Novel positive‐working and aqueous‐base‐developable photosensitive poly(imide benzoxazole) precursor

A novel positive‐working and aqueous‐base‐developable photosensitive poly(imide benzoxazole) precursor based on a poly(amic acid hydroxyamide) bearing phenolic hydroxyl groups and carboxylic acid groups, a diazonaphthoquinone (DNQ) photosensitive compound, and a solvent was developed. Poly(amic acid hydroxyamide) was prepared through the polymerization of 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane, trimellitic anhydride chloride, and 4,4′‐oxydibenzoyl chloride. Subsequently, the thermal cyclization of the poly(amic acid hydroxyamide) precursor at 350 °C produced the corresponding poly(imide benzoxazole). The inherent viscosity of the precursor polymer was 0.17 dL/g. The cyclized poly(imide benzoxazole) showed a high glass‐transition temperature of 372 °C and 5% weight loss temperatures of 535 °C in nitrogen and 509 °C in air. The structures of the precursor polymer and the fully cyclized polymer were characterized with Fourier transform infrared and ¹H NMR. The photosensitive polyimide precursor containing 25 wt % DNQ photoactive compound showed a sensitivity of 256 mJ/cm² and a contrast of 1.14 in a 3‐μm film with a 0.6 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from this composition. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5990–5998, 2004     

Three‐component negative‐type photosensitive polyimide precursor based on poly(amic acid), a crosslinker,and a photoacid generator

A new negative‐working and alkaline‐developable photosensitive polyimide precursor based on poly(amic acid) (PAA), 4,4′‐methylenebis[2,6‐bis(hydroxymethyl)]phenol (MBHP) as a crosslinker, and a photoacid generator (5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐2‐(methylphenyl)acetonitrile (PTMA) has been developed. PAA was prepared by ring‐opening polymerization of pyromellitic dianhydride with 4,4′‐oxydianiline. The photosensitive polyimide precursor containing PAA (65 wt %), MBHP (25 wt %), and PTMA (10 wt %) showed a clear negative image featuring 10 μm line and space patterns when it was exposed to 436 nm light at 100 mJ·cm^?2, post‐exposure baked at 130 °C for 3 min, followed by developing with a 2.38 wt % aqueous tetramethylammonium hydroxide solution at 25 °C. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 593–599, 2005     

Low‐CTE photosensitive polyimide based on semialicyclic poly(amic acid) and photobase generator

A negative‐type photosensitive polyimide (PSPI) based on semialicyclic poly(amic acid) (PAA), poly(trans‐1,4‐cyclohexylenediphenylene amic acid), and {[(4,5‐dimethoxy‐2‐nitrobenzyl)oxy]carbonyl} 2,6‐dimethylpiperidine (DNCDP) as a photobase generator has been developed as a next‐generation buffer coat material. The semialicyclic PAA was synthesized from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and trans‐1,4‐cyclohexyldiamine in the presence of acetic acid, and the PAA polymerization solution was directly used for PSPI formulation. This PSPI, consisting of PAA (80 wt %) and DNCDP (20 wt %), showed high sensitivity of 70 mJ/cm² and high contrast of 10.3, when it was exposed to a 365‐nm line (i‐line), postexposure baked at 190 °C for 5 min, and developed with 2.38 wt % tetramethylammonium hydroxide aqueous solution containing 20 wt % isopropanol at 25 °C. A clear negative image of 6‐μm line and space pattern was printed on a film, which was exposed to 500 mJ/cm² of i‐line by a contact printing mode and fully converted to poly(trans‐1,4‐cyclohexylenebiphenylene imide) pattern upon heating at 250 °C for 1 h. The PSPI film had a low coefficient of thermal expansion of 16 ppm/K compared to typical PIs, such as prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and 4,4′‐oxydianiline. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1317–1323, 2010     

Two‐step thermal conversion from poly(amic acid) to polybenzoxazole via polyimide: Their thermal and mechanical properties

