Substrate temperature dependence of microcrystalline silicon growth by PECVD technique

Undoped hydrogenated silicon films have been prepared from a gas mixture of silane and hydrogen, varying substrate temperature from 180–380 °C in an ultrahigh vacuum system using RFPECVD technique. XRD and Raman measurements enable us to know that the films are microcrystalline throughout the substrate temperature range. Bond formation of the SiH films at different substrate temperature is studied through different characterisation techniques like Fourier transform infrared spectroscopy and hydrogen evolution study. The infrared absorption spectroscopy and hydrogen evolution study reveal two types of growth: the formation of a void rich material at low T_s (∼180 °C) and a compact material at comparatively higher T_s.     

Influence of substrate temperature on microcrystalline structure and optical properties of ZnTe thin films

ZnTe thin films were deposited onto well‐cleaned glass substrates kept at different temperatures (Ts = 303, 373 and 423 K), by vacuum evaporation method under the pressure of 10^–5 Torr. The thickness of the film was measured by quartz crystal monitor and verified by the multiple beam interferometer method. The structural characterization was made using X‐ray diffractometer with filtered CuKα radiation. The grain sizes of the microcrystallines in films increases with increase in substrate temperature. The strain (ε), grain size (D) and dislocation density (δ) was calculated and results are discussed based on substrate temperature. Optical behaviour of the film was analyzed from transmittance spectra in the visible region (400–800 nm). The optical transition in ZnTe films is direct and allowed type. The optical band gap energy shows an inverse dependence on substrate temperature and thickness. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Hydrogenated microcrystalline silicon thin films deposited by RF-PECVD under low ion bombardment energy using voltage waveform tailoring

We present experimental results for hydrogenated amorphous and microcrystalline silicon (a-Si:H and μc-Si:H) thin films deposited by PECVD while using a voltage waveform tailoring (VWT) technique to create an electrical asymmetry in the reactor. VWT dramatically modifies the mean ion bombardment energy (IBE) during growth, and we show that for a constant peak-to-peak excitation voltage (V_PP), waveforms resembling “peaks” or “valleys” result in very different material properties. Using Raman scattering spectroscopy, we show that the crystallinity of the material depends strongly on the IBE, as controlled by VWT. A detailed examination of the Raman scattering spectra reveals that the narrow peak at 520 cm^? 1 is disproportionately enhanced by lowering the IBE through the VWT technique. We examine this effect for a range of process parameters, varying the pressure, hydrogen–silane dilution ratio, and total flow of H₂. In addition, the SiH_X bonding in silicon thin films deposited using VWT is characterised for the first time, showing that the hydrogen bonding character is changed by the IBE. These results demonstrate the potential for VWT in controlling the IBE during thin film growth, thus ensuring that application-appropriate film densities and crystallinities are achieved, independent of the injected RF power.     

Relation between substrate surface morphology and microcrystalline silicon solar cell performance

In the present paper, the structural and electrical performances of microcrystalline silicon (μc-Si:H) single junction solar cells co-deposited on a series of substrates having different surface morphologies varying from V-shaped to U-shaped valleys, are analyzed. Transmission electron microscopy (TEM) is used to quantify the density of cracks within the cells deposited on the various substrates. Standard 1 sun, variable illumination measurements (VIM) and Dark J(V) measurements are performed to evaluate the electrical performances of the devices. A marked increase of the reverse saturation current density (J₀) is observed for increasing crack densities. By introducing a novel equivalent circuit taking into account such cracks as non-linear shunts, the authors are able to relate the magnitude of the decrease of V_oc and FF to the increasing density of cracks.     

