilitates the stabilization of the cuprous oxide film, and strengthens the adsorption of BTAH. Copyright © 2008 John Wiley & Sons, Ltd.  相似文献   

13.
Active corrosion protection based on self-healing of defects in coatings is a vital issue for development of new advanced corrosion protection systems. However, there is a significant lack of experimental protocols, which can be routinely used to reveal the self-healing ability and to study the active corrosion protection properties of organic and hybrid coatings.The present work demonstrates the possibility to use EIS (electrochemical impedance spectroscopy) for investigation of the self-healing properties of protective coatings applied on a metal surface. The model EIS experiments supported by SVET (scanning vibrating electrode technique) measurements show that an increase of low frequency impedance during immersion in the corrosive medium is related to the suppression of active corrosion processes and healing of the corroded areas. Thus, EIS can effectively be employed as a routine method to study the self-repair properties of different protective systems. The 2024 aluminium alloy coated with hybrid sol–gel film was used as a model system to study the healing of artificial defects by an organic inhibitor (8-hydroxyquinoline).  相似文献   

14.
The corrosion process commonly limits the use of copper in practical applications. The use of corrosion inhibitors is one of the effective methods to reduce the corrosion rate of copper. In this research, the inhibition effect of acridine orange (3,6-bis(dimethylamine)acridine) (AcO) for the protection of copper in 0.5 ?M ?H2SO4 solution was studied. For this aim, the change of open circuit potential with exposure time (Eocp-t), electrochemical impedance spectroscopy (EIS), linear polarization resistance (LPR), anodic and cathodic potentiodynamic polarization measurements (PP) and chronoamperometry (CA) techniques were used. Some quantum chemical parameters (EHOMO, ELUMO and dipole moment) were calculated and discussed. The AcO film formed over the copper surface was examined by SEM, EDX, AFM and contact angle measurements. The electrochemical data showed that AcO is an effective corrosion inhibitor even at low concentrations (ranging between 99.1% and %99.4 ?at concentrations from 0.01 ?mM to 1 ?mM). The corrosion rate of copper decreases in the presence of the inhibitor by reducing both anodic and cathodic rates, which is depended on its concentration. This compound behaves as mixed-type corrosion inhibitors with predominantly cathodic type. Its adsorption on the copper surface obeys Langmuir adsorption isotherm. The value of adsorption equilibrium constant (Kads) and the standard free energy of adsorption were ΔGads 1.298 x 103 ?M?1 and -27.71 ?kJ/mol in the case of 0.5 ?M ?H2SO4 solution containing 1.0 ?mM AcO, which shows the adsorption is high and spontaneous. The adsorbed inhibitor film over the metal increase contact angle of the surface, which suggests the more hydrophobic properties of the surface are increasing coming from the orientation of hydrophobic sites to the electrolyte. The zero charge potential (Epzc) studies showed that the surface charge of the metal is positive in the corrosive media containing the inhibitor. Quantum chemical calculations showed that the binding of inhibitor molecules to the metal surface takes place through N atoms of the inhibitor.  相似文献   

15.
Many of the proprietary additive formulations that have been proposed to control the properties of metal electrodeposits include water soluble macromolecules. Among these are the hydrodynamically interesting polyethylene glycols ‘Polyox’. In the course of a rotating disk electrode study of the effects of additives in copper electrodeposition the present authors had cause to try the effects of low concentrations of Polyox in an acid copper sulphate plating solution. In the presence of an essential trace of chloride ion Polyox very strongly inhibited deposition below a critical overpotential at which current density rises extremely rapidly with increasing overpotential. These results suggest that below the critical overpotential chloride ions hold a film of Polyox onto the electrode surface and may also give the film some lateral cohesion. The film may be a Polyox-cuprous chloride complex. Striking spiral patterns form at the critical overpotential. Their characteristics are explained as the consequences of electrodeposition on a surface containing submicroscopic protrusions and depressions in conditions where current density increases very rapidly with potential.  相似文献   

16.
The dependence of the differential capacitance (C) of the electrode double layer of a hanging mercury drop electrode in bis (2-ethylhexyl) sodium sulfosuccinate (AOT) solutions on electrode potential (E) and time is measured using three-dimensional phase sensitive ac voltammetry. This methodology, possessing a very wide time window that permits a detailed study of the adsorption phenomena, is based on the reconstruction of C vs E curves, sampled after many phase-sensitive ac chronoamperometric experiments. The shape of these curves allows an estimation of the structure of the layer of AOT molecules absorbed at the electrode surface. AOT molecules form micelles in bulk solutions and they also associate in the charged interface under the strong influence of the electric field into surface aggregates which depend on their concentration and applied potential. The presence of AOT micelles in the bulk solution can be linked with the appearance of a surface film at potentials more negative than those corresponding to a condensed film linked with a capacitance value slightly higher than that normally attributed to a compact layer. The whole phenomenon is proved to be very dependant upon time.  相似文献   

