Influence of crystalline volume fraction on the performance of high mobility microcrystalline silicon thin-film transistors

The influence of the crystalline volume fraction of hydrogenated microcrystalline silicon on the device performance of thin-film transistors fabricated at temperatures below 200 °C was investigated. Transistors employing microcrystalline silicon channel material prepared close to the transition to amorphous growth regime exhibit the highest charge carrier mobilities exceeding 50 cm²/V s. The device parameters like the charge carrier mobility, the threshold voltage and the subthreshold slope will be discussed with respect to the crystalline volume fraction of the intrinsic microcrystalline silicon material.     

Preparation of microcrystalline silicon solar cells on microcrystalline silicon carbide window layers grown with HWCVD at low temperature

N-type microcrystalline silicon carbide layers prepared by hot-wire chemical vapor deposition were used as window layers for microcrystalline silicon n–i–p solar cells. The microcrystalline silicon intrinsic and p-layers of the solar cells were prepared with plasma-enhanced chemical vapor deposition at a very high frequency. Amorphous silicon incubation layers were observed at the initial stages of the growth of the microcrystalline silicon intrinsic layer under conditions close to the transition from microcrystalline to amorphous silicon growth. ‘Seed layers’ were developed to improve the nucleation and growth of microcrystalline silicon on the microcrystalline silicon carbide layers. Raman scattering measurement demonstrates that an incorporation of a ‘seed layer’ can drastically increase the crystalline volume fraction of the total absorber layer. Accordingly, the solar cell performance is improved. The correlation between the cell performance and the structural property of the absorber layer is discussed. By optimizing the deposition process, a high short-circuit current density of 26.7 mA/cm² was achieved with an absorber layer thickness of 1 μm, which led to a cell efficiency of 9.2%.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

Voids in hydrogenated amorphous silicon materials

Effusion measurements of hydrogen and of implanted helium are used to characterize the presence of voids in hydrogenated amorphous silicon (a-Si:H) materials as a function of substrate temperature, hydrogen content, etc. For undoped plasma-grown a-Si:H, interconnected voids are found to prevail at hydrogen concentrations exceeding 15–20 at.%, while isolated voids which act as helium traps appear at hydrogen concentrations ≤ 15 at.%. The concentration of such isolated voids is estimated to some 10¹⁸/cm³ for device-grade undoped a-Si:H deposited at a substrate temperature near 200 °C. Higher values are found for, e.g., doped material, hot wire grown a-Si:H and hydrogen-implanted crystalline Si. The results do not support recent suggestions of predominant incorporation of hydrogen in a-Si:H in (crystalline silicon type) divacancies, since such models predict a concentration of voids (which act as helium traps) in the range of 10²¹/cm³ and a correlation between void and hydrogen concentrations which is not observed.     

Silicon nanowire solar cells grown by PECVD

Silicon nanowires offer an opportunity to improve light trapping in low-cost silicon photovoltaic cells. We have grown radial junctions of hydrogenated amorphous silicon over p-doped crystalline silicon nanowires in a single pump-down plasma enhanced chemical vapor deposition process on glass substrates. By using Sn catalysts and boosting p-type doping in the nanowires, the open-circuit voltage of the devices increased from 200 to 800 mV. Light trapping was optimized by extending the length of nanowires in these devices from 1 to 3 μm, producing currents in excess of – 13 mA cm^? 2 and energy conversion efficiencies of 5.6%. The advantages of using thinner window layers to increase blue spectral response were also assessed.     

Back contacted a-Si:H/c-Si heterostructure solar cells

This paper shows how the amorphous/crystalline silicon technology can be implemented in the interdigitated back contact solar cell design. We have fabricated rear-junction, backside contact cells in which both the emitter and the back contact are formed by amorphous/crystalline silicon heterostructure, and the grid-less textured front surface is passivated by a double layer of amorphous silicon and silicon nitride, which also provides an anti-reflection coating. The entire self-aligned mask and photolithography-free process is performed at temperature below 300 °C with the aid of one metallic mask to create the interdigitated pattern. An open circuit voltage of 687 mV has been measured on a 0.5 Ωcm p-type monocrystalline silicon wafer. On the other hand, several technological aspects that limit the fill factor (50%) and the short circuit current density (32 mA/cm²) still need improvement. We show that the uniformity of the deposited amorphous silicon layers is not influenced by the mask-assisted deposition process and that the alignment is feasible. Moreover, this paper investigates the photocurrent limiting factors by one-dimensional modeling and quantum efficiency measurements.     