Preparation of microcrystalline silicon solar cells on microcrystalline silicon carbide window layers grown with HWCVD at low temperature

N-type microcrystalline silicon carbide layers prepared by hot-wire chemical vapor deposition were used as window layers for microcrystalline silicon n–i–p solar cells. The microcrystalline silicon intrinsic and p-layers of the solar cells were prepared with plasma-enhanced chemical vapor deposition at a very high frequency. Amorphous silicon incubation layers were observed at the initial stages of the growth of the microcrystalline silicon intrinsic layer under conditions close to the transition from microcrystalline to amorphous silicon growth. ‘Seed layers’ were developed to improve the nucleation and growth of microcrystalline silicon on the microcrystalline silicon carbide layers. Raman scattering measurement demonstrates that an incorporation of a ‘seed layer’ can drastically increase the crystalline volume fraction of the total absorber layer. Accordingly, the solar cell performance is improved. The correlation between the cell performance and the structural property of the absorber layer is discussed. By optimizing the deposition process, a high short-circuit current density of 26.7 mA/cm² was achieved with an absorber layer thickness of 1 μm, which led to a cell efficiency of 9.2%.     

Structure and properties of hydrogenated amorphous silicon carbide thin films deposited by PECVD

a-Si_1?xC_x:H films are deposited by RF plasma enhanced chemical vapor deposition (PECVD) at different RF powers with hydrogen-diluted silane and methane mixture as reactive gases. The structure and properties of the thin films are measured by infrared spectroscope (IR), Raman scattering spectroscope and ultra violet–visible transmission spectroscope (UV–vis), respectively. Results show that the optical band gap of the a-Si_1?xC_x:H thin films increases with increasing Si–C bond fraction. It can be easily controlled through controlling Si–C bond formed by modulating deposition power. At low deposition power, the bond configuration of the a-Si_1?xC_x:H thin film is more disordered owing to the distinct different bond lengths and bond strengths between Si and C atoms. At a too high deposition power, it becomes still high disordered due to dangling bonds appearing in the a-Si_1?xC_x:H thin film. The low disordered bond configuration appears in the thin film deposited with moderate deposition power density of about 2.5 W/cm².     

Electron spin resonance study of hydrogenated microcrystalline silicon–germanium alloy thin films

Paramagnetic defects of undoped hydrogenated microcrystalline silicon–germanium alloys (μc-Si_1?xGe_x:H) grown by low temperature (200 °C) plasma-enhanced chemical vapor desposition (PECVD) have been measured by electron spin resonance (ESR) and compared with those of hydrogenated amorphous silicon–germanium (a-Si_1?xGe_x:H). The spin density of μc-Si_1?xGe_x:H increases with Ge content and shows a broad maximum of ～10¹⁷ cm^?3 at x ～ 0.5, which reasonably accounts for the decreased photoconductivity. While the Ge dangling bond defects prevail in a-Si_1?xGe_x:H for Ge-rich compositions, we detected no ESR signal in μc-Si_1?xGe_x:H for x > 0.75 where an electrical change occurs from weak n- to strong p-type conduction. These results indicate that dangling bonds are charged in large densities due to the presence of the acceptor-like states in undoped μc-Si_1?xGe_x:H.     

High diffusion length silicon germanium alloy thin films deposited by pulsed rf PECVD method

Hydrogenated amorphous silicon germanium (a-Si_1?xGe_x:H) alloy thin films were deposited in a rf (13.56 MHz) powered plasma CVD system from a mixture of silane, germane and hydrogen. The rf power was pulsed at a frequency of 1356 Hz with the duty cycle (Q) ranging from 50% to 100%. The Ge content in the films, found in the range 40–45%, was deduced from Raman spectra. The band gaps E_g of the films were in between 1.44 and 1.48 eV. We find a good correlation between the ambipolar diffusion length (L_d) and the microstructure factor ($R^1$) for different duty cycles. At Q = 75% the $R^1$ value is lowest (0.14) which correlates well with the maximum value of L_d (100 nm), the highest L_d value reported for a-Si_1?xGe_x:H films with E_g = 1.44 eV. It was also found to be very stable under light soaking. Powder incorporation within the films was also studied. Quality of the films is determined by two opposing effects viz. size of the powders incorporated into the films from the plasma and the bombardment of energetic ions and neutrals. Best transport properties were found at an optimum duty cycle of 75%.     

