表面InGaN厚度对GaN基发光二极管特性的影响

通过调整GaN基发光二极管(LED)表面InGaN层的厚度，发现在20 mA电流驱动下，LED器件的正向压降有明显差距.本文考虑了极化效应的影响，通过求解InGaN/GaN三角形势阱内二维空穴气浓度以及空穴隧穿概率的变化，求得了表面InGaN层厚度不同时器件正向压降的变化趋势，发现理论结果与实验结果有很好的吻合.同时得到了获得最低正向压降的表面InGaN厚度.     

高效InGaN/AlInGaN发光二极管的结构设计及其理论研究（英文）

利用Advanced Physical Models of Semiconductor Devices(APSYS)理论对比研究了InGaN/AlInGaN和InGaN/GaN多量子阱作为有源层的InGaN基发光二极管的结构和电学特性。与InGaN/GaN基LED中GaN作为垒层材料相比,在AlInGaN材料体系中,通过调节AlInGaN中Al和In的组分可以优化器件的性能。当InGaN阱层材料中In组分为8%时,可以实现无应力的In0.08Ga0.92N/AlInGaN基LED。在这种无应力结构中可以进一步降低大功率LED的"效率下降"(Effciency droop)问题。理论模拟结果显示,四元系AlInGaN作为垒层可以进一步减少载流子泄露,增加空穴注入效率,减少极化场对器件性能的影响。在In0.08Ga0.92N/AlInGaN量子阱中的载流子浓度、有源层的辐射复合率、电流特性曲线和内量子效率等方面都优于InGaN/GaN基LED。无应变AlInGaN垒层代替传统的GaN垒层后,能够得到高效的发光二极管,并且大电流注入下的"效率滚降"问题得到改善。     

高效InGaN/AlInGaN发光二极管的结构设计及其理论研究

利用Advanced Physical Models of Semiconductor Devices (APSYS)理论对比研究了InGaN/AlInGaN 和 InGaN/GaN多量子阱作为有源层的InGaN基发光二极管的结构和电学特性。与InGaN/GaN 基LED 中GaN作为垒层材料相比,在AlInGaN材料体系中,通过调节AlInGaN中Al和In的组分可以优化器件的性能。当InGaN阱层材料中In组分为8%时,可以实现无应力的In_0.08Ga_0.92N/AlInGaN基 LED。在这种无应力结构中可以进一步降低大功率LED的"效率下降"(Effciency droop)问题。理论模拟结果显示,四元系AlInGaN作为垒层可以进一步减少载流子泄露,增加空穴注入效率,减少极化场对器件性能的影响。在In_0.08Ga_0.92N /AlInGaN量子阱中的载流子浓度、有源层的辐射复合率、电流特性曲线和内量子效率等方面都优于InGaN/GaN基LED。无应变AlInGaN垒层代替传统的GaN垒层后,能够得到高效的发光二极管,并且大电流注入下的"效率滚降"问题得到改善。     

小尺寸应变Si金属氧化物半导体场效应晶体管栅隧穿电流预测模型

小尺寸金属氧化物半导体场效应晶体管(MOSFET)器件由于具有超薄的氧化层、关态栅隧穿漏电流的存在严重地影响了器件的性能,应变硅MOSFET器件也存在同样的问题.为了说明漏电流对新型应变硅器件性能的影响,文中利用积分方法从准二维表面势分析开始,提出了小尺寸应变硅MOSFET栅隧穿电流的理论预测模型,并在此基础上使用二维器件仿真软件ISE进行了仔细的比对研究,定量分析了在不同栅压、栅氧化层厚度下MOSFET器件的性能.仿真结果很好地与理论分析相符合,为超大规模集成电路的设计提供了有价值的参考. 关键词： 应变硅 准二维表面势 栅隧穿电流 预测模型     

p型GaN/Al0.35Ga0.65N/GaN应变量子阱中二维空穴气的研究

对Ga面p型GaN/Al_0.35Ga_0.65N/GaN应变异质结构中形成的二维空穴气(2DHG)进行了研究.首先基于半导体-绝缘体-半导体异质结构模型确定了应变异质中的临界厚度，然后自洽求解薛定谔方程和泊松方程，计算了当中间势垒层AlGaN处于完全应变状态和半应变状态两种条件下，顶层GaN及中间层AlGaN厚度的变化对2DHG分布的影响.计算结果表明，势垒层AlGaN和顶层GaN的应变状态和厚度对极化引起的2DHG面密度及分布有重要影响.在此基础上制备了p型GaN/Al_0.35Ga_0.65N/GaN应变量子阱结构肖特基器件，并通过器件的C-V测试证实了异质结处2DHG的存在.器件响应光谱的测试结果表明，由于p型GaN/Al_0.35Ga_0.65N/GaN量子阱中强烈的极化作用和Stark效应使得器件零偏压和反向偏压时的响应光谱都向短波方向移动了10 nm，在零偏压下器件在280 nm处的峰值响应为0.022 A/W，在反向偏压为1 V时，峰值响应达到0.19 A/W，已经接近理论值. 关键词： AlGaN 二维空穴气 极化效应     