Infrared semiconductor laser irradiation used for crystallization of silicon thin films

We report the rapid thermal crystallization of silicon films using infrared semiconductor laser. Carbon films were used on silicon films to absorb the laser light. Uniform crystalline regions were achieved by a line shape laser beam with a length of 20 μm. Polycrystalline silicon thin film transistors were fabricated in crystallized regions. The effective electron carrier mobility and threshold voltage were achieved to be 130 cm²/Vs and 0.4 V, respectively, when the crystalline volume ratio of the silicon films was 0.95.     

Excimer laser crystallization of microcrystalline silicon for TFTs on flexible substrate

Microcrystalline silicon (μc-Si) films have been deposited on PDMS as well as on PEN substrate. Excimer laser annealing was used to improve the crystalline structure and so to obtain high mobility TFTs. The effect of the laser annealing on the crystalline structure of silicon films is studied using different characterization techniques and discussed. Mobility values of 60 cm²/V s with PDMS and 46 cm²/V s with PEN are obtained.     

Spectroscopic ellipsometry study of nickel induced crystallization of a-Si

The aim of this work is to present a spectroscopic ellipsometry study focused on the annealing time effect on nickel metal induced crystallization of amorphous silicon thin films. For this purpose silicon layers with 80 and 125 nm were used on the top of which a 0.5 nm Ni thick layer was deposited. The ellipsometry simulation using a Bruggemann Effective Medium Approximation shows that films with 80 nm reach a crystalline fraction of 72% after 1 h annealing, appearing to be full crystallized after 2 h. No significant structural improvement is detected for longer annealing times. On the 125 nm samples the crystalline volume fraction after 1 h is only around 7%, requiring 5 h to get a similar crystalline fraction than the one achieved with the thinner film. This means that the time required for full crystallization will be strongly determined by the Si layer thickness. Using a new fitting approach the Ni content within the films was also determined by SE and related to the silicon film thickness.     

Effect of P incorporation on aggregation of nanocrystallites in amorphous and nanocrystalline mixed-phase silicon thin films

We report the effects of P incorporation on the nanometer-scale structural and electrical properties of amorphous and nanocrystalline mixed-phase Si:H films. In the intrinsic and weakly P-doped (3 × 10¹⁸ at/cm³) films, the nanocrystallites aggregate to cone-shaped structures. Conductive atomic force microscopy images showed high current flows through the nanocrystalline cones and a distinct two-phase structure in the micrometer range. Adding PH₃ into the processing gas moved the amorphous/nanocrystalline transition to a higher hydrogen dilution ratio required for achieving a similar Raman crystallinity. In a heavily P-doped (2 × 10²¹ at/cm³) film, the nanocrystalline aggregation disappeared, where isolated grains of nanometer sizes were distributed throughout the amorphous matrix. The heavily doped mixed-phase film with 5–10% crystal volume fraction showed a dramatic increase in conductivity. We offer an explanation for the nanocrystalline cone formation based on atomic hydrogen enhanced surface diffusion model, and propose that the coverage of P-related radicals on the existing nanocrystalline surface during film growth and the P segregation in grain boundaries are responsible for preventing new nucleation on the surface of the existing nanocrystallites, resulting in nanocrystallites dispersed throughout the amorphous matrix.     

Microstructures of high-growth-rate (up to 8.3 nm/s) microcrystalline silicon photovoltaic layers and their influence on the photovoltaic performance of thin-film solar cells

Microstructures of microcrystalline silicon (μc-Si) deposited at a high-growth-rate have been investigated in order to apply to the photovoltaic i-layer. μc-Si films were prepared by very-high-frequency (100 MHz) plasma-enhanced chemical vapor deposition at 180 °C. High growth rates of 3.3–8.3 nm/s have been achieved utilizing high deposition pressures up to 24 Torr and large input powers. Applying μc-Si to n–i–p junction solar cells, as the optimum result in this experimental series, a conversion efficiency of 6.30% (J_SC: 22.1 mA/cm², V_OC: 0.470 V, and FF: 60.7%) has been achieved employing the i-layer deposited at 8.1 nm/s. Raman scattering and X-ray diffraction measurements revealed the crystalline volume fraction of around 50% with the (2 2 0) crystallographic preferential orientation, respectively. The cross-sectional transmission electron microscope image shows densely columnar structure grown directly on the underlying n-layer. These structural features are basically in good agreement those of low-growth-rate μc-Si used for a high efficiency solar cell as previously reported, implying advantages of the use of high pressures with regard to providing the photovoltaic i-layers. Finally, the implication is discussed from the photovoltaic performance as a function of the crystalline volume fraction of i-layer, and current problems in improving the photovoltaic performance are extracted.     