Growth and characterization of zirconium oxide thin films on silicon substrate

The growth and characterization of zirconium oxide (ZrO₂) thin films prepared by thermal oxidation of a deposited Zr metal layer on SiO₂/Si were investigated. Uniform ZrO₂ thin film with smooth surface morphology was obtained. The thermal ZrO₂ films showed a polycrystalline structure. The dielectric constant of the ZrO₂ film has been shown to be 23, and the equivalent oxide thickness (EOT) of the ZrO₂ stacked oxide is in the range of 3.38–5.43 nm. MOS capacitors with ZrO₂ dielectric stack show extremely low leakage current density, less than 10^?6 A/cm² at ?4 V. Consequently, using this method, high-quality ZrO₂ films could be fabricated at oxidation temperature as low as 600 °C.     

Photoluminescence in silicon rich oxide thin films under different thermal treatments

Photoluminescence (PL) was studied in silicon rich oxide (with the atomic percentage ranges of Si from 35% to 75%) thin film samples, fabricated by the plasma assisted CVD technique. A broad PL peak, blue-shifted from the bulk silicon band edge of ～1.1 eV, was observed. In one typical sample, the PL peak intensity shows a non-monotonic temperature dependence. This non-monotonic dependence was also observed in previous work by others and attributed to an energy splitting between the excitonic singlet and triplet levels in silicon nanocrystals, a consequence of quantum confinement effect. Finally, in more than 20 samples under different thermal treatments (with the annealing temperature range from 800 °C to 1100 °C), the wavelength of PL peak was observed to be pinned between ～900 and ～1000 nm, independent of thermal budget. This pinning effect, we believe, is probably due to the formation of oxygen-related interface states.     

On the oxidation mechanism of microcrystalline silicon thin films studied by Fourier transform infrared spectroscopy

Insight into the oxidation mechanism of microcrystalline silicon thin films has been obtained by means of Fourier transform infrared spectroscopy. The films were deposited by using the expanding thermal plasma and their oxidation upon air exposure was followed in time. Transmission spectra were recorded directly after deposition and at regular intervals up to 8 months after deposition. The interpretation of the spectra is focused on the Si-H_x stretching (2000-2100 cm⁻¹), Si-O-Si (1000-1200 cm⁻¹), and O_xSi-H_y modes (2130-2250 cm⁻¹). A short time scale (< 3 months) oxidation of the crystalline grain boundaries is observed, while at longer time scales, the oxidation of the amorphous tissue and the formation of O-H groups on the grain boundary surfaces play a role. The implications of this study on the quality of microcrystalline silicon exhibiting no post-deposition oxidation are discussed: it is not sufficient to merely passivate the surface of the crystalline grains and fill the gap between the grains with amorphous silicon. Instead, the quality of the amorphous silicon tissue should also be taken into account, since this oxidation can affect the passivating properties of the amorphous tissue on the surface of the crystalline silicon grains.     

Properties of n-type hydrogenated nanocrystalline cubic silicon carbide films deposited by VHF-PECVD at a low substrate temperature

n-Type hydrogenated nanocrystalline cubic silicon carbide (nc-3C–SiC:H) films have been deposited by very high-frequency plasma-enhanced chemical vapor deposition at a low substrate temperature of about 360 °C to apply this material to the window layer of heterojunction crystalline silicon (HJ-c-Si) solar cells. We investigated the effect of in situ doping on deposition rate, crystalline volume fraction and dark conductivity to optimize properties of the material. We also fabricated HJ-c-Si solar cells with a n-type nc-3C–SiC:H window layer. The solar cells shows high internal quantum efficiency of 0.90 at a wavelength of 400 nm, indicating that n-type nc-3C–SiC:H deposited by VHF-PECVD is a promising candidate of the window layer of HJ-c-Si solar cells.     

