Correlation between the method of preparation and the properties of the sol–gel HfO2 thin films

This work describes the preparation of HfO₂ thin films by the sol–gel method, starting with different precursors such as hafnium ethoxide, hafnium 2,4-pentadionate and hafnium chloride. From the solution prepared as mentioned above, thin films on silicon wafer substrates have been realized by ‘dip-coating’ with a pulling out speed of 5 cm min^?1. The films densification was achieved by thermal treatment for 10 min at 100 °C and 30 min at 450 °C or 600 °C, with a heating rate of 1 °C min^?1. The structural and optical properties of the films are determined employing spectroellipsometric (SE) measurements in the visible range (0.4–0.7 μm), transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM). The main objective of this paper was to establish a correlation between the method of preparation (precursor, annealing temperature) and the properties of the obtained films. The samples prepared from pentadionate and ethoxide precursors are homogenous and uniform in thickness. The samples prepared starting from chloride precursor are thicker and proved to be less uniform in thickness. Higher non-uniformity develops in multi-deposition films or in crystallized films. A nano-porosity is present in the quasi-amorphous films as well in the crystallized one. For the samples deposited on silicon wafer, the thermal treatment induced the formation of a SiO₂ layer at the coating–substrate interface.     

Preparation and characterization of SrTiO3/BaTiO3 thin multilayer films deposited on Pt/Ti/SiO2/Si substrate by radio frequency magnetron sputtering

SrTiO₃/BaTiO₃ thin films with multilayer structure were deposited on Pt/Ti/SiO₂/Si substrates by a double target radio frequency (RF) magnetron sputtering at 500 °C. The structure and properties of the SrTiO₃/BaTiO₃ thin multilayers have been evaluated by X-ray diffraction (XRD), Auger electron spectrometry (AES), scanning electron microscopy (SEM), scanning transmission electron microscopy (STEM), electron diffraction (ED) and polarization-electric field hysteresis loop. The XRD result reveals that the SrTiO₃/BaTiO₃ thin multilayers with the designed modulation have been accomplished. The lattice strain increases with layer number. According to AES analysis and morphology observation, a discrete interlayer exists at a position between the interface of Pt electrode and SrTiO₃. The remanent polarization (P_r) and coercive field (E_c) of SrTiO₃/BaTiO₃ thin multilayer are 3.0 μC/cm² and 20.0 kV/cm, respectively. In comparison with BaTiO₃, the device containing dual layers of SrTiO₃/BaTiO₃ possesses higher E_c but lower P_r.     

Selection of post-growth treatment parameters for atomic layer deposition of structurally disordered TiO2 thin films

Routes to atomic layer-deposited TiO₂ films with decreased leakage have been studied by using electrical characterization techniques. The combination of post-deposition annealing parameters, time and temperature, which provides measurable aluminum–titanium oxide–silicon structures – i.e., having capacitance–voltage curves which show accumulation behavior – are 625 °C, 10 min for p-type substrates, and 550 °C, 10 min for n-type substrates. The best annealing conditions for p-type substrates are 625 °C with the length extended to 30 min, which produces an interfacial state density of about 5–6 × 10¹¹ cm^?2 eV^?1, and disordered-induced gap state density below our experimental limits. We have also proved that a post-deposition annealing must be applied to TiO₂/HfO₂ and HfO₂/TiO₂/HfO₂ stacked structures to obtain adequate measurability conditions.     

Room temperature PbS nanoparticle growth,incubation in porous TiO2 electrode for photosensitization application

We have reported the synthesis of PbS nanoparticles using a layer-by-layer ionic adsorption and reaction method at room temperature. The structural, morphological, optical, electrical and wettability properties were characterized. PbS nanoparticles were found to be oriented along the (2 0 0) plane. These PbS nanoparticles were incubated in porous spin coated TiO₂ films of ∼1 μm thickness using the SILAR method. A change in surface wettability in terms of surface water contact angle measurement was not observed. This confirms the insertion of PbS nanopartcles into porous TiO₂. Finally, photosensitization of the PbS incubated in porous TiO₂ electrode in sodium sulfide electrolyte (80 mW/cm² light intensity) was studied.     