Poly(amic acid) was synthesized with a low‐temperature solution polymerization of 3,3′‐dihydroxybenzidine and pyromellitic dianhydride in N,N‐dimethylacetamide. The cast films were thermally treated at various temperatures. The polyimide containing the hydroxyl group was rearranged by decarboxylation, resulting in a fully aromatic polybenzoxazole at temperatures higher than 430 °C. These stepwise cyclizations were monitored with elemental analysis, Fourier transform infrared, and nuclear magnetic resonance. Microanalysis results confirmed the chemical compositions of poly(amic acid), polyimide, and polybenzoxazole, respectively. A cyclodehydration from poly(amic acid) to polyimide occurred between 150 and 250 °C in differential scanning calorimetry, and a cyclodecarboxylation to polybenzoxazole appeared at 400–500 °C. All the samples were stable up to 625 °C in nitrogen and displayed excellent thermal stability. Polybenzoxazole showed better thermal stability than polyimide, but polyimide exhibited better mechanical properties than polybenzoxazole. However, polyimide showed a crystalline pattern under a wide‐angle X‐ray, whereas polybenzoxazole was amorphous. The precursor poly(amic acid) was readily soluble in a variety of solvents, whereas the polyimide and polybenzoxazole were not soluble at all. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2537–2545, 2000     

Novel synthesis of polyimide with pendant 1-phenylethyl ester using DBU and its thermal acid-catalyzed deesterification

A model reaction of o-(N-phenylcarbamoyl)benzoic acid (amic acid) with threefold amounts of 1-phenylethyl bromide (PEB) and 1,8-diazabicyclo-[5,4,0]-7-undecene (DBU) was carried out in NMP. The reaction gave N-[m-(1-phenylethoxycarbonyl)phenyl]phthalimide in almost quantitative yield at room temperature for 2 h. Polyimide containing pendant 1-phenylethyl ester (P-1a) was also prepared from polyamic acid with PEB using DBU according to the model reaction. The obtained polymer was exactly consistent with P-1a synthesized stepwise from the esterification of the corresponding polyimide containing pendant carboxylic acid with PEB. Therefore, the reaction of polyamic acid bearing pendant carboxylic acid with alkyl bromide proceeded quantitatively to give polyimide containing pendant ester in the presence of DBU. Also, this method was applied to the synthesis of polyimide containing 1-phenylethyl ether. However, the polyimide with quantitative etherification was not synthesized. The acid-catalyzed deesterification of P-1a film was carried out by heating the irradiated polymer film containing 10 wt % of p-nitrobenzyl 9,10-diethoxyanthracene-2-sulfonate, which produced sulfonic acid by irradiation, at various temperatures. Although thermal deesterification of P-1a started at 220°C without any acid catalyst, the deesterification occurred when the irradiated film was heated at the lower temperature. The degree of esterification can be determined from the disappearance of absorption at 700 cm⁻¹. The deesterification obeyed first-order kinetics. © 1996 John Wiley & Sons, Inc.     

Two‐sided comb poly(amic ester)–poly(propylene oxide) graft copolymers as porous polyimide precursors

New step‐growth graft block copolymers were synthesized. These two‐sided comb copolymers consisted of a poly(amic ester) (PAE) backbone and pendant poly(propylene oxide) (PPO) grafts. The copolymers were made via a macromonomer approach, in which the 4,6‐bischlorocarbonyl isophthalic acid bis[poly(propylene oxide)] ester macromonomer was synthesized through the reaction of hydroxyl‐terminated PPO oligomers with pyromellitic dianhydride and oxalyl chloride. This macromonomer was subsequently used in step‐growth polymerization with comonomers 4,6‐bischlorocarbonyl isophthalic acid diethyl ester, 2,5‐bischlorocarbonyl terephthalic acid diethyl ester, and 2,2‐bis[4‐ (4‐aminophenoxy)phenyl] hexafluoropropane, and this yielded PPO‐co‐PAE graft copolymers. Accordingly, we report the synthesis and characterization of the PPO oligomer, the PPO macromonomer, and their corresponding PPO‐co‐PAE graft copolymers. Graft copolymers with PPO concentrations of 3–26 wt % were synthesized. These polymers were thermally cured to produce polyimide/PPO composites. The thermolysis of these polyimide/PPO composites yielded porous polyimide films with porosities ranging of 4–22.5%. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2266–2275, 2005     

Preparation and characterization of a polyimide nanofoam through grafting of labile poly(propylene glycol) oligomer