Influence of substrate temperature on the structure of ZnO:Al thin films

ZnO: Al films were prepared using low cost spray pyrolysis technique. The dependence of the physical properties on the substrate temperature was studied. The best films obtained at 500°C substrate temperature with preferred [002] orientation. The sheet resistance decreases with increased substrate temperature, and values as low as R_sh = 207 Ω/cm² are reached for substrate temperature of 500°C. The optical transmittance of films increased by increasing the substrate temperature and received to 75% at 500°C. (© 2007 WILEY ‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Determination factor of <110> direction growth in microcrystalline silicon thin film deposition

We have proposed the mechanism of the <110> directional growth of microcrystalline silicon (μc-Si) thin films deposited by PECVD (plasma enhanced chemical vapor deposition) from SiH₄ and H₂ gas mixture, where dimeric radicals act a key role to form bridge nuclei for the ledge formation on the (110) facet. In order to look further into details of the mechanism, we investigated other important factors that influence the growth of μc-Si in <110> direction in terms of their impact on crystallinity with varying deposition temperature. The enhancement of surface diffusion length of radicals is inferred from the enlargement of the crystalline grain size accompanied with the increase of the deposition temperature. The growth in <110> direction is also promoted as the deposition temperature increases. Therefore, it is suggested that the surface diffusion length of radicals is another key factor that governs the crystalline growth in <110> direction. The growth mechanism of μc-Si thin films in <110> direction is discussed in terms of the relation between the surface diffusion length of monomeric radicals depending on the substrate surface temperature and the average space of bridges depending on the density of dimeric radicals on the growing surface.     

Metastability effects in hydrogenated microcrystalline silicon thin films investigated by the dual beam photoconductivity method

Metastability effects in microcrystalline silicon (μc-Si:H) thin films have been investigated using dark conductivity, σ_D, photoconductivity, σ_ph, and sub-bandgap absorption methods. Nitrogen and inert gasses can cause reversible aging effect in conductivities but not in the sub-bandgap absorption. However, DI water and O₂ gas treatment result in both reversible and nonreversible effects in conductivities as well as in the sub-bandgap absorption. Only oxygen affected the dark conductivity reversibly in amorphous silicon, a-Si:H, films, other results were unaffected from the aging and annealing processes applied.     

Low temperature plasma deposition of silicon thin films: From amorphous to crystalline

We report on the epitaxial growth of crystalline silicon films on (100) oriented crystalline silicon substrates by standard plasma enhanced chemical vapor deposition at 175 °C. Such unexpected epitaxial growth is discussed in the context of deposition processes of silicon thin films, based on silicon radicals and nanocrystals. Our results are supported by previous studies on plasma synthesis of silicon nanocrystals and point toward silicon nanocrystals being the most plausible building blocks for such epitaxial growth. The results lay the basis of a new approach for the obtaining of crystalline silicon thin films and open the path for transferring those epitaxial layers from c-Si wafers to low cost foreign substrates.     

PECVD growth of crystalline silicon from its tetrafluoride

The process of plasma chemical deposition of silicon from inductively coupled plasma of the mixture of high‐purity SiF₄ and H₂ sustained by RF discharge at 13.56 MHz in amount sufficient for subsequent growth of crystal by Czochralski method was investigated. The structure and impurity content of the produced layers as well as of the grown crystal have been studied (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effect of substrate temperature on the optical constants of zincphthalocyanine thin films

The influence of the film thickness and substrate temperature on optical constants of the vacuum evaporated ZincPhthalocyanine (ZnPc) thin films have been reported in this paper. The direct and allowed optical band gap energy has been evaluated from the (αhυ)² vs. (hυ) plots. The optical constants such as extinction coefficient (k_f) and refractive index (n) have been evaluated from the transmittance values and the observed results strongly dependent on substrate temperature and film thickness. The low values of the refractive index have been observed for the films prepared at T_s=200°C. The change in crystallanity and phase transformation affect the optical constants and the lower values of the optical constants will leads to the good quality of the ZnPc thin films. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)