Surface enhanced Raman scattering in an amorphous matrix for Raman amplification

In order to improve the efficiency of Raman Amplifiers, the Surface Enhanced Raman Scattering (SERS) effect of an amorphous matrix of TiO₂ was studied. First, optimisation of the amorphous layer quality was performed by depositing thin films on glass substrates at different temperatures. Then, thin films of amorphous TiO₂ were deposited on silicon commercial gold SERS substrates (Klarite®) by a dip-coating process. The SERS effect was demonstrated by the great difference of Raman intensities of the amorphous TiO₂ matrix dip-coated on active and inactive parts of Klarite® substrate under 633 nm and 780 nm laser excitations in the tail of the Surface Plasmon Resonance band of gold nanoparticles.     

Crystallization of bismuth titanate and bismuth silicate grown as thin films by atomic layer deposition

Bismuth silicate and bismuth titanate thin films were deposited by atomic layer deposition (ALD). A novel approach with pulsing of two Bi-precursors was studied to control the Si/Bi atomic ratio in bismuth silicate thin films. The crystallization of compounds formed in the Bi₂O₃–SiO₂ and Bi₂O₃–TiO₂ systems was investigated. Control of the stoichiometry of Bi–Si–O thin films was studied when deposited on Si(1 0 0) and crystallization was studied for films on sapphire and MgO-, ZrO₂- and YSZ-buffered Si(1 0 0). The Bi–Ti–O thin films were deposited on Si(1 0 0) substrate. Both Bi–Si–O and Bi–Ti–O thin films were amorphous after deposition. Highly a-axis oriented Bi₂SiO₅ thin films were obtained when the Bi–Si–O thin films deposited on MgO-buffered Si(1 0 0) were annealed at 800 °C in nitrogen. The full-width half-maximum values for 200 peak were also studied. An excess of bismuth was found to improve the crystallization of Bi–Ti–O thin films and the best crystallinity was observed with Ti/Bi atomic ratio of 0.28 for films annealed at nitrogen at 1000 °C. Roughness of the thin films as well as the concentration depth distribution were also examined.     

ZnO growth on Si with low-temperature ZnO buffer layers by ECR-assisted MBE

High-quality ZnO films were grown on Si(1 0 0) substrates with low-temperature (LT) ZnO buffer layers by an electron cyclotron resonance (ECR)-assisted molecular-beam epitaxy (MBE). In order to investigate the optimized buffer layer temperature, ZnO buffer layers of about 1.1 μm were grown at different growth temperatures of 350, 450 and 550 °C, followed by identical high-temperature (HT) ZnO films with the thickness of 0.7 μm at 550 °C. A ZnO buffer layer with a growth temperature of 450 °C (450 °C-buffer sample) was found to greatly enhance the crystalline quality of the top ZnO film compared to others. The root mean square (RMS) roughness (3.3 nm) of its surface is the smallest, compared to the 350 °C-buffer sample (6.7 nm), the 550 °C-buffer sample (7.4 nm), and the sample without a buffer layer (6.8 nm). X-ray diffraction (XRD), photoluminescence (PL) and Raman scattering measurements were carried out on these samples at room temperature (RT) in order to characterize the crystalline quality of ZnO films. The preferential c-axis orientations of (0 0 2) ZnO were observed in the XRD spectra. The full-width at half-maximum (FWHM) value of the 450 °C-buffer sample was the narrowest as 0.209°, which indicated that the ZnO film with a buffer layer grown at this temperature was better for the subsequent ZnO growth at elevated temperature of 550 °C. Consistent with these results, the 450 °C-buffer sample exhibits the highest intensity and the smallest FWHM (130 meV) of the ultraviolet (UV) emission at 375 nm in the PL spectrum. The ZnO characteristic peak at 438.6 cm⁻¹ was found in Raman scattering spectra for all films with buffers, which is corresponding to the E₂ mode.     

Electrodeposited and selenized CIGS thin films for solar cells

Cu(In,Ga)Se₂ polycrystalline thin films were deposited adopting the potentiostatic electrochemical method on Mo/soda lime glass substrate. All the as-deposited Cu(In,Ga)Se₂ thin films were annealed in a selenium atmosphere at 550 °C for 1 h to improve the film crystalline properties. The selenized CIGS thin films were characterized by energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and scanning electron microscopy (SEM).The results indicate Cu(In,Ga)Se₂ thin films have single chalcopyrite structure and the grain size varies from 0.8 to 2.5 μm.     