GaN基功率LED电应力老化早期的退化特性

对InGaN/GaN多量子阱蓝光和绿光LED进行了室温900 mA电流下的电应力老化,发现蓝光LED老化到24h隧穿电流最小,绿光LED到6h隧穿电流最小;同时,两种LED的反向漏电也最小、光通量最大,随后绿光LED的反向漏电增加较快且光通量衰减较快.把热退火效应和电应力下缺陷的产生分别看成正负加速因子,绿光LED的负...     

Ⅲ族氮化物异质结构二维电子气研究进展

本文总结了近年来Ⅲ族氮化物半导体异质结构二维电子气的研究进展。从Ⅲ族氮化物材料晶格结构和特有的极化性质出发,重点讨论了AlGaN/GaN异质结构中二维电子气的性质,总结分析了异质结构中Al组分、势垒层厚度、应变弛豫度、掺杂等对二维电子气浓度和迁移率的影响,同时还涉及AlGaN/GaN/AlGaN,AlGaN/AlN/GaN和AlGaN/InGaN/GaN等异质结构二维电子气性质。     

Ⅲ族氮化物异质结构二维电子气研究进展

本文总结了近年来Ⅲ族氮化物半导体异质结构二维电子气的研究进展。从Ⅲ族氮化物材料晶格结构和特有的极化性质出发,重点讨论了AlGaN/GaN异质结构中二维电子气的性质,总结分析了异质结构中Al组分、势垒层厚度、应变弛豫度、掺杂等对二维电子气浓度和迁移率的影响,同时还涉及AlGaN/GaN/AlGaN,AlGaN/AlN/GaN和AlGaN/InGaN/GaN等异质结构二维电子气性质。     

BCP在多层有机电致发光器件中的作用

作为空穴阻挡材料,BCP通常被用在蓝光以及白光有机电致发光器件中,其空穴阻挡能力随着其厚度的增加而增强;另一方面,在电场作用下,空穴也能隧穿厚度较薄的BCP层。为了深入了解BCP在多层有机电致发光器件中的作用,文章研究了不同电压下BCP层厚度对器件ITO/NPB/BCP/Alq₃∶DCJTB/Alq₃/Al电致发光光谱的影响。实验发现,较薄的BCP层可以部分地阻挡空穴并能调节能量在不同发光层之间的传递,从而容易获得白光器件;但该种结构器件的电致发光光谱随着电压的变化变动较大。当BCP层足够厚时,器件的电致发光光谱也变得相对较稳定; 当BCP的厚度为15 nm以上时,空穴就很难再隧穿过去。文章还讨论了不同电压下多层器件的电致发光光谱发生变化的原因。     

影响GaN基蓝光LED能带结构与光谱特性关系的仿真研究

本文采用Silvaco TCAD软件对GaN基InGaN/GaN量子阱蓝光发光二极管(LED)的光谱特性进行了仿真研究。研究结果表明:光谱会随着注入电压的增加而产生蓝移现象,并出现0.365μm处的紫外光发光峰;发光效率在正向电流较小时增长很快,随着正向电流进一步增加而逐渐趋于饱和;随着量子阱中In组分和量子阱阱层厚度的增加,发光光谱出现红移现象,并且发光效率下降。仿真结果对GaN基InGaN/GaN量子阱结构蓝光LED的设计和优化提供一定的依据。     

Recent progress in single chip white light-emitting diodes with the InGaN underlying layer

Tremendous progress has been achieved in white light-emitting diodes (LEDs). To further improve the quality of white light and simplify the fabrication process, a single chip white-light LED with the InGaN underlying layer (UL) was studied and fabricated. The turn-on voltage of this type of LED was 2.7 V, and the spectrum at a forward bias current of 20 mA was comprised of blue (443 nm) and yellow (563 nm) lights. The intensity ratio of blue to yellow light was almost constant with the in- creasing injectio...     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

InGaN/GaN MQD p–n junction photodiodes

The p–n junction photodiodes with InGaN/GaN MQD have been prepared by metal-organic chemical vapor deposition (MOCVD) growth; we achieved nanoscale InGaN self-assembled QDs in the well layers of the active region. The RT PL spectrum peak position for the fabricated InGaN/GaN MQD p–n Junction PDs is located at 464.6 nm and FWHM is 24.2 nm. After finishing device process, it was fond that the turn on voltage in forward bias and the break down voltage in reverse bias are about 3 and −13.5 V, respectively. Furthermore, with 1, 2, and 3 V applied bias, the maximum responsivity of the fabricated MQD p–n junction PD was observed at 350 nm, and the minimum of spectral response was measured at 465 nm. It was also found that the responsivity was nearly a constant from 390 to 440 nm. It seems to suggest that the spectral response in the range of 390–440 nm is due to the effect of the InGaN dots-in a-well active layers.     