Improving the performance of amorphous and crystalline silicon heterojunction solar cells by monitoring surface passivation

The influence of thermal annealing on the crystalline silicon surface passivating properties of selected amorphous silicon containing layer stacks (including intrinsic and doped films), as well as the correlation with silicon heterojunction solar cell performance has been investigated. All samples have been isochronally annealed for 1 h in an N₂ ambient at temperatures between 150 °C and 300 °C in incremental steps of 15 °C. For intrinsic films and intrinsic/n-type stacks, an improvement in passivation quality is observed up to 255 °C and 270 °C, respectively, and a deterioration at higher temperatures. For intrinsic/n-type a-Si:H layer stacks, a maximum minority carrier lifetime of 13.3 ms at an injection level of 10¹⁵ cm^? 3 has been measured. In contrast, for intrinsic/p-type a-Si:H layer stacks, a deterioration in passivation is observed upon annealing over the whole temperature range. Comparing the lifetime values and trends for the different layer stacks to the performance of the corresponding cells, it is inferred that the intrinsic/p-layer stack is limiting device performance. Furthermore, thermal annealing of p-type layers should be avoided entirely. We therefore propose an adapted processing sequence, leading to a substantial improvement in efficiency to 16.7%, well above the efficiency of 15.8% obtained with the ‘standard’ processing sequence.     

Crystallinity of the mixed phase silicon thin films by Raman spectroscopy

Raman spectra of the mixed phase silicon films were studied for a sample with transition from amorphous to fully microcrystalline structure using four excitation wavelengths (325, 514.5, 632.8 and 785 nm). Factor analysis showed the presence of two and only two spectrally independent components in the spectra within the range from 250 to 750 cm^?1 for all four excitation wavelengths. The 785 nm excitation was found optimal for crystallinity evaluation and by comparison with surface crystallinity obtained by atomic force microscopy, we have estimated the ratio of integrated Raman cross-sections of microcrystalline and amorphous silicon at this wavelength as y = 0.88 ± 0.05.     

Amorphous and nanocrystalline silicon made by varying deposition pressure in PECVD process

Silicon thin films are deposited using plasma enhanced chemical vapor deposition (PECVD) of silane, argon, hydrogen mixture at various pressures in the range of 2–8 Torr. Raman scattering shows these to be amorphous in the pressure range 6–8 Torr, and nanocrystalline in the range 2–4 Torr. The volume fraction of nanocrystals is estimated by fitting the Raman data to three peaks and is found to be ～75% for the films deposited at low pressure, density of states of these films was measured. It is observed that the electrical conduction in these films depends on the crystalline volume fraction (ρ), estimated from the laser Raman Spectroscopy. Temperature dependence electrical conductivity shows that at lower temperatures thermionic emission dominates for the films with lower ρ, whereas, hopping is the main conduction mechanism for the films having high ρ. The density of states is estimated from the space charge limited currents (SCLC) observed at high fields. Photoconductivity at room temperature is also measured. The amorphous films are found to be more photosensitive than the nanocrystalline one. In the context of these findings, changes in the properties of silicon from amorphous to nanocrystalline are described.     

Argon-plasma-induced growth of crystalline grains in microcrystalline silicon: Formation mechanism of grains

A thick (∼300 nm) microcrystalline silicon (μc-Si:H) film with a low crystalline volume fraction (∼24%) and a columnar grain size of about 100 nm was exposed to an argon plasma at a substrate temperature of 220 °C after deposition. It is shown that argon plasma treatment significantly enhances film-crystallinity throughout the μc-Si:H layer: over a factor of 2 in crystalline fraction and by a factor of 3 in columnar grain size after a 90-min argon treatment. Based on these experimental results, it is proposed that crystallization of μc-Si:H is likely mediated by the energy transferred from energetic argon atoms.     