Fabrication and characterization of transparent conductive ZnO:Al thin films prepared by direct current magnetron sputtering with highly conductive ZnO(ZnAl2O4) ceramic target

Using a highly conductive ZnO(ZnAl₂O₄) ceramic target, c-axis-oriented transparent conductive ZnO:Al₂O₃ (ZAO) thin films were prepared on glass sheet substrates by direct current planar magnetron sputtering. The structural, electrical and optical properties of the films (deposited at different temperatures and annealed at 400°C in vacuum) were characterized with several techniques. The experimental results show that the electrical resistivity of films deposited at 320°C is 2.67×10⁻⁴ Ω cm and can be further reduced to as low as 1.5×10⁻⁴ Ω cm by annealing at 400°C for 2 h in a vacuum pressure of 10⁻⁵ Torr. ZAO thin films deposited at room temperature have flaky crystallites with an average grain size of ∼100 nm; however those deposited at 320°C have tetrahedron grains with an average grain size of ∼150 nm. By increasing the deposition temperature or the post-deposition vacuum annealing, the carrier concentration of ZAO thin films increases, and the absorption edge in the transmission spectra shifts toward the shorter wavelength side (blue shift).     

Infrared spectroscopy of Li-diborate glassy thin films

This work presents a structural investigation of Li-borate thin film electrolytes prepared by rf-sputtering from targets having the nominal Li₂O–2B₂O₃ composition. Thin films of ca. 1 μm were deposited on Si wafers and gold-covered Si substrates under argon, and their infrared spectra were measured in the 30–5000 cm⁻¹ range. The measured spectra of thin films were compared with those calculated on the basis of the infrared properties of the bulk Li-diborate glass and by considering all optical effects in the film/substrate system. The results showed that the thin films have the key structural features of the bulk glass, but exhibit also differences in the short-range order structure and in the Li ion-site interactions. These findings were discussed in terms of cooling rate differences between melt-quenching for bulk glass and sputtering for thin films.     

Growth and characterization of zirconium oxide thin films on silicon substrate

The growth and characterization of zirconium oxide (ZrO₂) thin films prepared by thermal oxidation of a deposited Zr metal layer on SiO₂/Si were investigated. Uniform ZrO₂ thin film with smooth surface morphology was obtained. The thermal ZrO₂ films showed a polycrystalline structure. The dielectric constant of the ZrO₂ film has been shown to be 23, and the equivalent oxide thickness (EOT) of the ZrO₂ stacked oxide is in the range of 3.38–5.43 nm. MOS capacitors with ZrO₂ dielectric stack show extremely low leakage current density, less than 10^?6 A/cm² at ?4 V. Consequently, using this method, high-quality ZrO₂ films could be fabricated at oxidation temperature as low as 600 °C.     

Fabrication and ionic conductivity of amorphous Li–Al–Ti–P–O thin film

Li⁺ ion conducting Li–Al–Ti–P–O thin films were fabricated on ITO-glass substrates at various temperatures from 25 to 400 °C by RF magnetron sputtering method. When the substrate temperature is higher than 300 °C, severe destruction of ITO films were confirmed by XRD (X-ray diffraction) and the abrupt transformation of one semi-circle into two semi-circles on the impedance spectra. These as-deposited Li–Al–Ti–P–O solid state electrolyte thin films have an amorphous structure confirmed by XRD and a single semicircle on the impedance spectra. Good transmission higher than 80% in the visible light range of these electrolyte thin films can fulfill the demand of electro-chromic devices. Field emission scanning electron microscopy and atomic force microscopy showed the denser, smoother and more uniform film structure with the enhanced substrate temperature. Measurements of impedance spectra indicate that the gradual increased conductivity of these Li–Al–Ti–P–O thin films with the elevation of substrate temperature from room temperature to 300 °C is originated from the increase of the pre-exponential factor (σ₀). The largest Li-ion conductivity can come to 2.46 × 10^? 5 S cm^? 1. This inorganic solid lithium ion conductor film will have a potential application as an electrolyte layer in the field such as lithium batteries or all-solid-state EC devices.     