Preparation of a polyimide nanofoam (PI‐F) for microelectronic applications was carried out using a polyimide precursor synthesized from poly[(amic acid)‐co‐(amic ester)] and grafted with a labile poly(propylene glycol) (PPG) oligomer. Polyimide precursor was synthesized by partial esterification of poly(amic acid) (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA). The precursor was then grafted with bromide‐terminated poly(propylene glycol) in the presence of K₂CO₃ in hexamethylphosphoramide and N‐methylpyrrolidone, imidized at 200°C in nitrogen and the product was subsequently decomposed in air at 300°C to eliminate the labile PPG oligomer to produce PMDA/ODA polyimide nanofoam. Nuclear magnetic resonance spectroscopy (¹H‐NMR) and Fourier transform infrared spectroscopy (FT‐IR) techniques were used to characterize the formation of polyimide precursor and extent of grafting of PPG with polyimide. The results of thermogravimetric analysis (TGA) showed three step decomposition of nanofoam with the removal of PPG at 350°C and decomposition of polyimide at around 600°C. The polyimide nanofoams were also characterized by small angle X‐ray scattering (SAXS), field‐emission scanning electron microscopy (FE‐SEM) and transmission electron microscopy (TEM). The morphology showed nanophase‐separated structures with uniformly distributed and non‐interconnected pores of 20–40 nm in size. Dynamic mechanical analysis (DMA) indicated higher storage modulus for the foamed structure compared to the pure PI with reduction in loss tangent for the former system. Copyright © 2004 John Wiley & Sons, Ltd.     

Synthesis and properties of poly(amic acid)s and polyimides based on 2,2′,6,6′‐biphenyltetracarboxylic dianhydride

Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2′,6,6′‐biphenyltetracarboxylic dianhydride (2,2′,6,6′‐BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2′,6,6′‐BPDA and 4,4′‐(1,3‐phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass‐transition temperatures (T_g)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385–6393, 2006     

Synthesis and characterization of soluble polyimides derived from 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride

A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004     

Synthesis and characterization of novel photosensitive polyimide based on 5‐(2,5‐dioxotetrahydrofuryl)‐3‐methyl‐3‐cyclohexene‐1,2‐dicarboxylic anhydride

A negative type photosensitive polyimide with alicyclic moiety (NPI) was synthesized from 5‐(2,5‐dioxotetrahydrofuryl)‐3‐methyl‐3‐cyclohexene‐1,2‐dicarboxylic anhydride and 4,4‐diaminobenzophenone by one‐step polymerization in m‐cresol. Properties of the polyimides were characterized and a photo‐crosslinking mechanism was investigated using DEPT ¹³C‐NMR and FT‐IR spectroscopy. The negative polyimide showed good photosensitivity on exposure to UV light from a mercury xenon lamp. The polyimide showed remarkable solubility difference after photo‐ irradiation with an exposure dose of 500 mJ/cm². The resulting negative pattern of the photo‐cured NPI exhibited 10 μm resolution. Glass transition temperature of the photo‐crosslinked polyimide was about 307°C, which increased by 10°C compared to that of the polyimide before UV exposure. Transmittance of NPI after photo‐irradiation was about 87% at 500 nm. Copyright © 2004 John Wiley & Sons, Ltd.     

Synthesis and properties of new aromatic polyimides based on 2,5‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐tert‐butylbenzene and various aromatic dianhydrides

A novel, fluorinated diamine monomer, 2,5‐bis(4‐amino‐2‐ trifluoromethylphenoxy)‐tert‐butylbenzene ( II ) was synthesized through the nucleophilic substitution reaction of tert‐butylhydroquinone (t‐BHQ) and 2‐chloro‐5‐nitrobenzotrifluoride in the presence of potassium carbonate to yield the intermediate dinitro compound I , followed by catalytic reduction with hydrazine and Pd/C to afford diamine II . A series of fluorinated polyimides V were prepared from II with various aromatic dianhydrides ( III _a–f ) via the thermal imidization of poly(amic acid). Most of V _a–f could be soluble in amide‐type solvents and even in less polar solvents. These polyimide films showed tensile strengths up to 106 MPa, elongation at break up to 21%, and initial modulus up to 2.1 GPa. The glass‐transition temperature of V was recorded at 245–304 °C, the 10% weight loss temperatures were above 488 °C, and left more than 41% residue even at 800 °C in nitrogen. Low dielectric constants, low moisture absorptions, and higher and light‐colored transmittances were also observed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5424–5438, 2004     

Synthesis and properties of ortho‐linked aromatic polyimides based on 1,2‐bis(4‐aminophenoxy)‐4‐tert‐butylbenzene