17.
Nanostructured cobalt (Co) and cobalt-iron (CoFe) alloy coatings were electrodeposited from sulfate solutions in the presence and absence of saccharin. The effects of saccharin on the corrosion behavior of Co and CoFe alloy coatings were investigated using the electrochemical quartz crystal microbalance (EQCM) technique coupled with cyclic voltammetry (CV) measurements. Saccharin was added to the electrolyte as a grain refiner and brightener. Interestingly, opposite corrosion behaviors were found for all nanostructured coatings in 0.1 M H2SO4 and 0.1 M NaOH. The use of saccharin as an additive in the plating solution accelerated the anodic reaction for all deposits in acidic medium. The mass decreases while dissolution rate increased with higher saccharin concentration. Meanwhile, formation of a thick passive film on the Co electrode surface were enhanced while a hindering effect was observed for CoFe alloy coatings deposited in the presence of saccharin in alkaline solution. The anodic and cathodic curves obtained from potentiodynamic polarization experiments were also in agreement with the EQCM results.  相似文献   

18.

Ellipsometry and electrochemical measurements are used to study the adsorption of some substituted 1,2,4-triazoles on copper and their effect on dissolution of copper in aqueous buffer solutions at pH 7.4. It is found that the adsorption of triazole compounds on copper is polymolecular at potential Е = 0.0 V, in relation to a normal hydrogen electrode. The first layer is described by the Temkin equation with free adsorption energy (−ΔGa0) = 55.2–76.3 kJ/mol and an energy heterogeneity factor that varies from 0.91 to 2.5. The maximum value of −ΔGa0 is found for an acid and a hydrogen sulfide corrosion inhibitor that is a mixture of triazole derivatives. The same inhibitor is the one least sensitive to the energy heterogeneity of the surface of a copper electrode, due to its high chemical reactivity and ability to be adsorbed on different active sites. This inhibitor is likely chemisorbed on copper and forms an ultrathin coating in an aqueous solution that is vastly superior to similar coatings produced by the familiar corrosion inhibitors of triazole group compounds in protecting against atmospheric corrosion.

  相似文献   

19.
This investigation potentiodynamically evaluates the corrosion behavior of a high strength titanium alloy, VT-9, in 4 M sulfuric acid solution containing different concentrations (10, 20, 30 ppm) of the organic inhibitor, 2-phenyl-4-[(E)-1-(4-sulfanylanilino)methylidene]-1,3-oxazole-5(4H)-one (L-SH), at different temperatures (293, 303 and 313 ± 1 K). The open circuit potential values noted before and after each experiment varied appreciably with time. These values, in the presence of L-SH, were negative before polarization, but after completion of the experiment turned positive and remained stable over a long period of time. The cathodic current density values increased with increasing cathodic potential (more negative). The corrosion potential (Ecorr) increased remarkably with the addition of L-SH. The corrosion current densities (Icorr), critical current density (Icr), and passive current density (Ip) all decreased when L-SH was used. However, only the decrease in the Icorr with increasing amounts of inhibitor was significant compared to that of Icr and Ip. L-SH expanded the range of the passive potential. SEM micrographs and open circuit potential measurements revealed the formation of a uniform and protective film on the alloy surface in the presence of L-SH, which acted as an efficient inhibitor.  相似文献   

20.
应用循环伏安法和现场椭圆偏光法研究了弱碱性介质中铜的腐蚀、钝化过程,并用二组分有效介质模型对光学实验结果进行了拟合。结果表明金属铜在腐蚀达到稳态时其表面氧化膜具有一定的组成和厚度;反应生成的CuO比Cu2O更为致密,因而对基体具有更好的保护作用;CuO的阴极还原过程可能会涉及到还原中间产物Cu^+的岐化反应,该岐化反应的进行有助于铜耐蚀性的提高;CuO的还原可以在小于-0.45V(vs.SCE)的电位范围内与Cu2O的还原同时进行,椭圆偏光实验不仅与电化学和光电化学实验的结果一致,还能定量地确定膜的厚度、折射率等性质;并根据有效介质模型,可以计算得到不同时刻电极表面膜组成的改变;从而为研究电极反应机理提供新的证据。  相似文献   

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