Fine embossing of chalcogenide glasses – a new fabrication route for photonic integrated circuits

For the first time embossing of ribs, from 1 to 10 μm wide and ∼10 mm long, has been carried out in chalcogenide glass layers sputtered onto semiconductor wafer substrates, with potential to act as monomode waveguides; these features have been similarly embossed in the surface of bulk chalcogenide glasses. The embossing shows very good replication of the GaAs mould patterning to 1 μm definition, with evidence also for sub-micron replication. For the embossing, thin coatings of the chalcogenide glasses were sputtered onto wafer substrates as follows: (i) a 6 μm layer of Ge₁₇As₁₈Se₆₅ (at.%) onto porous Si-on-Si wafer substrates and (ii) a 4 μm layer of Ge₁₅As₁₅Se₁₇Te₅₃ onto uncoated GaAs substrates. The Ge₁₇As₁₈Se₆₅ sputtered glass layer on porous Si-on-Si was demonstrated to slab waveguide at 1.55 μm wavelength; it was designed to achieve monomode waveguiding at 1.55 μm after embossing, for the 5 μm wide rib. The series of ribs, 1–10 μm wide, were successfully embossed in the Ge₁₇As₁₈Se₆₅ glass sputtered layer on porous Si-on-Si, but cracking of the glass layer occurred during the embossing process. Successful embossing of ribs without the glass layer cracking was achieved for the Ge₁₅As₁₅Se₁₇Te₅₃ sputtered glass layer on uncoated GaAs. Due to its relative simplicity, it is likely that hot embossing of this type of glass-based matrix offers an extremely promising route for producing high-resolution, guided-wave optical components and circuitry at low-cost, high-volume, and for a wide wavelength range.     

Low-K factor of SiO2 layer on Si irradiated by YAG:Nd laser

The change of optical and electrical properties of SiO₂ layer on Si single crystal exposed to YAG:Nd laser radiation has been found experimentally. The second harmonic of YAG:Nd laser was used as a source of light. Before irradiation the SiO₂ layer with thickness 0.75 μm had red color in reflecting light due to the interference. After irradiation with the laser with intensity of more than 3.5 MW/cm² red color changed to yellow. However, samples with thickness 0.21 μm did not change color after irradiation. We explain such peculiarities of optical properties by change of optical path. Capacity (C) measurements of SiO₂ layer with thickness 0.21 μm by the method of capacity–voltage characteristics have shown a decrease of C to more than 40%. It is possible if real part of dielectric permittivity (K) decreases or thickness of the SiO₂ layer increases. Atomic force microscope and profilemeter measurements did not show any change of surface roughness for the SiO₂ layer with thickness 0.21 μm. We suppose that after irradiation of the SiO₂ layer decrease of K takes place due to the formation of nanopores in SiO₂ or/and generation of the charged point defect at the interface of Si–SiO₂. Particularly the first is in agreement with measurements of micro hardness and capillary effect.     

Studies on a possible growth mechanism of silver nanoparticles loaded on TiO2 thin films by photoinduced deposition method

The TiO₂ thin films loaded with silver nanoparticles were prepared on soda-lime glass substrates by a photoinduced deposition method. The TiO₂ films immersed in AgNO₃ solution were vertically irradiated by UV light with center wavelength of 365 nm for 60 h. The as-produced films were characterized by X-ray diffraction (XRD), UV–Vis spectroscopy, X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The studies show that the film after UV excitation is composed of anatase phase TiO₂ and metallic silver with face centered cubic structure. A possible growth mechanism of silver nanoparticles on TiO₂ thin films under UV irradiation was proposed. The charge carriers of TiO₂ semiconductor are generated by photoexcitation. Owing to the conduction band position of TiO₂ which is above the standard potential of Ag⁺/Ag, the generated electrons could transfer from the conduction band to Ag⁺ adsorbed on the surface of the TiO₂ films. Therefore, the Ag⁺ was finally reduced into a Ag atom, which could preferentially localize in the grain boundaries of TiO₂ particles due to high surface free energy there. With the irradiation time extended, silver nanoparticles were shaped into certain morphologies on the surface of the TiO₂ films.     

Rare-earth-doped silica-based glasses for photonic applications

Two different silica-based glass systems with valuable optical and spectroscopic properties in the 1.5 μm band, exploited in optical microcavities, are presented. First, we report on Er³⁺-activated core–shell silica spheres prepared by sol–gel process. The core consists of a silica sphere of 270 nm in diameter, while the shell is an Er₂O₃–SiO₂ film. The second system is an Er³⁺-activated microcavity fabricated by rf-sputtering technique. The cavity is constituted of an Er³⁺-doped SiO₂ layer inserted between two Bragg mirrors, fabricated by alternately stacking five TiO₂ and five SiO₂ thin films. Optical and spectroscopic properties were assessed, and the two systems were characterized from morphological and structural point of view.     