Peculiarity of constant photocurrent method for silicon films with mixed amorphous–nanocrystalline structure

The results of conductivity, photoconductivity and constant photocurrent method absorption measurements by DC and AC methods in hydrogenated silicon films with mixed amorphous–nanocrystalline structure are presented. A series of diphasic silicon films was deposited by very high frequency plasma enhanced chemical vapor deposition technique, using different hydrogen dilution ratios of silane. The increase of hydrogen dilution ratio results in five orders of magnitude increase of conductivity and a sharp increase of grain volume fraction. The comparison of the absorption spectra obtained by DC and AC methods showed that they are similar for silicon films with the predominantly amorphous structure and films with high grain volume fraction. However we found a dramatic discrepancy between the absorption spectra obtained by DC and AC constant photocurrent methods in silicon films deposited in the regime of the structure transition from amorphous to nanocrystalline state. AC constant photocurrent method gives higher absorption coefficient than DC constant photocurrent method in the photon energy range of 1.2–1.7 eV. This result indicates the possibility of crystalline grains contribution to absorption spectra measured by AC constant photocurrent method in silicon films with intermediate crystalline grain volume fraction.     

Influence of oxygen on defect densities in nanocrystalline Si

A differential capacitance vs. frequency technique for determining trap densities as a function of energy in amorphous and nanocrystalline Si devices is presented. Through differential capacitance measurements, trap states can be accurately measured and profiled within the bandgap as a function of energy. Defects for amorphous silicon were shown to be Gaussian approximately 0.7 eV below the conduction band, on the order of 10¹⁵–10¹⁶ cm^? 3 depending on deposition. This agrees with both external a-Si measurements and C–V defect measurements. Defects in nano-crystalline silicon were studied as a function of oxygen present in the material. Five different depositions were carried out with varying amounts of oxygen. The defect densities of each device were then measured. A large increase in defect densities corresponding to an increase in oxygen content is observed.     

Self-aggregated Si quantum dots in amorphous Si-rich SiC

Amorphous silicon quantum dots (Si-QDs) self-aggregated in silicon-rich silicon carbide are synthesized by growing with plasma-enhanced chemical vapor deposition on (100)-oriented Si substrate. Under the environment of Argon (Ar)-diluted Silane (SiH₄) and pure methane (CH₄), the substrate temperature and RF power are set as 350 °C and 120 W, respectively, to provide the Si-rich SiC with changing fluence ratio (R = [CH₄ ]/[SiH₄] + [CH₄]). By tuning the fluence ratio from 50% to 70%, the composition ratio x of Si-rich Si_1 ? xC_x film is varied from 0.27 to 0.34 as characterized by X-ray photoelectron spectroscopy (XPS), which reveals the component of Si_2p decreasing from 66.3 to 59.5%, and the component of C_1s increasing from 23.9% to 31% to confirm the formation of Si-rich SiC matrix. Annealing of the SiC sample from 650 °C to 1050 °C at 200 °C increment for 30 min induces the very tiny shift on the wavenumber of the crystalline Si (c-Si) related peak due to the precipitation of Si-QDs within the SiC matrix, and the Raman scattering spectra indicate a broadened Raman peak ranging from 410 to 520 cm^? 1 related to the amorphous Si accompanied with the significant enhancement for SiC bond related peak at 980 cm^? 1. From the high resolution transmission electron microscopy images, the critical temperature for Si-QD precipitation is found to be 850 °C. The self-assembly of the crystallized Si-QDs with the size of 3 ± 0.5 nm and the volume density of (3 ± 1) × 10¹⁸ (#/cm³) in Si-rich SiC film with R = 70% are observed after annealing at higher temperature.     

Features of Er3+ luminescence in fluorine-doped amorphous silicon dioxide fabricated by low-temperature plasma CVD

Spectra and photoluminescence kinetics of Er³⁺ ions incorporated in an amorphous host of fluorine-doped silicon dioxide synthesized by surface plasma chemical vapor deposition (SPCVD) are investigated at temperatures of 27–300 K. Luminescence is excited with an Ar⁺ laser at a wavelength of 514.5 nm and with a diode laser at a wavelength of 975 nm. Narrow and well-defined components of Stark manifolds with a small contribution from inhomogeneous broadening intrinsic to Er³⁺ ions in crystalline, but not amorphous, hosts are revealed and identified in photoluminescence spectra. The structure of the Stark manifolds is well-resolved at low temperatures. The presence of the well-resolved Stark structure in the spectra is indicative of stable anion complexes formating the Er³⁺ local neighborhood presumably associated with fluorine incorporation. This neighborhood is formed during the low temperature plasma chemical synthesis and is destroyed upon glass fusion.