A bis(ether amine) containing the ortho‐substituted phenylene unit and pendant tert‐butyl group, 1,2‐bis(4‐aminophenoxy)‐4‐tert‐butylbenzene, was synthesized and used as a monomer to prepare polyimides with six commercial dianhydrides via a conventional two‐stage procedure. The intermediate poly(amic acid)s had inherent viscosities of 0.78–1.44 dL/g, and most of them could be thermally converted into transparent, flexible, and tough polyimide films. The inherent viscosities of the resulting polyimides were in the range of 0.46–0.87 dL/g. All polyimides were noncrystalline, and most of them showed excellent solubility in polar organic solvents. The glass‐transition temperatures of these polyimides were in the range of 222–259 °C in differential scanning calorimetry and 212–282 °C in thermomechanicl analysis. These polyimides showed no appreciable decomposition up to 500 °C in thermogravimetric analysis in air or nitrogen. A comparative study of the properties with the corresponding polyimides without pendant tert‐butyl groups derived from 1,2‐bis(4‐aminophenoxy)benzene is also presented. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1551–1559, 2000     

Synthesis and properties of new hydroxyl‐pendant aromatic polyimides derived from trimethylsilylated 4,4′‐diamino‐3,3′‐dihydroxybiphenyl and aromatic tetracarboxylic dianhydrides

New phenolic hydroxyl‐pendant aromatic polyimides were synthesized with the N‐silylated diamine method in two steps: the ring‐opening polyaddition of tetrakis(trimethylsilyl)‐substituted 4,4′‐diamino‐3,3′‐dihydroxybiphenyl to various aromatic tetracarboxylic dianhydrides, giving trimethylsiloxy‐pendant poly(amic acid) trimethylsilyl esters, and thermal imidization. The hydroxyl‐bearing polyimides were amorphous but insoluble in organic solvents. They had glass‐transition temperatures greater than 370 °C and temperatures of 10% weight loss greater than 415 °C in nitrogen. The hydroxyl‐pendant polypyromellitimide film had a high tensile strength and a high modulus of 310 MPa and 10 GPa, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1790–1795, 2002     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.     

Direct patterning of poly(amic acid) and low‐temperature imidization using a crosslinker,a photoacid generator,and a thermobase generator

A positive‐type photosensitive polyimide (PSPI) based on poly(amic acid) (PAA), a crosslinker 1,1,1‐tris{4‐[2‐(vinyloxy)ethoxy]phenyl}ethane (TVPE), a photoacid generator (PAG) (5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐2‐(methylphenyl)acetonitrile (PTMA), and a thermobase generator (TBG) t‐butyl 2,6‐dimethylpiperidine‐1‐carboxylate (BDPC) has been developed as a promising material in microelectronics. The PAA was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐oxydianiline (ODA) in dimethyl sulfoxide (DMSO). The PSPI, consisting of PAA (69 wt %), TPVE (21 wt %), PTMA (3 wt %), and BDPC (7 wt %), showed high sensitivity of 21 mJ/cm² and a high contrast of 6.8 when it was exposed to a 436‐nm line (g‐line), postbaked at 90 °C for 5 min, and developed with 1.69 wt % TMAHaq. A clear positive image of 8 μm line and space pattern was printed on film, which was exposed to 50 mJ/cm² of g‐line by a contact printing mode and fully converted to the corresponding polyimide (PI) pattern on heating at 200 °C, confirmed by FTIR spectroscopy. Thus, this system will be a good candidate for next generation PSPIs. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3362–3369, 2009     

The effect of film thickness on the depth‐wise chain orientation of rod‐shaped polyimide

Controlling the chain orientation of polyimide is important because it affects the physical and electrical properties of the film. When a polyimide film is thick, the chain orientation has an inhomogeneous distribution along the thickness direction. In this study, poly(amic acids), the precursor of polyimide, with different coating thicknesses are dried, and the distribution of chain orientation in the thickness direction is investigated by measuring the residual solvent content with Raman spectroscopy. The effect of film thickness on the imidization rate is also studied by measuring the depth‐wise degree of imidization at the curing step. With the final cured polyimide film, the depth‐wise chain orientation is quantified by introducing the Fraser distribution function using polarized Raman spectroscopy. The thicker film has a lower degree of in‐plane orientation of polyimide chains, particularly near the substrate. This distribution of polyimide chain orientation in the thickness direction is similar to that of poly(amic acid) after drying. Fast imidization with higher solvent content for thick polyimide retards the formation of a well‐ordered structure with a high degree of in‐plane orientation. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 848–857     