Enhancement of ferroelectricity in the compositionally graded (Pb,Sr)TiO3 thin films derived by a sol–gel process

The compositionally graded Pb_1−xSr_xTiO₃ (PST) films with a fine compositional gradient from Pb_0.6Sr_0.4TiO₃ to Pb_0.3Sr_0.7TiO₃ were fabricated on LNO-buffered Pt/Ti/SiO₂/Si substrates by a sol–gel deposition method. The graded films crystallized into a pure perovskite structure and exhibited highly (1 0 0) preferred orientation after post-deposition annealing. Dielectric and ferroelectric properties were investigated as a function of temperature, frequency and direct current bias field. Dielectric constant peaks, common to a ferroelectric transition, were not observed in the temperature range of 25–250 °C within which the dielectric constant showed weak temperature dependence. This compositionally graded thin film can result in a dielectric constant more than double and a remanent polarization at least two and a half times larger than conventional PST thin films.     

Sol–gel derived highly transparent and conducting yttrium doped ZnO films

This paper reports the structural, electrical and optical properties of Yttrium doped zinc oxide (YZO) thin films deposited on Corning (7059) glass substrates by spin coating technique. A precursor solution of ZnO, 0.2 M in concentration was prepared from zinc acetate dissolved in anhydrous ethanol with diethanolamine as a sol gel stabilizer. Yttrium nitrate hexahydrate (Y₂NO₃ · 6H₂O) was used as the dopant (3 wt%) in the present study. The films of different thickness in the range (200–500 nm) were prepared. The films were annealed in air at 450 °C for 1 h. It was observed that the c-axis orientation improves and the grain size increases as is indicated by an increase in intensity of the (0 0 2) peak and the decrease in the FWHM with the increase of film thickness. The resistivity decreased sharply from 2.8 × 10⁻² to 5.8 × 10⁻³ Ω-cm as the thickness increased from 200 to 500 nm. However, the average transmittance decreased from 87% to 82.6% as the film thickness increased to 500 nm. The lowest sheet resistance of ∼120 Ω/□ was obtained for the 500 nm thick film.     

The effect of Tb doped PbTiO3 inducing layer on texture and tunable property of sol–gel derived Pb0.4Sr0.6TiO3 thin films grown on ITO/glass substrate

Highly (1 0 0)-oriented Pb_0.4Sr_0.6TiO₃ (PST40) thin films have been prepared on the Tb doped PbTiO₃ (PTT) thin film coated ITO/glass substrate by sol–gel technique. The PTT inducing layers are (1 0 0)-oriented and can help to control the orientation of PST40 thin films. Crystallization of the PST40 thin film with the PTT inducing layer is more perfect than that without PTT layer due to less distortion in the thin film. The dielectric tunability of the PST40 thin film with PTT layer therefore reaches 65%, which is 85% higher than that without PTT layer. The dielectric loss of the PST thin film is only 0.05. These results indicate that (1 0 0)-oriented Tb doped PbTiO₃ can be used as an inducing layer for highly (1 0 0)-oriented tunable materials on ITO/glass substrate.     

Preparation and properties of titanium silicide coating glass by CVD

Titanium silicide thin films were prepared on glass substrates by chemical vapor deposition using SiH₄ and TiCl₄ as the precursors. The phase structure of the thin films was identified by XRD. The surface morphology of the thin films was observed by FESEM. The sheet resistance and optical behaviors of the thin films were measured by the four point resistivity test system and FTIR spectrometer, respectively. Titanium disilicide (TiSi₂) thin films with the face-centered orthorhombic structure are formed. The suitable formation temperature of the TiSi₂ crystalline phase is about 710 °C. The formation of TiSi₂ crystalline phase is dependent on the thickness of thin films and a quantity of the crystalline phase of TiSi₂ in the thin film is directly related to mole ratio of SiH₄/TiCl₄. The sheet resistance of the TiSi₂ thin films is dependent on the formation of the TiSi₂ crystalline phase. With the mole ratio of SiH₄/TiCl₄ of 3, the lowest sheet resistance (0.7 Ω/□) of titanium silicide thin film is formed at 710 °C. The maximum reflectance of the TiSi₂ thin films is about 0.95 on the broad IR heat radiation. A related reaction mechanism was proposed.