Enhanced performance of InGaN light-emitting diodes with InGaN and composition-graded InGaN interlayers

The effects of InGaN light-emitting diodes (LEDs) with InGaN and composition-graded InGaN interlayers in the space of multiple quantum wells and electron blocking layer are studied numerically. The electrostatic field, energy band diagrams, carrier concentrations, light–current–voltage performances, and internal quantum efficiency (IQE) are investigated. Simulation results show that the light output power and IQE are both largely improved over the conventional LED structure due to the improvement in hole injection efficiency and electron blocking capability, especially for the LED with composition-graded InGaN interlayer.     

Enhancement of light-emission efficiency of ultraviolet InGaN/GaN multiple quantum well light emitting diode with InGaN underlying layer

Two ultraviolet InGaN/GaN light emitting diodes (LEDs) with and without InGaN underlying layer beneath the multiple quantum wells (MQWs) were grown by metal-organic vapor phase epitaxy. Based on the photoluminescence excitation measurements, it was found that the Stokes shift of the sample with a 10-nm-thick In_0.1Ga_0.9N underlying layer was about 64 meV, which was smaller than that of the reference sample without InGaN underlying layer, indicating a reduced quantum-confined Stark effect (QCSE) due to the decrease of the piezoelectric polarization field in the MQWs. In addition, by fitting the photon energy dependence of carrier lifetime values, the radiative recombination lifetime of the sample with and without InGaN underlying layer were obtained about 1.22 and 1.58 ns at 10?K, respectively. The shorter carrier lifetime also confirmed that the QCSE in the MQWs was weakened after inserting the InGaN underlying layer. In addition, although the depth of carrier localization in the sample with InGaN underlying layer became smaller, the nonradiative recombination centers (NRCs) inside it decreased, and thus suppressed the nonradiative recombination process significantly according to the electroluminescence measurement results. Compared to the reference sample, the efficiency droop behavior was delayed in the sample with InGaN underlying layer and the droop effect was also effectively alleviated. Therefore, the enhanced light-emission efficiency of ultraviolet InGaN/GaN MQW LEDs could be attributed to the decrease of QCSE and NRCs.     

引入n型InGaN/GaN超晶格层提高量子阱特性研究

利用金属有机物化学气相淀积技术在蓝宝石衬底上生长了InGaN/GaN量子阱结构. 研究了引入n型InGaN薄层或InGaN/GaN超晶格层的量子阱特性,结果表明通过引入n型InGaN薄层或InGaN/GaN超晶格层缓解了量子阱有源区中的应力,改善了多量子阱表面形貌,减少了V型缺陷密度,而且提高了多量子阱的光致发光强度,从而也改进了LED的发光效率. 关键词： InGaN/GaN多量子阱 原子力显微镜 X射线双晶衍射 光致发光     

Two dimensional electron gas in a hybrid GaN/InGaN/ZnO heterostructure with ultrathin InGaN channel layer

We investigated the influence of an ultrathin InGaN channel layer on two-dimensional electron gas (2DEG) properties in a newly proposed hybrid GaN/In_xGa_1−xN/ZnO heterostructure using numerical methods. We found that 2DEG carriers were confined at InGaN/ZnO and GaN/InGaN interfaces. Our calculations show that the probability densities of 2DEG carriers at these interfaces are highly influenced by the In mole fraction of the InGaN channel layer. Therefore, 2DEG carrier confinement can be adjustable by using the In mole fraction of the InGaN channel layer. The influence of an ultrathin InGaN channel layer on 2DEG carrier mobility is also discussed. Usage of an ultrathin InGaN channel layer with a low indium mole fraction in these heterostructures can help to reduce the short-channel effects by improvements such as providing 2DEG with higher sheet carrier density which is close to the surface and has better carrier confinement.     

MOVPE生长的InGaN/GaN单量子阱的光致发光和光吸收特性

研究了用金属有机物气相外延(MOVPE)法在蓝宝石衬底上生长的In组分浓度保持不变的InGaN/GaN单量子阱结构在室温下的发光特性和光吸收特性.实验结果表明,在InGaN厚度<3nm时,随着样品InGaN势阱层宽度的增加(1nm),光致发光(PL)谱的发光峰值波长出现明显的红移33nm现象,而且发光强度下降8%,谱线半峰全宽(FWHM)展宽,通过对样品的透射、反射光谱研究发现,量子阱层窄(1.5nm)的样品在波长接近红外区时出现无吸收的现象,即R+T达到了100%,而在阱层较宽的样品中没有发现这一现象,对引起这些现象的原因进行了讨论.这些结果有助于开发和优化三族氮化物半导体光电器件的进一步研究工作.