Synthesis of autophotosensitive hyperbranched polyimides based on 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride and 1,3,5‐tris(4‐aminophenoxy)benzene via end capping of the terminal anhydride groups by ortho‐alkyl aniline

Benzophenone‐containing, anhydride‐terminated hyperbranched poly(amic acid)s were end‐capped by ortho‐alkyl aniline in situ and then chemically imidized, yielding autophotosensitive hyperbranched polyimides. The polyimides were soluble in strong polar solvents, such as N‐methyl‐2‐pyrrolidone, N‐dimethylformamide, dimethylacetamide, and dimethyl sulfoxide. Thermogravimetric analysis revealed their excellent thermal stability, with a 5 wt % thermal loss temperature in the range of 527–548 °C and a10 wt % thermal loss temperature in the range of 562–583 °C. The strong absorption of the polyimide films in ultraviolet–visible spectra at 365 nm indicated that the hyperbranched polyimides were patternable. Highly resolved images with a line width of 6 μm were developed by ultraviolet exposure of the polymer films. A well‐defined image with lines as thin as 3 μm was also patterned, but the lines were rounded at the edges. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2026–2035, 2003     

Preparation of a chemically amplified photosensitive polyimide based on norbornene‐end‐capped poly(amic acid ethoxymethylester)

A positive‐working chemically amplified photosensitive polyimide (PSPI) developable with basic aqueous solutions was obtained from poly(amic acid ethoxymethylester) (PAAE) as a polyimide precursor and diphenyliodonium 5‐hydroxynaphthalene‐1‐sulfonate (DINS) as a photoacid generator. The norbornene‐end‐capped PAAE based on 4,4′‐oxydiphthalic anhydride and 4,4′‐oxydianiline exhibited high transparency at 365 nm. The protection ratio of the ethoxymethyl groups was optimized to maximize the difference between the dissolution rates of the exposed and unexposed areas. The acid generated from DINS in the UV‐exposed region effectively deprotected the ethoxymethyl groups of PAAE by a chemical amplification mechanism. A 10‐μm‐thick film of the PSPI precursor system containing 16 wt % DINS exhibited a sensitivity (D^o) of 1100 mJ cm^?2 when developed with a 2.38 wt % aqueous tetramethyl ammonium hydroxide solution at room temperature. A fine, positive, 5‐μm line‐and‐space pattern was fabricated in a 15‐μm‐thick film with 1500 mJ cm^?2 of UV exposure. This resolution is excellent in comparison with those previously reported for chemically amplified PSPIs, and such a film can thus be used as a buffer coating in semiconductor packaging. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5520–5528, 2005     

Characterization of a thermally imidized soluble polyimide film

A soluble aromatic poly (amic acid) film was converted to a soluble polyimide by staging at 25°C intervals to 325°C and characterized at each interval by several analytical methods. The behavior observed was consistent with an interpretation that a reduction occurred in molecular weight of the poly (amic acid) during the initial stages of cure before the ultimate molecular weight was achieved as a polyimide. This interpretation was supported by the results of solution viscosity, gel permeation chromatography, low angle laser light scattering photometry, and infrared spectroscopy analyses. The results of this study serve to increase our fundamental understanding of how polyimides are thermally formed from poly (amic acid)s.     

Synthesis and characterization of new fluorene‐based poly(ether imide)s

A novel bis(ether anhydride) monomer, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride (4), was synthesized from the nitrodisplacement of 4‐nitrophthalonitrile by the bisphenoxide ion of 9,9‐bis(4‐hydroxyphenyl)fluorene (1), followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetracarboxylic acid. A series of poly(ether imide)s bearing the fluorenylidene group were prepared from the bis(ether anhydride) 4 with various aromatic diamines 5a–i via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s 6a–i followed by thermal cyclodehydration to the polyimides 7a–i. The intermediate poly(amic acid)s had inherent viscosities in the range of 0.39–1.57 dL/g and afforded flexible and tough films by solution‐casting. Except for those derived from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all other poly(amic acid) films could be thermally transformed into flexible and tough polyimide films. The glass transition temperatures (T_g) of these poly(ether imide)s were recorded between 238–306°C with the help of differential scanning calorimetry (DSC), and the softening temperatures (T_s) determined by thermomechanical analysis (TMA) stayed in the range of 231–301°C. Decomposition temperatures for 10% weight loss all occurred above 540°C in an air or a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1403–1412, 1999